Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/21/2011CN101958299B Method for packaging single double-sided graphic chip by way of directly arranging and then sequentially plating and etching
12/21/2011CN101937835B 熔丝类晶圆修调参数的方法 Fuse class wafer trimming method parameters
12/21/2011CN101894858B 一种有源驱动有机电致发光器件及其制备方法 An active driving organic electroluminescent device and fabrication method
12/21/2011CN101894737B 腔室环境的控制方法 The control method of the chamber environment
12/21/2011CN101887849B 两步沉积法制备ZnO薄膜的方法及其装置 The method of two-step deposition of ZnO thin films and devices
12/21/2011CN101872789B 一种大功率高电流密度整流二极管芯片及其制造方法 One kind of high-power high current density rectifier diode chip and its manufacturing method
12/21/2011CN101849034B 使用硅烷作为前驱体制备n-型半导体材料的方法 Silane as the precursor preparation method n- type semiconductor material
12/21/2011CN101842881B 等离子体处理装置 The plasma processing apparatus
12/21/2011CN101840872B 无气泡的封装方法 Encapsulation method without air bubbles
12/21/2011CN101840854B 半导体的掺杂方法 Semiconductor doping methods
12/21/2011CN101840842B 处理机 Processor
12/21/2011CN101834149B 用于手机摄像头的cmos图象传感器在封装中控制污染的方法 Methods cmos image sensors for camera phones to control pollution in the package
12/21/2011CN101826501B 高密度接点的无引脚集成电路元件及其制造方法 No pin high-density integrated circuit elements and a manufacturing method of contacts
12/21/2011CN101826484B 浅沟道隔离结构的制造方法 Manufacturing method shallow trench isolation structure
12/21/2011CN101819940B 测试晶片的方法及测试结构 The method and the test wafer test structure
12/21/2011CN101819934B 在器件的掺杂多晶硅沟槽上形成钛化硅层的方法 The method of forming a titanium silicon layer on the doped polysilicon trench device
12/21/2011CN101803013B 半导体装置以及导线焊接方法 Semiconductor device and method of welding wire
12/21/2011CN101794776B 含逆槽沟、源极接地及源体短路电极的半导体器件及方法 Including inverse groove, the semiconductor device source shorted to ground and the source electrode and method body
12/21/2011CN101794714B 钎焊散热件的方法 The method of brazing fins
12/21/2011CN101783317B 动态随机存取存储器的冠状电容器的制作工艺及结构 Production process and the structure of dynamic random access memory capacitor coronal
12/21/2011CN101772831B 切割和芯片接合用带以及半导体芯片的制造方法 And a method for producing a semiconductor chip with a cutting and die-bonding
12/21/2011CN101764196B 一种纳米尺寸相变存储器的制作方法 Method of making a nano-sized memory phase change
12/21/2011CN101764080B 双大马士革工艺中的灰化处理方法 Dual damascene process of ashing method
12/21/2011CN101752428B 场效应晶体管、场效应晶体管的制造方法和显示装置 Field effect transistor, the field effect transistor and method of manufacturing a display device
12/21/2011CN101740550B 带屏蔽装置的电子部件及其制造方法 With a shielding device and a manufacturing method for an electronic component
12/21/2011CN101740402B 大功率半导体器件管座压焊区去金工艺 Power semiconductor devices header compression pads go gold craft
12/21/2011CN101740353B 切割模片接合膜和生产半导体器件的方法 The method of dicing die bonding film and a semiconductor device production
12/21/2011CN101740340B 反应腔室及半导体加工设备 The reaction chamber and a semiconductor processing equipment
12/21/2011CN101728370B 化合物半导体元件的封装模块结构及其制造方法 Encapsulation module structure and manufacturing method of the compound semiconductor element
12/21/2011CN101728298B 载置台 Stage
12/21/2011CN101720503B 等离子体处理装置 The plasma processing apparatus
12/21/2011CN101719488B 具有锥形轮廓的再分布线的焊垫连接 Having a tapered profile redistribution pad connection line
12/21/2011CN101719483B 用于生长纤锌矿型晶体的衬底、其制造方法和半导体器件 The substrate for growing a wurtzite type crystal, and a semiconductor device manufacturing method thereof
