H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/14/2011	CN101529596B 装置及其制造方法 Device and manufacturing method
12/14/2011	CN101501112B 互穿聚合物网络结构体及研磨垫以及它们的制造方法 Interpenetrating polymer network structure and a polishing pad and a method of manufacturing thereof
12/14/2011	CN101495244B 涂敷方法及涂敷装置 The coating method and the coating apparatus
12/14/2011	CN101475140B 纳米尺度下界面陷阱产生的巨压阻及其制作方法 Nanoscale interface traps generated by the giant piezoresistive and production methods
12/14/2011	CN101465296B 薄膜晶体管及其制造方法和显示装置 A thin film transistor and a display device and manufacturing method thereof
12/14/2011	CN101456534B 聚焦离子束注入结合氟化氙气体辅助刻蚀的微纳加工方法 Focused ion beam implantation combined with micro-nanofabrication methods xenon gas-assisted etching of fluorinated
12/14/2011	CN101454892B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011	CN101447460B 制造电子装置的方法及电子装置 The method of manufacturing an electronic device and electronic apparatus
12/14/2011	CN101447402B 用于晶片处理的处理室及其相关方法 A wafer processing chamber for processing and related method
12/14/2011	CN101442077B 一种齐纳二极管及其bcd工艺制造方法 Zener diode and bcd one kind of process manufacturing method
12/14/2011	CN101425521B Soi衬底及其制造方法 Soi substrate and manufacturing method thereof
12/14/2011	CN101423681B 导体图案形成用墨液、导体图案及布线基板 The ink for forming a conductor pattern, the conductor pattern and a printed circuit board
12/14/2011	CN101417405B 半导体晶片的同时双面磨削 Grinding the semiconductor wafer while the double-sided
12/14/2011	CN101416301B 将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 The electrical contact element disposed on the circuit carrier mounting system suitable for carrying out the method and the method
12/14/2011	CN101414555B 闪存浮栅制造方法 Floating gate flash memory manufacturing method
12/14/2011	CN101405838B 移动体驱动方法及移动体驱动系统、图案形成方法及装置、曝光方法及装置、组件制造方法、以及校正方法 The movable body drive method and the movable body drive system, a pattern forming method and apparatus, exposure method and apparatus, device manufacturing method, and a correction method
12/14/2011	CN101373742B 具有密封环结构的半导体器件及其形成方法 Semiconductor device having a sealing ring structure and method of forming
12/14/2011	CN101369537B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/14/2011	CN101363128B 用于形成突起的非氰类电解金电镀液 Non-cyanide electrolytic gold plating solution for forming the protrusions
12/14/2011	CN101359614B 一种衬垫夹钳 One kind of liner clamp
12/14/2011	CN101354366B 故障解析方法及故障解析装置 Failure analysis method, and failure analysis apparatus
12/14/2011	CN101346801B 具有双层浮栅的eprom单元 Eprom unit has a double floating gate
12/14/2011	CN101344725B 涂敷装置、基板的交接方法及涂敷方法 Interfacing method of coating apparatus, the substrate and the coating method
12/14/2011	CN101342992B 板状体搬运装置 Plate-like body handling device
12/14/2011	CN101341583B Ⅲ-Ⅴ族半导体器件的电介质界面 Dielectric interface Ⅲ-Ⅴ semiconductor devices
12/14/2011	CN101322240B 半导体装置 Semiconductor device
12/14/2011	CN101310374B 用于高级焊料凸点形成的方法 Advanced method for forming solder bumps
12/14/2011	CN101295722B 半导体器件及其制造方法、光测定装置、光检测装置 Semiconductor device and manufacturing method for an optical device, an optical detection means measuring
12/14/2011	CN101276743B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/14/2011	CN101262985B 输送机构、输送装置及真空处理装置 Conveying means, conveying means and a vacuum processing apparatus
12/14/2011	CN101256987B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/14/2011	CN101231479B 浸润式微影方法、浸润式微影系统及其封闭板的对准方法 Immersion lithography method, immersion lithography system and its closure plate alignment method
12/14/2011	CN101189705B 芯片反转装置和芯片反转方法，及芯片安装设备和芯片安装方法 Reversal device chip and chip inversion method, and chip mounting equipment and chip mounting method
12/14/2011	CN101185988B 激光照射装置及照射方法、装置的制造方法 Laser irradiation apparatus and method for producing the irradiation method, apparatus
12/14/2011	CN101175362B 除电装置和除电方法 Except electrical apparatus and methods in addition to electricity
12/14/2011	CN101161411B 晶片的磨削加工方法 Wafer grinding method
12/14/2011	CN101154581B 半导体器件的制造方法、湿式蚀刻处理装置及湿式蚀刻方法 The method of manufacturing a semiconductor device, a wet etching apparatus and wet etching method processing
12/14/2011	CN101128084B 等离子体生成装置、等离子体控制方法和基板制造方法 The plasma generating apparatus, the plasma control method and substrate manufacturing method
12/14/2011	CN101124353B 生长第（Ⅲ）族金属氮化物薄膜的方法和装置、以及第（Ⅲ）族金属氮化物薄膜 The first growth (Ⅲ) Method and apparatus for metal nitride films, as well as the first (Ⅲ) metal nitride films
12/14/2011	CN101079383B 半导体器件的制造方法和制造装置 Manufacturing method and manufacturing apparatus of a semiconductor device
12/14/2011	CN101071276B 位移测量系统、光刻设备、位移测量方法和装置制造方法 Displacement measuring system, lithographic apparatus and device manufacturing method displacement measurement method
12/14/2011	CN101067985B 电子器件 Electronic devices
12/14/2011	CN101064986B 结合有多重磁芯的电感耦合等离子体反应器 Combined with multiple cores inductively coupled plasma reactor
