H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/01/2011	US20110294298 Textured single crystal
12/01/2011	US20110294297 Method of manufacturing semiconductor device
12/01/2011	US20110294296 Using edges of self-assembled monolayers to form narrow features
12/01/2011	US20110294295 Method for making three-dimensional nano-structure array
12/01/2011	US20110294294 Protective coating for planarization
12/01/2011	US20110294293 Chemical planarization of copper wafer polishing
12/01/2011	US20110294292 Method of forming a shared contact in a semiconductor device
12/01/2011	US20110294291 Semiconductor device and method of manufacturing the same
12/01/2011	US20110294290 Three-dimensional semiconductor memory device and method for manufacturing the same
12/01/2011	US20110294289 Method for Producing a Connection Electrode for Two Semiconductor Zones Arranged One Above Another
12/01/2011	US20110294288 Method of fabricating metal interconnection and method of fabricating image sensor using the same
12/01/2011	US20110294287 Method of manufacturing semiconductor device having dual fully-silicided gate
12/01/2011	US20110294286 Reverse planarization method
12/01/2011	US20110294285 Photo key and method of fabricating semiconductor device using the photo key
12/01/2011	US20110294284 Method for depositing ultra fine grain polysilicon thin film
12/01/2011	US20110294283 Mocvd reactor having cylindrical gas inlet element
12/01/2011	US20110294282 Semiconductor device and method for manufacturing the same
12/01/2011	US20110294281 Method of at least partially releasing an epitaxial layer
12/01/2011	US20110294280 Method of manufacturing semiconductor device and substrate processing apparatus
12/01/2011	US20110294279 Working method for sapphire substrate
12/01/2011	US20110294278 Method for manufacturing semiconductor device
12/01/2011	US20110294277 Methods for manufacturing multilayer wafers with trench structures
12/01/2011	US20110294276 Method of manufacturing semiconductor device
12/01/2011	US20110294275 Method for fabricating semiconductor device
12/01/2011	US20110294274 Method of forming metal gate structure and method of forming metal gate transistor
12/01/2011	US20110294273 Method and Layout of Semiconductor Device with Reduced Parasitics
12/01/2011	US20110294272 Semiconductor device production method
12/01/2011	US20110294271 Semiconductor device and manufacturing method thereof
12/01/2011	US20110294270 Method of manufacturing semiconductor device
12/01/2011	US20110294269 Transistor With Embedded Strain-Inducing Material Formed in Diamond-Shaped Cavities Based on a Pre-Amorphization
12/01/2011	US20110294268 Thin Film Transistors and Methods of Manufacturing Thin Film Transistors
12/01/2011	US20110294267 Method of fabricating thin film transistor
12/01/2011	US20110294266 Method of manufacturing a semiconductor device
12/01/2011	US20110294265 Semiconductor device and manufacturing method of the same
12/01/2011	US20110294264 Heat spreader as mechanical reinforcement for ultra-thin die
12/01/2011	US20110294263 Pattern verification method, program thereof, and manufacturing method of semiconductor device
12/01/2011	US20110294262 Semiconductor package process with improved die attach method for ultrathin chips
12/01/2011	US20110294261 Semiconductor device and manufacturing method of the same
12/01/2011	US20110294260 Semiconductor package and method of forming the same
12/01/2011	US20110294259 Nonvolatile memory element, manufacturing method thereof, and nonvolatile semiconductor apparatus using the nonvolatile memory element
12/01/2011	US20110294258 Method and apparatus for trench and via profile modification
12/01/2011	US20110294246 Silicon dioxide cantilever support and method for silicon etched structures
12/01/2011	US20110294245 Adaptation of the lattice parameter of a layer of strained material
12/01/2011	US20110294240 Light-emitting device, light-emitting system including the same, and fabricating method thereof
12/01/2011	US20110294239 Sub-resolution assist feature arranging method and computer program product and manufacturing method of semiconductor device
12/01/2011	US20110294238 Semiconductor wafer with electrically connected contact and test areas
12/01/2011	US20110294237 Packaging method of semiconductor device
12/01/2011	US20110294236 Semiconductor device and method of manufacturing it
12/01/2011	US20110294235 Method of forming a semiconductor device
12/01/2011	US20110294234 Thin film solar fabrication process, etching method, device for etching, and thin film solar device
12/01/2011	US20110294233 Method of manufacturing a semiconductor device
12/01/2011	US20110294232 Method for recovering damage of low dielectric insulating film and method for manufacturing semiconductor device
