Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/01/2011DE102004059629B4 Halbleitervorrichtung vom Typ mit dielektrischer Isolierung und Verfahren zu deren Herstellung A semiconductor device of the type with dielectric isolation, and methods for their preparation
12/01/2011CA2775065A1 Silicon carbide substrate and method for manufacturing same
11/2011
11/30/2011EP2390972A1 Nitride-semiconductor luminescent element, epitaxial substrate, and method of producing nitride-semiconductor luminescent element
11/30/2011EP2390932A1 Semiconductor device and method for manufacturing same
11/30/2011EP2390928A2 Light emitting device, light emitting device package, and lighting system
11/30/2011EP2390925A1 Thin film solar fabrication process, etching method, device for etching, and thin film solar device
11/30/2011EP2390919A2 III-Nitride switching device with an emulated diode
11/30/2011EP2390913A2 Locking device and method for making the same
11/30/2011EP2390909A1 Miniature packaging for discrete circuit components
11/30/2011EP2390908A2 Method of manufacturing an electronic device package
11/30/2011EP2390907A1 Trench structure in multilayer wafer
11/30/2011EP2390906A1 Apparatus and method for electrostatic discharge (ESD) reduction
11/30/2011EP2390905A1 Thin film monitoring device and method
11/30/2011EP2390904A2 Method for low temperature pressure interconnection of two connection partners and assembly manufactured using same
11/30/2011EP2390903A1 Semiconductor device and method of manufacturing same
11/30/2011EP2390721A2 Patterned polymeric structures, particularly microstructures, and methods for making same
11/30/2011EP2390297A1 Conductive hydrocarbon fluid
11/30/2011EP2390239A2 Synthetic quartz glass substrate and making method
11/30/2011EP2390225A2 Method of dividing a substrate into a plurality of individual chip parts
11/30/2011EP2390194A1 Apparatus for assembling chip devices on wires
11/30/2011EP2389689A2 Electrode structure, device comprising the same and method for forming electrode structure
11/30/2011EP2389688A1 Asymmetric junction field effect transistor and method of manufacturing the same
11/30/2011EP2389685A2 Systems and methods for detecting defects on a wafer
11/30/2011EP2389684A2 Dual high-k oxides with sige channel
11/30/2011EP2389683A2 Methods of enhancing performance of field-effect transistors and field-effect transistors made thereby
11/30/2011EP2389682A1 Non-condensing thermos chuck
11/30/2011EP2389633A2 Memory device power managers and methods
11/30/2011EP2389612A1 A photoresist image-forming process using double patterning
11/30/2011EP2389417A1 Compositons comprising silane modified metal oxides
11/30/2011EP2195843B1 Programmable rom using two bonded strata and method of operation
11/30/2011EP1979941B1 Structure and method for making high density mosfet circuits with different height contact lines
11/30/2011EP1850375B1 Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
11/30/2011EP1808887B1 Production method of semiconductor wafer
11/30/2011EP1735816B1 Phosphor and blends thereof for use in leds
11/30/2011EP1678746B1 Method for forming a dielectric on a copper-containing metallisation
11/30/2011EP1638864B1 Wafer box with radially pivoting latch elements
11/30/2011EP1612891B1 Anisotropic electrically conductive film and method of producing the same
11/30/2011EP1609174B1 Chamber and method for wafer processing
11/30/2011EP1393115B1 Systems and methods for scanning a beam of light across a specimen
11/30/2011EP1361610B1 Vaporizer and deposition device using the same
11/30/2011EP1355362B1 Semiconductor device
11/30/2011EP1166366B1 Doping pastes for producing p, p+ and n, n+ zones in semiconductors
11/30/2011DE20321881U1 LEDS mit vertikaler Struktur LEDS vertical structure
11/30/2011DE20321880U1 LEDS mit vertikaler Struktur LEDS vertical structure
11/30/2011CN202059594U 一种石英加热槽 A silica heating tank
11/30/2011CN202058736U Multilayer film structure used for preparing polycrystalline silicon thin film
11/30/2011CN202058735U 陶瓷衬底的氮化镓基芯片 The gallium nitride-based ceramic substrate chip
11/30/2011CN202058716U 半导体组件取放机构及半导体组件挑选设备 Semiconductor component pick and place mechanism and semiconductor equipment components selection
11/30/2011CN202058715U 取放头结构 Pick and place head structure
11/30/2011CN202058714U Cassette correction system
11/30/2011CN202058713U Floating table for cassette correcting system