12/14/2011	CN101057340B 半导体装置及用于其制造的方法 Semiconductor device and method for its manufacture
12/14/2011	CN101055838B 一种制造一半导体器件的方法 A method of manufacturing a semiconductor device
12/14/2011	CN101041413B 微机械及其制造方法 Micromechanical and manufacturing method thereof
12/14/2011	CN101039543B 可调整高度的等离子体离子流探头 Adjustable height of the plasma ion current probe
12/14/2011	CN101009332B 薄膜电路装置、电子设备和制造方法 A thin film circuit device, an electronic device and manufacturing method
12/13/2011	USRE43025 Mixed composition interface layer and method of forming
12/13/2011	USRE43023 Dual loading port semiconductor processing equipment
12/13/2011	US8078996 Method and system for correcting a mask pattern design
12/13/2011	US8078419 Polishing monitoring method and polishing apparatus
12/13/2011	US8078306 Polishing apparatus and polishing method
12/13/2011	US8078018 Communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses
12/13/2011	US8078012 Pattern inspection apparatus and method
12/13/2011	US8077504 Shallow trench type quadri-cell of phase-change random access memory (PRAM)
12/13/2011	US8077391 Wavefront aberration measuring method, mask, wavefront aberration measuring device, exposure apparatus, and device manufacturing method
12/13/2011	US8077287 Method of preparing components, prepared component, lithographic apparatus and device manufacturing method
12/13/2011	US8077280 Thin film transistor substrate of horizontal electric field type liquid crystal display device and fabricating method thereof
12/13/2011	US8077269 Array substrate and display panel having the same
12/13/2011	US8077248 Optical device and production method thereof
12/13/2011	US8076774 Transistor clamping device
12/13/2011	US8076770 Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
12/13/2011	US8076767 Semiconductor device
12/13/2011	US8076765 Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors
12/13/2011	US8076763 Electrical shielding in stacked dies by using conductive die attach adhesive
12/13/2011	US8076759 Semiconductor package with a controlled impedance bus and method of forming same
12/13/2011	US8076748 Semiconductor device
12/13/2011	US8076734 Semiconductor structure including self-aligned deposited gate dielectric
12/13/2011	US8076732 Semiconductor device
12/13/2011	US8076714 Memory device with high dielectric constant gate dielectrics and metal floating gates
12/13/2011	US8076713 Non-volatile memory devices having a multi-layered charge storage layer
12/13/2011	US8076709 Nonvolatile semiconductor memory device
12/13/2011	US8076706 Ferroelectric memory device and method of manufacturing the same
12/13/2011	US8076705 Capacitor device providing sufficient reliability
12/13/2011	US8076702 CMOS image sensor and fabricating method thereof
12/13/2011	US8076700 P-N junction for use as an RF mixer from GHZ to THZ frequencies
12/13/2011	US8076699 Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems
12/13/2011	US8076654 Sample surface inspection apparatus and method
12/13/2011	US8076252 Substrate processing method and substrate processing apparatus
12/13/2011	US8076251 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
12/13/2011	US8076250 PECVD oxide-nitride and oxide-silicon stacks for 3D memory application
12/13/2011	US8076249 Structures containing titanium silicon oxide
12/13/2011	US8076248 Methods for forming semiconductor constructions, and methods for selectively etching silicon nitride relative to conductive material
12/13/2011	US8076247 Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
12/13/2011	US8076246 Method of manufacturing thermally assisted magnetic head
12/13/2011	US8076245 MOS low power sensor with sacrificial membrane
12/13/2011	US8076244 Methods for causing fluid to flow through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device components
12/13/2011	US8076242 Methods of forming an amorphous silicon thin film
12/13/2011	US8076241 Methods for multi-step copper plating on a continuous ruthenium film in recessed features
12/13/2011	US8076240 Techniques to improve characteristics of processed semiconductor substrates
12/13/2011	US8076239 Semiconductor device and method of manufacturing the same
12/13/2011	US8076238 Electronic device and method for production
12/13/2011	US8076237 Method and apparatus for 3D interconnect
12/13/2011	US8076236 SRAM bit cell with self-aligned bidirectional local interconnects
12/13/2011	US8076235 Semiconductor device and fabrication method thereof
12/13/2011	US8076234 Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure
12/13/2011	US8076233 Method of forming electrode connecting portion
12/13/2011	US8076232 Semiconductor device and method of forming composite bump-on-lead interconnection
12/13/2011	US8076231 Semiconductor device and manufacturing method of same

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