12/21/2011CN101710568B 用醋酸镍溶液诱导晶化非晶硅薄膜的方法 Nickel acetate solution induced crystallization of amorphous silicon thin film method
12/21/2011CN101692439B 薄膜晶体管数组基板的制作方法 Making thin film transistor array substrate method
12/21/2011CN101689490B 成膜方法和处理系统 Film-forming method and processing system
12/21/2011CN101683650B 一种清洗晶片容器的方法 A cleaning method for a wafer container
12/21/2011CN101680561B 流体控制装置 Fluid control apparatus
12/21/2011CN101669200B 具有垂直存取装置的存储器 The vertical access device having a memory
12/21/2011CN101654171B 十字吹扫阀和容器组件 Cross purge valve and container components
12/21/2011CN101644902B 基板处理方法与设备及其供液装置 Substrate processing method and apparatus and equipment for liquid
12/21/2011CN101641780B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN101630636B 一种薄半导体晶片清洗干燥装置 Of a thin semiconductor wafer cleaning and drying equipment
12/21/2011CN101587839B 薄膜晶体管的制备方法 The method for preparing a thin film transistor
12/21/2011CN101577301B 白光led的封装方法及使用该方法制作的led器件 White led encapsulation methods and the use of the method of making the led devices
12/21/2011CN101572232B 形成高质量的低温氮化硅层的方法 The method of forming a high quality low temperature silicon nitride layer
12/21/2011CN101572219B 一种腔室状态监控系统、方法以及半导体处理设备 One kind of chamber condition monitoring systems, methods, and semiconductor processing equipment
12/21/2011CN101563760B 利用气体团簇离子束的固体表面平坦化方法及固体表面平坦化设备 A gas cluster ion beam and the solid surface smoothing method of a solid surface smoothing apparatus
12/21/2011CN101556968B 薄膜晶体管和其制造方法以及有机发光二极管显示装置 And a method of manufacturing the thin film transistor and an organic light emitting diode display device
12/21/2011CN101521172B 搬送单元的示教方法及基板处理装置 Transport unit teaching method and substrate processing apparatus
12/21/2011CN101471244B 一种制备稀磁半导体薄膜的方法 A dilute magnetic semiconductor thin films prepared
12/21/2011CN101459100B 紧凑式晶圆自动传输装置 Compact automatic transmission device wafer
12/21/2011CN101436004B 硅片预对准的方法 Method wafer prealignment
12/21/2011CN101431052B 双重图像传感器及其制造方法 Dual image sensor and its manufacturing method
12/21/2011CN101427351B 抛光形成在半导体晶片上的金属层的方法及系统 Method and system for polishing a metal layer formed on a semiconductor wafer
12/21/2011CN101414546B 基板冷却装置 Substrate cooling device
12/21/2011CN101398633B 光刻设备和器件制造方法以及测量系统 A lithographic apparatus and device manufacturing method and a measurement system
12/21/2011CN101395537B 感光性有机膜用显影液组合物 Photosensitive organic film with the developer composition
12/21/2011CN101383349B 静态随机存取存储单元 Static random access memory cell
12/21/2011CN101364572B 薄膜晶体管基板制造方法 The method of manufacturing a thin film transistor substrate
12/21/2011CN101356651B 层叠结构、使用其的电子元件、其制造方法、电子元件阵列和显示单元 Laminated structure, using the same electronic device, manufacturing method, an electronic element array and the display unit
12/21/2011CN101339913B 半导体晶圆的缺陷位置检测方法 Defect position detection method of a semiconductor wafer
12/21/2011CN101322035B 探针卡 Probe Card
12/21/2011CN101313385B 光刻法用洗涤液及使用该洗涤液的曝光装置的洗涤方法 Photolithography and the solution was washed with the washing method using the exposure apparatus of the washing liquid
12/21/2011CN101287777B 包含偶联的电介质层和金属层的半导体器件、其制造方法和用于偶联半导体器件中的电介质层和金属层的材料 The dielectric layer and the metal layer of the semiconductor device comprises coupling, the manufacturing methods and materials used for coupling a semiconductor device in the dielectric layer and the metal layer