11/30/2011CN202058712U 芯片支持框抽放治具 Chip support frame drainage fixture
11/30/2011CN202058711U 晶片更换装置以及焊接装置 Replace the device wafer and welding equipment
11/30/2011CN202058710U 资料收集装置 Data collection device
11/30/2011CN202058709U 子母垃圾桶 Picture trash
11/30/2011CN202058708U 一种剥离硅片的铲刀 A release silicon blade
11/30/2011CN202058707U 固晶机焊头机构 Bonder welding head mechanism
11/30/2011CN202058706U 晶圆喷洗干燥装置 Wafer spray drying device
11/30/2011CN202058705U 晶片烘干系统 Wafer drying system
11/30/2011CN202058704U 高速晶圆劈裂装置 High-speed wafer splitting device
11/30/2011CN202053247U 机械手 Manipulator
11/30/2011CN202052736U 用于清洗外管的洗管机 Wash for cleaning the outer tube of the machine
11/30/2011CN1932646B 曝光装置 Exposure device
11/30/2011CN1921035B 在集成电路中形成的交叉耦合的电感器对 In the integrated circuit formed of cross-coupled inductors
11/30/2011CN1841214B 在抗蚀剂剥离室中从衬底上除去抗蚀剂的方法 The method of removing the resist from the substrate in the resist stripping chamber
11/30/2011CN1800975B 分步重复光照纳米压印装置 Step and repeat light nanoimprinter
11/30/2011CN1667026B 抛光浆料及其制备方法和基板的抛光方法 Polishing slurry and polishing method and substrate preparation
11/30/2011CN1659710B 在绝缘层上覆硅基板中的掺杂区域 On the insulating layer overlying the silicon substrate doped region
11/30/2011CN1550894B 化学放大型光刻胶组合物 Chemical amplification type resist composition
11/30/2011CN1531037B 激光辐照方法、设备以及用于制造半导体器件的方法 Laser irradiation method, apparatus and a method for manufacturing a semiconductor device
11/30/2011CN102265474A 氮化物半导体装置及其制造方法 The nitride semiconductor device and manufacturing method thereof
11/30/2011CN102265413A 具有新的几何形状的太阳能电池芯片及其制造方法 Solar cell and method of manufacturing the chip with a new geometry
11/30/2011CN102265411A 受光元件、受光元件阵列、制造受光元件的方法以及制造受光元件阵列的方法 An optical element, light receiving element array, a method of manufacturing the light receiving element and a method of manufacturing the light-receiving element array
11/30/2011CN102265398A 硅基纳米级交叉存储器 Silicon-based nano-level cross-memory
11/30/2011CN102265397A 忆阻设备以及制造和使用所述忆阻设备的方法 Memristor devices and methods of making and using the memristor device
11/30/2011CN102265392A 半导体存储单元及其制造方法以及半导体存储装置 The semiconductor memory cell and method for manufacturing a semiconductor memory device, and
11/30/2011CN102265391A 半导体结构 Semiconductor structure
11/30/2011CN102265390A 静电卡盘用卡板的制造方法 The method for producing an electrostatic chuck pallets
11/30/2011CN102265389A 结合方法 Combined method
11/30/2011CN102265388A 热固型芯片接合薄膜 Thermosetting die bonding film
11/30/2011CN102265387A 具有循环高压及低压清洗步骤的远程等离子体清洗工艺 Remote plasma cleaning step with a high-pressure and low-pressure cleaning process cycle
11/30/2011CN102265386A 基板切断方法及电子元件的制造方法 Substrate cutting method and manufacturing method of an electronic device
11/30/2011CN102265385A 分子离子的离子植入技术 Molecular ion ion implantation technique
11/30/2011CN102265384A 非水溶液无电沉积 Non-aqueous electroless deposition
11/30/2011CN102265383A 用于沉积具有降低电阻率及改良表面形态的钨膜的方法 Having reduced resistivity for depositing a tungsten film and a method of improving surface morphology
11/30/2011CN102265382A 用于生长Ⅲ族氮化物半导体层的方法 Ⅲ method for growing nitride semiconductor layer
11/30/2011CN102265381A 半色调掩模及制造方法 Half-tone mask and the manufacturing method
11/30/2011CN102265380A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011CN102265323A 显示装置 Display device
11/30/2011CN102265217A 采用压印材料的衬底平坦化及方法 A substrate using imprint planarizing material and method
11/30/2011CN102264944A Cvd装置 Cvd device
11/30/2011CN102264943A 用于碳纳米管生长的装置和方法 Apparatus and method for the growth of carbon nanotubes
11/30/2011CN102264853A 膜状粘合剂和各向异性导电粘合剂 The film-like adhesive and the anisotropic conductive adhesive
11/30/2011CN102264754A 钌化合物、其制造方法、使用其制造含钌薄膜的方法、以及含钌薄膜 Ruthenium compound, its manufacturing method using the manufacturing method of a thin film containing ruthenium, ruthenium-containing thin film and
11/30/2011CN102264616A 分类与供给用于成型的药片的装置 Classification and supply of equipment for molding tablets
11/30/2011CN102264613A 自动仓库 Automated warehouse
11/30/2011CN102264544A 对准台 Alignment station
11/30/2011CN102263194A 半导体封装与制造半导体封装的方法 Semiconductor package and method of fabricating a semiconductor package
11/30/2011CN102263182A 发光器件及其制造方法、发光器件封装以及照明系统 The light emitting device and manufacturing method thereof, a light emitting device package and a lighting system
11/30/2011CN102263160A 晶片传送装置以及具有其的位置感应系统和可视检查系统 Wafer transfer device and having the same position sensing system and visual inspection systems