Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/30/2011CN102259083A 半导体封装用厚胶膜旋涂方法 The semiconductor package with a thick film spin coating method
11/30/2011CN101989620B Mim电容器及其制造方法 Mim capacitor and manufacturing method
11/30/2011CN101882617B 肖特基二极管、半导体存储器及其制造工艺 Schottky diodes, semiconductor memory and manufacturing process
11/30/2011CN101882579B Ono介电层切断方法 Ono dielectric layer cutting method
11/30/2011CN101879702B 组合式修整器及其制法 Combined dresser Jiqizhifa
11/30/2011CN101877302B 对腔体抽真空的方法 The method of evacuating the chamber
11/30/2011CN101874293B 等离子体成膜方法以及等离子体cvd装置 The plasma film forming method and apparatus of a plasma cvd
11/30/2011CN101871110B 电镀铜方法 Copper plating method
11/30/2011CN101866838B 一种非晶硅薄膜可控同质外延生长的方法 One kind of amorphous silicon thin film epitaxially grown on a controlled homogenous method
11/30/2011CN101862904B 激光加工方法及半导体芯片 The laser processing method and a semiconductor chip
11/30/2011CN101847592B Indium welded ball array preparing method based on electroplating technology
11/30/2011CN101819948B 纵向沟道soi ldmos的cmos vlsi集成制作方法 Vertical channel soi ldmos of cmos vlsi integrated production methods
11/30/2011CN101819927B 一种微纳结构硅材料的制备系统与制备方法 Preparation System and method for preparing micro- and nanostructures of silicon material
11/30/2011CN101813859B 液晶显示器件及其制造方法 The liquid crystal display device and manufacturing method thereof
11/30/2011CN101807535B 栅氧化层失效分析方法及所用测试结构 Gate oxide failure analysis and test structures used
11/30/2011CN101803026B 电子器件以及制造电子器件的方法 An electronic device and a method of manufacturing an electronic device
11/30/2011CN101783289B 反型外延片制备方法 Anti-type wafer preparation
11/30/2011CN101752087B Pvdf有机聚合物薄膜电容器 Pvdf organic polymer film capacitors
11/30/2011CN101748480B Si衬底上生长ZnO外延薄膜的方法 Epitaxial growth of ZnO thin films on Si substrates
11/30/2011CN101743639B 用于半导体部件的接触结构及其制造方法 Contact structure and manufacturing method for a semiconductor component
11/30/2011CN101740539B 四方平面无导脚封装单元及其制法和其导线架 Quartet plane without guide pin package and its wire rack unit Jiqizhifa
11/30/2011CN101740373B 浅沟槽形成方法 The method for forming shallow trench
11/30/2011CN101728229B 金属垫的形成方法 The method of forming a metal pad
11/30/2011CN101727014B 控制特征尺寸的光刻方法及光刻系统 Lithographic feature size control method and lithography system
11/30/2011CN101719466B 一种在图形衬底上生长氮化物薄膜外延层的方法 The method of growing a nitride thin epitaxial layer on the substrate the graphic
11/30/2011CN101714541B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011CN101697341B 一种量子阱混合方法 A quantum well intermixing methods
11/30/2011CN101689499B 气化器和成膜装置 Gasifier and film forming apparatus
11/30/2011CN101685764B 系统级封装模块结构的制造方法 The method of manufacturing the modular structure of the system in package
11/30/2011CN101681808B 从半导体晶片制造工艺再生废浆料的再生工艺和再生系统 Regeneration of waste slurry from the semiconductor wafer manufacturing process regeneration process and regeneration system
11/30/2011CN101677065B 制造半导体元件的方法 The method of manufacturing a semiconductor element
11/30/2011CN101661934B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011CN101661912B 用于直接基板冷却的具有分布式支撑的逆变器功率模块 For direct cooling of the substrate having a distributed inverter power module support
11/30/2011CN101657893B 半导体晶圆的异物检测和修复系统及其方法 Semiconductor wafer foreign body detection and repair system and method
11/30/2011CN101656240B 单一晶粒尺寸半导体元件绝缘被覆工艺 Single grain size of the semiconductor device having an insulating coating process
11/30/2011CN101646803B 气体供给方法和气体供给装置 Gas supply method and the gas supply means
11/30/2011CN101641783B 氮化硅膜和非易失性半导体存储器件 A silicon nitride film and a non-volatile semiconductor memory device
11/30/2011CN101640215B 有机发光二极管显示器 The organic light emitting diode display
11/30/2011CN101636818B 电极隔离方法及具有隔离电极对的基于纳米线的器件 Electrode isolation methods and devices have isolated electrodes based on nanowires
11/30/2011CN101635278B Dram中存储单元的离子掺杂方法 Dram ion doping method in the storage unit
11/30/2011CN101635261B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011CN101630650B 传送工具 Transfer tool
11/30/2011CN101630635B 玻璃基板蚀刻装置 Glass substrate etching apparatus
11/30/2011CN101626015B 封装结构及其形成、量产方法与芯片堆叠结构 Package structure and formation, production methods and chip stack structure
11/30/2011CN101617390B 切割/芯片接合薄膜 Cutting / die-bonding film
11/30/2011CN101615619B 半导体器件 Semiconductor devices
11/30/2011CN101615570B 真空处理装置 Vacuum processing apparatus
11/30/2011CN101611483B 利用真空封装电子元器件的方法和设备 Method and apparatus for the use of vacuum packaging of electronic components
11/30/2011CN101604668B 无Pb焊料连接结构和电子装置 Pb-free solder connection structure and electronic devices
11/30/2011CN101599418B 激光剥离方法 Laser lift-off method
11/30/2011CN101598907B 衬底台、光刻设备和器件制造方法 Substrate table, lithographic apparatus and device manufacturing method
11/30/2011CN101593691B 沟槽的刻蚀方法 Trench etching method
