Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/14/2011CN102280397A 一种晶圆输送分配装置及其方法 One kind of wafer handling apparatus and method for distribution
12/14/2011CN102280396A 一种石墨舟饱和处理工艺 Graphite boat saturated Process
12/14/2011CN102280395A 发光二极管的光电参数分组测试方法 Light-emitting diode optical parameters grouping test method
12/14/2011CN102280394A Led及晶圆检查装置、以及利用上述装置的检查方法 Led and wafer inspection apparatus, and inspection method using the above apparatus
12/14/2011CN102280393A 一种芯片的焊接方法 A chip welding method
12/14/2011CN102280392A 具有敷镀通孔的结构元件 Having a through-hole plating structural element
12/14/2011CN102280391A 晶圆级封装结构及其形成方法 Wafer-level packaging structure and method of forming
12/14/2011CN102280390A 组装具有散热器的半导体器件的方法 Method of assembling a semiconductor device having the radiator
12/14/2011CN102280389A 一种提高单晶铜键合丝封装性能的制备工艺 An increase preparation of single crystal copper bonding wire package performance
12/14/2011CN102280388A 基于单晶铜键合丝的制备方法 Based on the preparation method of single crystal copper bonding wire
12/14/2011CN102280387A Sonos结构和sonos存储器的形成方法 Sonos structure and method for forming a memory sonos
12/14/2011CN102280386A Ldmos晶体管结构及其形成方法 Ldmos transistor structure and method of forming
12/14/2011CN102280385A 一种半导体元件的制造方法 A method of manufacturing a semiconductor device
12/14/2011CN102280384A 功率沟槽式金属氧化物半导体场效应晶体管制作工艺 Power trench metal oxide semiconductor field effect transistor fabrication process
12/14/2011CN102280383A 制造超结半导体器件的方法 Super junction semiconductor device manufacturing method
12/14/2011CN102280382A 集成在igbt器件中的静电放电保护结构及其制造方法 Igbt devices integrated in the ESD protection structure and its manufacturing method
12/14/2011CN102280381A Method of planarization insulation layer and method for manufacturing array substrate comprising planarization insulation layer
12/14/2011CN102280380A 通过加工单晶而制造多个半导体晶片的方法 The method of processing a single crystal is manufactured by a plurality of semiconductor wafers
12/14/2011CN102280379A 一种应变硅nmos器件的制造方法 A method of manufacturing a silicon strain nmos devices
12/14/2011CN102280378A Sonos结构和sonos存储器的形成方法 Sonos structure and method for forming a memory sonos
12/14/2011CN102280377A Sonos结构及其制作方法 Sonos structure and production methods
12/14/2011CN102280376A 一种用于cmos器件的双金属栅双高介质的集成方法 An integrated method for dual metal gate cmos devices for double-height media
12/14/2011CN102280375A 一种先栅工艺中叠层金属栅结构的制备方法 A first gate preparation process laminated metal gate structure
12/14/2011CN102280374A 一种50nm及以下的硅栅结构的制作方法 Production method of 50nm and below the silicon gate structure
12/14/2011CN102280373A 一种制备多晶硅太阳能电池发射极的扩散方法 Preparation of a polysilicon emitter solar cell diffusion method
12/14/2011CN102280372A 一种半导体硅片的清洗方法 A semiconductor wafer cleaning method
12/14/2011CN102280371A 可挠性电子元件及其制造方法 The flexible electronic device and manufacturing method
12/14/2011CN102280370A 一种在硅衬底上生长非极性面AlN模板的方法 Method of growing non-polar surface of the AlN template on a silicon substrate
12/14/2011CN102280369A 形成薄膜图案的方法以及具有该薄膜图案的平板显示器 The method of forming a thin film pattern, and a flat panel display having the thin film pattern
12/14/2011CN102280368A 图案化紫外屏蔽膜的制备方法 Patterned UV-shielding film preparation
12/14/2011CN102280367A 保护对准标记的方法及以此方法形成的半导体元件 The semiconductor protection element and a method of alignment marks formed in this way
12/14/2011CN102280366A 一种用于激光加工的旋转窗片装置 Means for rotating windows laser processing
12/14/2011CN102280365A 包括硅纳米晶体的多层结构及光感测单元的制作方法 Including the production method of silicon nanocrystals multilayer structure and optical sensing unit
