Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/21/2011CN102292407A 电子零件用胶粘剂 Electronic Components Adhesives
12/21/2011CN102292342A 芳香族化合物及其制造方法 Aromatic compound and its manufacturing method
12/21/2011CN102290528A 存储装置及其制造方法 Storage device and manufacturing method thereof
12/21/2011CN102290509A 一种低缺陷高亮度的衬底结构体,制备方法及其用途 A low defect high luminance substrate structure, preparation and use thereof
12/21/2011CN102290488A 一种多晶硅厚膜的制备方法 One kind of polycrystalline silicon thick film preparation
12/21/2011CN102290486A 用于加载或卸载基板的基板处理装置 Substrate processing apparatus for loading or unloading of the substrate
12/21/2011CN102290447A 柱状钻石萧基二极管及其制作方法 Xiao diamond columnar base diode and manufacturing method thereof
12/21/2011CN102290446A 半导体设备及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290445A 晶体管组件及其制造方法 Transistor elements and a manufacturing method
12/21/2011CN102290442A 薄膜晶体管和显示装置 A thin film transistor and a display device
12/21/2011CN102290441A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290440A 晶体管及其制造方法 Transistor and manufacturing method thereof
12/21/2011CN102290437A Vdmos晶体管结构及其形成方法 Vdmos transistor structure and method of forming
12/21/2011CN102290436A 新型绝缘栅双极晶体管背面结构及其制备方法 New insulated gate bipolar transistor on the back of the structure and preparation method
12/21/2011CN102290435A 一种大面积完美量子点及其阵列制造方法 One kind of perfect quantum dots and a large area array manufacturing method
12/21/2011CN102290434A 带栅下缓冲层结构的金属半导体场效应晶体管及制作方法 Metal-semiconductor field-effect transistors and production methods with a buffer layer under the gate structure
12/21/2011CN102290431A 平板显示装置及其制造方法与母基底及其制造方法 Flat panel display device and manufacturing method of the master substrate and manufacturing method thereof
12/21/2011CN102290425A 具有三维层叠结构的半导体器件的制造方法 Method of manufacturing a semiconductor device having a three-dimensional stacked structure
12/21/2011CN102290422A 显示装置及其制造方法、剥离方法及发光装置的制造方法 Device manufacturing method and a manufacturing method of peeling the light emitting display device and a method
12/21/2011CN102290421A 平板显示装置和制造该平板显示装置的方法 The method of manufacturing the flat panel display device and a flat panel display device
12/21/2011CN102290420A 垂直半导体器件及其制造方法 Vertical semiconductor device and manufacturing method thereof
12/21/2011CN102290415A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290413A 阵列基板及其制造方法和液晶显示器 Array substrate and manufacturing method thereof, and a liquid crystal display
12/21/2011CN102290411A 一种抗光干扰红外线接收模组及其制造方法 An anti-light interference infrared receiver module and manufacturing method
12/21/2011CN102290404A 半导体芯片封装及其制造方法 The semiconductor chip package and method of manufacturing
12/21/2011CN102290403A 模块基板、具有该基板的半导体模块及其制造方法 Module substrate, comprising a semiconductor module and a manufacturing method of the substrate
12/21/2011CN102290399A 堆叠式芯片封装结构及方法 Stacked chip packaging structure and method
12/21/2011CN102290398A 储存电容架构及其制造方法与像素结构 Storage capacitor structure and method of manufacturing the pixel structure
12/21/2011CN102290394A Heat radiating electronic package structure and method of manufacturing the same
12/21/2011CN102290393A 具有导线架的集成电路封装系统及其制造方法 System and method for manufacturing an integrated circuit package having a lead frame
12/21/2011CN102290392A 具有导电扩散区的半导体芯片、其制造方法以及堆叠封装 A semiconductor chip having a conductive diffusion region, its manufacturing method, and the stacked package
