Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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12/28/2011 | CN102299055A 于蓝宝石衬底表面制作纳米球的方法 Method for the production of sapphire substrate surface nanospheres |
12/28/2011 | CN102299054A 用于薄膜电阻器生产的硬掩膜 For the production of thin-film resistors hard mask |
12/28/2011 | CN102299053A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
12/28/2011 | CN102299052A 晶片的制作方法 Wafer fabrication method |
12/28/2011 | CN102299051A 一种干燥微电子器件的方法及其装置 A dry method and apparatus for microelectronic devices |
12/28/2011 | CN102299050A 一种晶圆位置探测装置 One kind of wafer position detecting means |
12/28/2011 | CN102299049A 花篮式气浮硅片自动分离机构 Automatic Wafer basket flotation separation mechanism |
12/28/2011 | CN102299048A 用于制造半导体器件的装置 Apparatus for manufacturing a semiconductor device |
12/28/2011 | CN102299047A 热处理装置和热处理方法 Heat treatment apparatus and heat treatment method |
12/28/2011 | CN102299046A 基板处理装置 Substrate processing apparatus |
12/28/2011 | CN102299045A 气体分配装置及包括该气体分配装置的基板处理设备 The gas distribution apparatus and a substrate processing apparatus includes a gas distribution means |
12/28/2011 | CN102299044A 工艺控制系统及其实现方法 Process control system and its implementation |
12/28/2011 | CN102299043A 真空处理装置 Vacuum processing apparatus |
12/28/2011 | CN102298265A 共聚物组合物、光刻介电组合物及电气或电子器件 Copolymer composition lithography dielectric compositions and electrical or electronic components |
12/28/2011 | CN102296006A 清洗组合物及用其形成半导体图形的方法 The cleaning composition and method for forming a semiconductor pattern thereof |
12/28/2011 | CN102295894A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
12/28/2011 | CN102295893A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
12/28/2011 | CN102295892A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
12/28/2011 | CN102294793A 用于塑料封装模具的抽真空装置 Means for evacuating the mold plastic package |
12/28/2011 | CN102294648A 化学机械研磨金属的方法 The method of chemical mechanical polishing of metal |
12/28/2011 | CN102294637A 磨削加工工具 Grinding Tools |
12/28/2011 | CN102294526A 一种生产大功率管芯片焊接方法及其装置 A high power transistor chip welding method and apparatus for the production of |
12/28/2011 | CN102064104B Method for manufacturing T-shaped grid of GaN microwave device |
12/28/2011 | CN101969031B 一种用于二极管晶粒封装流程的清洗方法 A process of encapsulating the LED die cleaning method for |
12/28/2011 | CN101963726B Ffs型tft-lcd阵列基板及其制造方法 Ffs type tft-lcd array substrate and manufacturing method |
12/28/2011 | CN101908516B 倒装芯片锡银凸块结构及其制造方法 Silver tin bump flip chip structure and manufacturing method |
12/28/2011 | CN101901755B 适用于快闪存储器的高密度钯纳米晶的制备方法 Preparation method is suitable for high-density flash memory palladium nanocrystals |
12/28/2011 | CN101894854B 具有垂直信道存取晶体管及存储器平面的相变化存储单元 Phase change channel access transistor having a vertical plane of the storage unit and the memory |
12/28/2011 | CN101853776B 具有新型采样策略的高级处理控制 Advanced process control with a new sampling strategy |
12/28/2011 | CN101847641B 阵列基板及其制造方法和宽视角液晶显示器 Array substrate and manufacturing method thereof, and a wide viewing angle liquid crystal display |
12/28/2011 | CN101847640B 阵列基板及其制造方法和液晶面板 The method of manufacturing the array substrate and the liquid crystal panel, |
12/28/2011 | CN101847568B 半导体制造方法与装置 A method of manufacturing a semiconductor device |
12/28/2011 | CN101827514B 键合工具、电子元器件安装装置和电子元器件安装方法 Devices and electronic components mounting method bonding tools, electronic components installed |
12/28/2011 | CN101826550B ABO<sub>3</sub>/TiO<sub>2</sub>/MgO/Ⅲ-V族氮化物半导体异质结构及制备方法 ABO <sub> 3 </ sub> / TiO <sub> 2 </ sub> / MgO / Ⅲ-V nitride semiconductor heterostructures and preparation methods |