11/30/2011CN101593687B 多晶硅栅极、侧墙、半导体器件及其形成方法 Polysilicon gate, side walls, and a method of forming a semiconductor device
11/30/2011CN101587304B 图形转移方法 Pattern transfer method
11/30/2011CN101584038B 形成包括具有受应力的信道区的场效晶体管的半导体结构的方法 Forming a field effect transistor comprising a semiconductor structure having a stressed channel region of a method
11/30/2011CN101584024B 多层结构及其制备工艺 Multi-layer structure and preparation process
11/30/2011CN101577251B Cmos器件钝化层形成方法 Cmos device passivation layer forming method
11/30/2011CN101577244B 层间介质层的平坦化方法及接触孔的形成方法 The method of forming an interlayer planarizing method and a dielectric layer of a contact hole
11/30/2011CN101572246B 电阻存储器、含有电阻存储器的集成电路的制作方法 Production Method resistance memory, memory integrated circuits containing resistance
11/30/2011CN101572235B N型轻掺杂区域的形成方法及半导体器件的制造方法 The method of manufacturing a semiconductor device forming method and an N-type lightly doped region
11/30/2011CN101567355B 半导体封装基板及其制法 The semiconductor package substrate preparation method
11/30/2011CN101562152B 主动元件阵列基板的制造方法 The method of manufacturing an active element array substrate
11/30/2011CN101552311B 发光元件的封装制程 Packaging process emitting element
11/30/2011CN101552186B 等离子体蚀刻方法 The plasma etching method
11/30/2011CN101542726B 具有硅通孔和侧面焊盘的半导体芯片 A semiconductor chip having a silicon vias and side pads
11/30/2011CN101521212B 显示装置及其制造方法 Display device and manufacturing method
11/30/2011CN101491885B 一种晶圆控片的研磨方法 A method of controlling the grinding chip wafer
11/30/2011CN101459103B 台装置 Station
11/30/2011CN101452860B 多芯片堆叠结构及其制法 Multi-chip stack structure Jiqizhifa
11/30/2011CN101449639B 工件自动作业装置 Workpiece automatic working device
11/30/2011CN101447409B 半导体晶圆的保护带切断方法及其装置 Method and apparatus for semiconductor wafer protective tape off
11/30/2011CN101425467B 在柔性衬底上制备透明导电薄膜及透明异质结的方法 Transparent conductive film and method for preparing transparent heterojunction on flexible substrates
11/30/2011CN101414617B 固体摄像装置 The solid-state imaging device
11/30/2011CN101389179B 等离子体处理装置和等离子体处理方法 Plasma processing apparatus and plasma processing method
11/30/2011CN101383292B 修改芯片封装体上的载球层的方法 Modify the ball carrier layer on the chip package
11/30/2011CN101374973B 基板处理装置以及基板载置台 Substrate processing apparatus and substrate stage
11/30/2011CN101373733B 集成电路器件结构形成方法及相应结构 The method of forming an integrated circuit device structure and the corresponding structures
11/30/2011CN101364568B 镜头模块的制造方法及以该方法所制成的镜头模块 The method of manufacturing the lens module and in this way made the lens module
11/30/2011CN101334414B 用于晶片的缺陷检测机台的匹配方法 Matching wafer defect inspection machine for
11/30/2011CN101320731B 集成电路器件制造方法和相关器件 Integrated circuit device manufacturing method and related devices
11/30/2011CN101304004B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011CN101298132B 复合式研磨垫及其制造方法 Composite polishing pad and manufacturing method thereof
11/30/2011CN101288163B 用于处理控制之产品相关之反馈 Related to the feedback process control of products for
11/30/2011CN101241309B 利用间距偏移量校准次纳米关键尺寸的方法 The use of sub-nanometer spacing offset calibration method for critical dimension
11/30/2011CN101226892B 测量装置及激光加工机 Measuring devices and laser processing machine
11/30/2011CN101202256B 功率放大器 PA
11/30/2011CN101170075B 晶片的分割方法以及分割装置 Segmentation of the wafer and dividing means
11/30/2011CN101161391B 焊剂成膜装置及焊剂面的平滑化方法 Smoothing film forming apparatus and method of solder flux surfaces
11/30/2011CN101156238B 电子零件连接用突起电极与电子零件安装体的制造方法 Connecting the electronic component manufacturing method of mounting electronic parts and bump electrodes
11/30/2011CN101108720B 微机电装置以及其制造方法 Micro-electromechanical device and a manufacturing method thereof
11/30/2011CN101102909B 从用于等离子体处理设备的硅和碳化硅电极表面除去黑硅和黑碳化硅的方法 Removed from the silicon and silicon carbide electrode surface for plasma processing apparatus of black silicon and silicon carbide
11/30/2011CN101055431B 图像形成方法和装置 The image forming method and apparatus
11/30/2011CN101051654B 半导体电阻及制造该半导体电阻的半导体制程 Semiconductor manufacturing the semiconductor resistors and resistor semiconductor process
11/30/2011CN101043053B 具有改善性能的功率半导体器件和方法 Power semiconductor device having improved properties and methods
11/30/2011CN101013686B 互连衬底、半导体器件及其制造方法 Interconnect substrate, a semiconductor device and manufacturing method thereof
11/30/2011CN101006206B 硅片及其制造方法，以及硅单晶的培育方法 Wafer manufacturing method thereof, and silicon single crystal cultivation method
11/29/2011USRE42972 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
11/29/2011US8068663 Simulation method of optical image intensity distribution, program, and method of manufacturing semiconductor device
11/29/2011US8068379 Dynamic RAM
11/29/2011US8068370 Floating gate memory device with interpoly charge trapping structure
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