12/21/2011CN102290391A 半导体器件及其制造方法和制造装置 Semiconductor device and manufacturing method and apparatus
12/21/2011CN102290388A 电控设备、热管散热器及其制作方法 Electronic control equipment, heat pipe radiator and its production method
12/21/2011CN102290386A 锁定装置和用于制造锁定装置的方法 Locking means locking apparatus and a method for producing
12/21/2011CN102290384A Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
12/21/2011CN102290380A 玻璃保护式二极管及其制法 Glass protection diode Jiqizhifa
12/21/2011CN102290379A 半导体结构及半导体装置的制造方法 The method of manufacturing a semiconductor structure and a semiconductor device
12/21/2011CN102290378A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290377A Soi cmos射频开关及其形成方法，及采用其的器件 Soi cmos RF switch and method for forming and using their devices
12/21/2011CN102290376A 半导体集成器件形成方法 A method of forming a semiconductor integrated device
12/21/2011CN102290375A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290374A 制造集成电路装置的方法 The method of manufacturing an integrated circuit device
12/21/2011CN102290373A 芯片焊接器、拾取方法以及拾取装置 Chip welders, picking methods and pickup
12/21/2011CN102290372A 半导体器件制造方法以及半导体器件制造设备 The semiconductor device manufacturing method and semiconductor device manufacturing apparatus
12/21/2011CN102290371A 接触孔制备过程中光阻的去除方法 Preparation of the contact hole during photoresist removal method
12/21/2011CN102290370A 导电插塞的制作方法 Conductive plug production methods
12/21/2011CN102290369A 一种薄goi晶片及其制备方法 A thin, wafer and preparation method goi
12/21/2011CN102290368A 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/21/2011CN102290367A 从载体基底中移去可逆向安装的器件晶片的方法和装置 The carrier substrate is removed from the device wafer mounted reversible method and apparatus
12/21/2011CN102290366A Support structure and processing apparatus
12/21/2011CN102290365A 基板保持装置、具备其之曝光装置及方法、元件制造方法 Substrate holding apparatus, which includes the exposure apparatus and method, device manufacturing method
12/21/2011CN102290364A 基板保持装置、具备其之曝光装置、元件制造方法 Substrate holding apparatus, which includes the exposure apparatus, device manufacturing method
12/21/2011CN102290363A Apparatus for driving placing table
12/21/2011CN102290362A 一种激光加工中晶圆片定位误差的校正方法 Correction method for laser processing wafer positioning error
12/21/2011CN102290361A 一种适用于三维集成技术的模版对准方法 A suitable method for three-dimensional integrated stencil alignment techniques
12/21/2011CN102290360A 一种t轴旋转限位结构 One kind of t-axis rotation limit structure
12/21/2011CN102290359A 支承体构造、处理容器构造及处理装置 A support structure, structure and process container handling equipment
12/21/2011CN102290358A 四方扁平无引脚封装体及其制造方法 Quad flat no-lead package and manufacturing method thereof
12/21/2011CN102290357A 键合封装及其方法 Bond package and method
12/21/2011CN102290356A 一种适用于bga芯片贴片焊接后进行封装保护的方法 A suitable package to protect a patch after soldering bga chip method
12/21/2011CN102290355A 一种用于集成电路封装模具的排出装置 An integrated circuit package discharge means for the mold
12/21/2011CN102290354A 新型ic封装制造工艺 The new ic package manufacturing process
12/21/2011CN102290353A 一种可控硅芯片与钼片的烧结模具及其使用方法 A sintered mold and method of use chip and molybdenum SCR
12/21/2011CN102290352A 一种mos晶体管局部应力的引入技术 One kind of local stresses introduced mos transistor technology
12/21/2011CN102290351A 半导体器件制造方法 The semiconductor device manufacturing method