12/28/2011 | CN101821844B 用于测量部件介电特性的装置 Means for measuring the dielectric properties of the components |
12/28/2011 | CN101819363B Tft-lcd阵列基板及其制造方法 Tft-lcd array substrate and manufacturing method thereof |
12/28/2011 | CN101819362B Tft-lcd阵列基板制造方法 Tft-lcd array substrate manufacturing method |
12/28/2011 | CN101807587B Tft-lcd阵列基板及其制造方法和液晶显示器 Tft-lcd array substrate and manufacturing method and a liquid crystal display |
12/28/2011 | CN101807514B 液处理装置、液处理方法和存储介质 Liquid processing apparatus and liquid processing method and the storage medium |
12/28/2011 | CN101796622B 半导体元件、其制造方法及实装其的实装构造体 Semiconductor components, its manufacturing method and mounting mounting structure thereof |
12/28/2011 | CN101794775B 在半导体衬底中形成的螺旋电感以及形成该电感的方法 Formed in the semiconductor substrate and the inductance of spiral inductor forming method |
12/28/2011 | CN101789418B 一种多孔超低介电常数材料薄膜及其制备方法 A porous ultra low-k film material and its preparation method |
12/28/2011 | CN101789375B 一种非穿通型绝缘栅双极晶体管薄片背面制作工艺 A non-punch-through on the back of the sheet insulated gate bipolar transistor fabrication process |
12/28/2011 | CN101785103B 低阻抗晶圆穿孔 Low impedance wafer perforation |
12/28/2011 | CN101783352B 一种非易失性存储器及其设计方法 A non-volatile memory and design method |
12/28/2011 | CN101779277B 用于蚀刻设在反射层下方的介电层的方法和设备 Used to etch the reflective layer disposed below a method and apparatus of the dielectric layer |
12/28/2011 | CN101777490B 在晶圆上形成掺杂层的方法 The method of forming a doped layer on the wafer |
12/28/2011 | CN101752385B 具有埋置的选择栅的非易失性存储器单元及其制造方法 Non-volatile memory cell and a manufacturing method of the select gate is buried |
12/28/2011 | CN101752382B 一次性可编程存储器、制造及编程读取方法 One-time programmable memory, manufacturing and programming method of reading |
12/28/2011 | CN101752319B 薄膜晶体管液晶显示器阵列基板的制造方法 The method of manufacturing a thin film transistor array substrate of a liquid crystal display |
12/28/2011 | CN101752218B 基板检查方法、基板检查装置和存储介质 The substrate inspection method, a substrate inspection apparatus and the storage medium |
12/28/2011 | CN101740604B 有源矩阵有机发光二极管像素结构及其制造方法 The active matrix organic light emitting diode pixel structure and manufacturing method |
12/28/2011 | CN101740506B 构图金属栅极的方法 Patterned metal gate approach |
12/28/2011 | CN101738798B 宽视角液晶显示器阵列基板及其制造方法 A wide viewing angle liquid crystal display array substrate and manufacturing method thereof |
12/28/2011 | CN101728399B 薄膜晶体管数组基板及其制造方法 The thin film transistor array substrate and manufacturing method |
12/28/2011 | CN101728299B 薄板夹持装置 Sheet clamping device |
12/28/2011 | CN101728289B 一种面阵封装电子元件的室温超声波软钎焊方法 At room temperature for an area array packaging electronic components ultrasonic soldering method |
12/28/2011 | CN101726695B 一种测试nmos热载流子注入寿命的方法 A test nmos life hot carrier injection method |
12/28/2011 | CN101718950B 薄膜构图方法及制造液晶显示装置的方法 Film patterning method and a method of manufacturing a liquid crystal display device |
12/28/2011 | CN101714556B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
12/28/2011 | CN101710586B 提高开口率的储存电容及其制作方法 Improve storage capacitor and method of making the aperture ratio |
12/28/2011 | CN101710564B 基板处理系统 A substrate processing system |
12/28/2011 | CN101692425B 一种esd保护的设计方法 A protective design method esd |
12/28/2011 | CN101689592B Ⅲ族氮化物半导体发光元件及其制造方法和灯 Ⅲ nitride semiconductor light emitting device and manufacturing method and light |
12/28/2011 | CN101689559B 有机电致发光显示屏及其制造方法 Organic electroluminescent display and method of manufacturing |
12/28/2011 | CN101689487B 重掺杂衬底中的扩散控制 Substrate heavily doped diffusion control |
12/28/2011 | CN101689486B 载置台构造和热处理装置 Stage structure and heat treating apparatus |