12/01/2011	US20110294231 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
12/01/2011	US20110294047 Photomask blank, resist pattern forming process, and photomask preparation process
12/01/2011	US20110293395 Transferring apparatus
12/01/2011	US20110293305 Development method, method of manufacturing photomask, method of manufacturing semiconductor device and development device
12/01/2011	US20110292959 Semiconductor laser device and method for fabricating the same
12/01/2011	US20110292957 Gan-based laser diodes with misfit dislocations displaced from the active region
12/01/2011	US20110292723 Dram cell utilizing floating body effect and manufacturing method thereof
12/01/2011	US20110292708 3d semiconductor device
12/01/2011	US20110292653 LED lamp, method for manufacturing and LED lamp and bulb therefor
12/01/2011	US20110292632 Method for manufacturing a semiconductor component and structure therefor
12/01/2011	US20110292628 Anti-ultraviolet memory device and fabrication method thereof
12/01/2011	US20110292562 Matched coefficient of thermal expansion for an electrostatic chuck
12/01/2011	US20110292561 Tray for transporting wafers and method for fixing wafers onto the tray
12/01/2011	US20110292490 Method and apparatus for providing high-fill-factor micromirror/micromirror arrays with surface mounting capability
12/01/2011	US20110291303 Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them
12/01/2011	US20110291302 Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
12/01/2011	US20110291301 Method for Producing Semiconductor Components, and Corresponding Semiconductor Component
12/01/2011	US20110291300 Dicing sheet-attached film for forming semiconductor protection film, method for producing semiconductor device using the same, and semiconductor device
12/01/2011	US20110291299 Stress Reduction in Chip Packaging by a Stress Compensation Region Formed Around the Chip
12/01/2011	US20110291298 Chip Package Including Multiple Sections for Reducing Chip Package Interaction
12/01/2011	US20110291292 Selective Shrinkage of Contact Elements in a Semiconductor Device
12/01/2011	US20110291287 Through-silicon vias with low parasitic capacitance
12/01/2011	US20110291286 Electronic device and method for connecting a die to a connection terminal
12/01/2011	US20110291284 INTERCONNECT STRUCTURE WITH AN OXYGEN-DOPED SiC ANTIREFLECTIVE COATING AND METHOD OF FABRICATION
12/01/2011	US20110291283 Integrated circuit package system with embedded die superstructure and method of manufacture thereof
12/01/2011	US20110291281 Partial air gap formation for providing interconnect isolation in integrated circuits
12/01/2011	US20110291280 Semiconductor device and manufacturing method thereof
12/01/2011	US20110291279 Semiconductor article having a through silicon via and guard ring
12/01/2011	US20110291276 Magnetically sintered conductive via
12/01/2011	US20110291275 Method of assembling chips
12/01/2011	US20110291273 Chip bump structure and method for forming the same
12/01/2011	US20110291271 Semiconductor chip and semiconductor device
12/01/2011	US20110291270 Manufacturing method of semiconductor device, and mounting structure thereof
12/01/2011	US20110291266 Semiconductor integrated circuit having a multi-chip structure
12/01/2011	US20110291265 Semiconductor integrated circuit having a multi-chip structure
12/01/2011	US20110291264 Integrated circuit packaging system with posts and method of manufacture thereof
12/01/2011	US20110291263 Ic having dielectric polymeric coated protruding features having wet etched exposed tips
12/01/2011	US20110291261 Three dimensional stacked package structure
12/01/2011	US20110291260 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
12/01/2011	US20110291259 Reliable metal bumps on top of I/O pads after removal of test probe marks
12/01/2011	US20110291257 Integrated circuit packaging system with dual side connection and method of manufacture thereof
12/01/2011	US20110291256 Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
12/01/2011	US20110291254 Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
12/01/2011	US20110291252 Method and system for forming a thin semiconductor device
12/01/2011	US20110291251 Integrated circuit packaging system with multiple row leads and method of manufacture thereof
12/01/2011	US20110291249 Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe
12/01/2011	US20110291247 Relaxation and transfer of strained material layers
12/01/2011	US20110291245 Semiconductor Device with Substrate-Side Exposed Device-Side Electrode and Method of Fabrication

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