12/14/2011CN102280364A 三极管梯形成型机 Transistor trapezoid machine
12/14/2011CN102280363A 基板处理设备 The substrate processing apparatus
12/14/2011CN102280362A 基板处理装置及其控制系统、收集单元、以及控制方法 Substrate processing apparatus and its control system, collecting unit, and control method
12/14/2011CN102280361A Fpd的安装装配装置以及安装装配方法 Fpd mounting assembly apparatus and method of assembly is installed
12/14/2011CN102280337A 反应离子刻蚀设备及方法 Reactive ion etching apparatus and method
12/14/2011CN102278967A 抛光液厚度测量装置、测量方法和化学机械抛光设备 Slurry thickness measuring device, measuring method and a chemical mechanical polishing apparatus
12/14/2011CN102277567A 用于微孔填充的化学镀铜溶液 Electroless copper plating solution for the filling of micropores
12/14/2011CN102277096A 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 The anisotropic conductive adhesive and electrically connected using the method of the binder
12/14/2011CN102276167A 一种把金属材料插入玻璃的方法及装置 One kind of metal material is inserted glass method and apparatus
12/14/2011CN102275234A 单晶/多晶硅片多线切割自动脱胶方法及其装置 Mono / polycrystalline silicon wafer multi-wire cutting method and apparatus for automatically unglued
12/14/2011CN101996876B 将较大尺寸沟槽顶部直角改变成明显圆角的方法 Will change the larger size at right angles to the top of the trench obvious way round
12/14/2011CN101966688B 超大规模集成电路铜布线表面低压化学机械抛光方法 VLSI copper wiring surface low pressure chemical mechanical polishing method
12/14/2011CN101930910B 修复离子注入后氧化推进形成的衬底高低差的方法 After the repair height difference between the ion implantation of a substrate to promote oxidation method of forming
12/14/2011CN101923296B Nvm器件制备中光刻对准记号的制备方法 Preparation Nvm devices prepared lithographic alignment mark
12/14/2011CN101920476B 化学机械抛光设备及其研磨液输送方法 The chemical mechanical polishing slurry delivery apparatus and method
12/14/2011CN101916741B Method for preparing strained silicon-on-insulator
12/14/2011CN101901782B Oxidation protection method of multilayer wiring of ultra large scale integrated circuit after alkaline polishing
12/14/2011CN101901767B 获得垂直型沟道高压超级结半导体器件的方法 Obtaining a vertical high-pressure super-channel junction semiconductor device
12/14/2011CN101866954B 一种具有微通道结构的tft基板及其制备方法 Tft substrate and a method for preparing a microchannel structure has
12/14/2011CN101866842B 硅基三维结构磁场辅助电化学腐蚀的方法 Silicon-based three-dimensional structure of the magnetic field assisted electrochemical etching method
12/14/2011CN101847573B 用于加热设备的温度控制方法 Temperature control method for heating the device
12/14/2011CN101842874B 半导体处理方法、半导体处理室和处理头 The semiconductor processing method, a semiconductor processing chamber and the processing head
12/14/2011CN101840856B 封装制作晶圆tsv过程中所采用的腐蚀槽和工艺方法 Etching bath and process for the production of wafer encapsulation process used tsv
12/14/2011CN101834117B 腔门紧锁装置 Chamber door locking device
12/14/2011CN101826482B 晶片固持系统、系统及配合晶片载具使用的晶片 Chip wafer holding systems, systems and tools for use with the wafer
12/14/2011CN101819995B GaN基MOSFET及其制备方法 GaN-based MOSFET and its preparation method
12/14/2011CN101814479B 电极接触结构及其制造方法 Electrode contact structure and manufacturing method
12/14/2011CN101814452B 真空腔定位机构 Vacuum chamber positioning mechanism
12/14/2011CN101809769B 化合物半导体外延晶片及其制造方法 Compound semiconductor epitaxial wafer and its manufacturing method
12/14/2011CN101809731B 用于在处理室内定位衬底的偏移校正技术 Positioning the substrate within the process chamber for offset correction technique
12/14/2011CN101809729B 方向转换装置及具有方向转换装置的悬浮输送系统 Direction changing means having a direction changing means and a suspension conveyor system
12/14/2011CN101807527B 一种SiC MESFET栅极制作方法 One kind of SiC MESFET gate production methods