12/28/2011 | CN101689477B 用于将粘性材料分配到基板上的方法及设备 For dispensing a viscous material to a method and apparatus on a substrate |
12/28/2011 | CN101688295B 具有分离电极的静电卡盘 Having a separate electrode electrostatic chuck |
12/28/2011 | CN101684547B 铜膜的成膜方法 Copper film deposition method |
12/28/2011 | CN101681881B 半导体装置以及具备该半导体装置的电源和运算处理装置 And a power supply and a semiconductor device comprising an arithmetic processing unit of the semiconductor device |
12/28/2011 | CN101681816B 用于薄膜钝化的双靶溅射系统及用该系统形成薄膜的方法 Passivation film dual target sputtering system and method for forming a film of the system for |
12/28/2011 | CN101673693B 高可靠厚膜混合集成电路键合系统及其制造方法 High reliability thick film hybrid IC bonding system and method for manufacturing |
12/28/2011 | CN101666931B 液晶显示器、薄膜晶体管液晶显示器的阵列基板及其制造方法 The array substrate and manufacturing method of the liquid crystal display, a thin film transistor liquid crystal display |
12/28/2011 | CN101661907B 液晶显示装置的阵列基板制造方法 Array substrate of a liquid crystal display device manufacturing method |
12/28/2011 | CN101661199B 半透过式液晶显示装置的阵列基板制造方法 Array substrate device manufacturing method and a half through the liquid crystal display |
12/28/2011 | CN101652852B 用于传送基底的机械手及其末端执行器 Robot for conveying the substrate and end effector |
12/28/2011 | CN101627470B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
12/28/2011 | CN101621000B 等离子体蚀刻方法 The plasma etching method |
12/28/2011 | CN101620987B 基板清洗装置 Substrate cleaning device |
12/28/2011 | CN101607479B 液体喷出头及其制造方法以及结构体的形成方法 Liquid discharge head and method for forming manufacturing method, and structure |
12/28/2011 | CN101604662B 制造显示单元的方法以及显示单元 The method of manufacturing a display unit and a display unit |
12/28/2011 | CN101604654B 基板支撑装置和等离子体处理设备 Substrate support means and the plasma processing apparatus |
12/28/2011 | CN101578697B 高频封装件 High-frequency package |
12/28/2011 | CN101556918B 提高半导体图形分辨率的方法 Improve semiconductor graphics resolution methods |
12/28/2011 | CN101556898B 一种芯片制造工艺中的挡片回收的检测方法 Detection of a chip manufacturing process blanks recovered |
12/28/2011 | CN101536159B 进行实际流量检验的方法 Actual flow test method |
12/28/2011 | CN101512754B 用来形成纳米结构单层的方法和器件,以及包括该单层的器件 For forming a nanostructure monolayer methods and devices, as well as the single-layer device comprising |
12/28/2011 | CN101496147B 热处理方法 Heat treatment method |
12/28/2011 | CN101495673B Cvd成膜方法和cvd成膜装置 Cvd cvd film formation method and film forming apparatus |
12/28/2011 | CN101471266B 半导体器件的制造方法 The method of manufacturing a semiconductor device |
12/28/2011 | CN101461063B 基板检查及修正装置、以及基板评估系统 Board inspection and correction device, as well as board evaluation system |
12/28/2011 | CN101457047B 导体图案形成用墨水、导体图案以及配线基板 Conductor pattern forming ink, and a wiring substrate conductor pattern |
12/28/2011 | CN101419918B 制造印刷电路板的方法以及通过该方法制造的印刷电路板 The method of manufacturing a printed circuit board and by the method of manufacturing the printed circuit board |
12/28/2011 | CN101419375B 电泳显示器件及其制造方法 Electrophoretic display device and manufacturing method thereof |
12/28/2011 | CN101401194B 使用低能量等离子体系统制造高介电常数晶体管栅极的方法和装置 The method and apparatus using a low energy plasma system for producing high dielectric constant gate of the transistor |
12/28/2011 | CN101400470B 热动卡盘及用于制造热动卡盘的方法 Thermal chuck and method of manufacturing the thermal chuck for |
12/28/2011 | CN101399248B 配线基板及其制造的方法 And a method of manufacturing the wiring substrate |
12/28/2011 | CN101399246B 覆晶封装基板结构及其制法 Flip chip package substrate structure Jiqizhifa |
12/28/2011 | CN101390199B 无定形碳膜的成膜方法和使用其的半导体装置的制造方法 Amorphous carbon film deposition method and a method of manufacturing a semiconductor device using the same |