12/21/2011CN101239515B 基于植入式纳米线电极的介电可调薄膜及其制备方法 Film and preparation method adjustable dielectric nanowire electrodes implanted on
12/21/2011CN101231508B 采用时间序列分析预测-校正集成电路制造工艺控制方法 Time series analysis and forecasting - Correction IC manufacturing process control methods
12/21/2011CN101221952B 用以保护一内部集成电路的半导体结构及其制造方法 Semiconductor structure and method for protecting an internal integrated circuits
12/21/2011CN101219576B 无线使能装置 Wireless-enabled device
12/21/2011CN101193732B 用于定位和保持切开的衬底块上的薄衬底的装置和方法 Means for positioning and holding a thin substrate and a method of cutting the substrate block of
12/21/2011CN101167165B 增加pecvd氮化硅膜层的压缩应力的方法 Increasing the compressive stress of the silicon nitride film method pecvd
12/21/2011CN101145579B 具有槽沟的源体短路电极的、逆槽沟和源极接地的场效应晶体管结构 Source body having a groove of the short-circuiting electrode, and the inverse grooves source grounded field effect transistor structure
12/21/2011CN101135046B 半导体处理用的成膜方法和装置 The semiconductor processing method and apparatus used in the film forming
12/21/2011CN101127298B 热处理装置和热处理方法 Heat treatment apparatus and heat treatment method
12/21/2011CN101032843B 晶片分割方法 Segmentation wafers
12/21/2011CN101009235B 半导体装置制造方法 The semiconductor device manufacturing method
12/21/2011CN101005062B 使用相互连接的三维层片将垂直封装的mosfet和集成电路功率器件构建成集成模块 The vertical packaged mosfet power devices and integrated circuits to construct a three-dimensional integrated module interconnected layers
12/21/2011CA2709626A1 Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
12/20/2011USRE43036 Filter for extreme ultraviolet lithography
12/20/2011US8082536 Semiconductor integrated circuit manufacturing process evaluation method
12/20/2011US8082119 Method and system for mask fabrication process control
12/20/2011US8082054 Method of optimizing process recipe of substrate processing system
12/20/2011US8081850 Device with tunable plasmon resonance
12/20/2011US8081384 Multilayer reflective film coated substrate, manufacturing method thereof, reflective mask blank, and reflective mask
12/20/2011US8081266 Thin film transistor device, liquid crystal display device using the same, and method of fabricating the same
12/20/2011US8081174 Active matrix organic electroluminescent display device and method of fabricating the same
12/20/2011US8080886 Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
12/20/2011US8080885 Integrated circuit packaging system with multi level contact and method of manufacture thereof
12/20/2011US8080873 Semiconductor device, semiconductor package, and method for testing semiconductor device
12/20/2011US8080863 Semiconductor device and method of manufacturing the same
12/20/2011US8080859 Reducing stress between a substrate and a projecting electrode on the substrate
12/20/2011US8080849 Characterizing films using optical filter pseudo substrate
12/20/2011US8080848 High voltage semiconductor device with lateral series capacitive structure
12/20/2011US8080843 Nonvolatile memory devices and methods of forming the same
12/20/2011US8080836 Embedded semiconductor component
12/20/2011US8080831 Semiconductor device and manufacturing the same
12/20/2011US8080825 Image sensor and method for manufacturing the same
12/20/2011US8080817 Memory cells
12/20/2011US8080816 Silver-selenide/chalcogenide glass stack for resistance variable memory
12/20/2011US8080797 Bolometer and method of producing a bolometer