12/14/2011CN101796617B 用于高度准直光收集布置的方法和装置 Method and apparatus for highly collimated light collecting arrangement
12/14/2011CN101783309B 一种硅片并排输送机构 Silicon wafers side transport mechanism
12/14/2011CN101780942B Mems器件圆片级真空封装方法 Mems device wafer level vacuum packaging method
12/14/2011CN101779276B 掩模修整 Mask trimmed
12/14/2011CN101777560B 存储器阵列及存储器单元 Memory array and memory cells
12/14/2011CN101764065B 一种p型氧化亚锡沟道薄膜晶体管的制备方法 One kind of p-type channel stannous oxide thin film transistor prepared
12/14/2011CN101752347B 一种防静电保护结构及其制作方法 An electrostatic protection structure and method of making anti-
12/14/2011CN101743621B 具有不同掺杂的有应变的电流电极区域的晶体管 Current electrode of transistor regions are doped with different strain
12/14/2011CN101743619B 半导体器件的分离 Separating the semiconductor device
12/14/2011CN101740586B 紫外光图像传感器及其制作方法 Ultraviolet image sensor and manufacturing method thereof
12/14/2011CN101740468B 深沟槽二次刻蚀接触孔及刻蚀方法 The second contact hole deep trench etching and etching method
12/14/2011CN101740403B 封装基板结构及其制作方法 Package substrate structure and production methods
12/14/2011CN101719517B 一种肖特基隧穿晶体管的制备方法 One kind of preparation Schottky tunneling transistor
12/14/2011CN101714522B 制造半导体元件的方法与半导体元件 The method of manufacturing a semiconductor element and a semiconductor element
12/14/2011CN101714508B 制造半导体装置的方法 The method of manufacturing a semiconductor device
12/14/2011CN101710580B Bipolar电路的多层复合钝化层结构及其生成工艺方法 Passivation layer multilayer composite structure Bipolar circuit and method for generating process
12/14/2011CN101699613B 在等离子体反应装置中以均匀温度冷却晶片支撑的方法 In the plasma reaction apparatus at a uniform temperature of the cooling method of the wafer support
12/14/2011CN101692463B 一种混合纳米晶存储器的电容结构及其制备方法 Capacitor structure and a method for preparing hybrid nanocrystal memory
12/14/2011CN101685826B 一种具有二极管驱动器的存储阵列及其制造方法 A storage array and its manufacturing method diode driver has
12/14/2011CN101675510B 金属线接合方法和接合力校准 Wire bonding method and the bonding force calibration
12/14/2011CN101667526B 晶片处理装置及在单一装置中处理半导体晶片的方法 Wafer processing apparatus and method for processing semiconductor wafers in a single apparatus
12/14/2011CN101663758B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011CN101661902B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011CN101651114B 精确位置调节装置及具有该装置的半导体在线检测系统 Precise position adjusting means and having a semiconductor-line detection system of the apparatus
12/14/2011CN101647110B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011CN101636824B 用于分层加热器的高功率电气接头 High power heater electrical connector for stratification
12/14/2011CN101627460B 被破坏低k介电膜层去除的方法 Is damaged low-k dielectric film layer removal method
12/14/2011CN101615577B 外延晶片及其制造方法 An epitaxial wafer and its manufacturing method
12/14/2011CN101581880B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method
12/14/2011CN101577247B 把金属和超低k值电介质集成 Metal and ultra low-k dielectric integration
12/14/2011CN101562134B 隧道窗口制备方法 Preparation tunnel window
12/14/2011CN101556909B 等离子体处理装置及其密封结构、密封方法 Apparatus and sealing structure, a sealing method plasma treatment
12/14/2011CN101551564B 低成本大画面广视野角高速回应液晶显示装置 Low-cost large-screen high-speed response to a wide viewing angle liquid crystal display device
12/14/2011CN101540328B 非易失性半导体存储器件及其制造方法 Non-volatile semiconductor memory device and manufacturing method thereof
12/14/2011CN101533279B 用于支持电子装置的测试的系统、温度控制单元及方法 System for supporting testing of an electronic device, a temperature control unit and method
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