12/21/2011CN102290350A 利用cmp技术的具有平坦表面的沟槽mos势垒肖特基整流器 Cmp technology use has a flat surface trench mos Schottky barrier rectifiers
12/21/2011CN102290349A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/21/2011CN102290348A 半导体光刻方法 Semiconductor lithography method
12/21/2011CN102290347A 一种刻蚀系统 One kind of etching system
12/21/2011CN102290346A 平坦化基底的方法 Flattening the substrate method
12/21/2011CN102290345A 深亚微米栅长AlGaN/GaN HEMT制作方法 Deep sub-micron gate length AlGaN / GaN HEMT production methods
12/21/2011CN102290344A 沟槽式mos管制作工艺 Grooved mos tube production process
12/21/2011CN102290343A Trench gate manufacturing method for power device
12/21/2011CN102290342A 一种采用六边形束斑的激光扫描退火方法 One kind of using hexagonal beam spot scanning laser annealing method
12/21/2011CN102290341A 离子植入方法 The ion implantation method
12/21/2011CN102290340A 一种改变静电保护器件触发电压的方法及装置 An altered trigger voltage electrostatic protection device method and apparatus
12/21/2011CN102290339A 铜铟镓硒靶材连续溅射制备cigs太阳电池吸收层的新工艺 CIGS sputtering target cigs solar cell absorbs the continuous production of new technology layer
12/21/2011CN102290338A 透明导电薄膜的常温大面积沉积生产工艺 A large area of ​​the production process at room temperature deposition of transparent conductive films
12/21/2011CN102290337A 低压tvs用硅外延片的制造方法 Low tvs method of manufacturing silicon wafer
12/21/2011CN102290336A 一种薄膜、图案层及其制造方法 A thin film, the pattern layer and manufacturing method thereof
12/21/2011CN102290335A 使硅层结晶的方法和制造薄膜晶体管的方法 Crystalline silicon layer and a method of manufacturing a thin film transistor
12/21/2011CN102290334A 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/21/2011CN102290333A 一种适用于石墨烯基器件的栅氧介质的形成方法 A method suitable for forming graphene-based devices of gate oxide dielectric
12/21/2011CN102290332A 一种制备高密度硅纳米孔阵列的方法 A method of high-density silicon nanopore arrays prepared
12/21/2011CN102290331A 基板清洗装置 Substrate cleaning device
12/21/2011CN102290330A 一种电容结构的形成方法 A method of forming a capacitor structure
12/21/2011CN102290329A 形成具有lc滤波器和ipd滤波器的rf fem的半导体器件和方法 Ipd form a lc filter and filter rf fem semiconductor device and method
12/21/2011CN102290328A 干蚀刻装置 Dry etching apparatus
12/21/2011CN102290327A 基板处理装置 Substrate processing apparatus
12/21/2011CN102290326A 盖体保持夹具 The lid holding jig
12/21/2011CN102290325A 金属硅化物的清洗方法 The method of cleaning metal silicide
12/21/2011CN102289546A 一种电路辐照性能仿真方法及设备 A circuit simulation method and apparatus radiation performance
12/21/2011CN102289120A Tft阵列基板、液晶显示面板及配线修补方法 Patch panel and wiring method Tft array substrate, a liquid crystal display
12/21/2011CN102289115A 母板及tft阵列基板的制造方法 The method of manufacturing the array substrate motherboard and tft
12/21/2011CN102287851A 炉管点火方法 Tube ignition method
12/21/2011CN102286760A 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 Electrochemical filled with a metal of high aspect ratio features large recessed methods aqueous solution plating tank, plating equipment and systems
12/21/2011CN102286728A 基板处理装置及基板处理方法 Substrate processing apparatus and substrate processing method
12/21/2011CN102284427A 模块集成电路分选机及模块集成电路分选机的上载方法 Upload method sorter module IC and module IC sorter
12/21/2011CN102005430B Double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly
12/21/2011CN101976683B 一种绝缘栅双极型晶体管及其制造方法 An insulated gate bipolar transistor and its manufacturing method
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