H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/28/2011	CN102300809A 用于测量硅沉积反应器中硅棒的温度和生长厚度的设备和方法 Measuring the silicon deposition reactor apparatus and method of the silicon rod for temperature and growth thickness
12/28/2011	CN102300801A 接合式微机电组件 Joining micro-electromechanical components
12/28/2011	CN102300796A 柔性基板位置控制设备 Flexible substrate position control apparatus
12/28/2011	CN102300706A 包括高长宽比分子结构的结构和制造方法 Including the structure and manufacturing method of the molecular structure of high aspect ratio
12/28/2011	CN102300688A 基板分断装置 Substrate cutting device
12/28/2011	CN102300644A 涂敷装置 The coating apparatus
12/28/2011	CN102300419A Welding method of coaxial diode and circuit board
12/28/2011	CN102300397A Metal matrix circuit board and manufacturing method thereof
12/28/2011	CN102299220A 直驱式固晶机的摆臂机构 Bonder direct-drive swing arm mechanism
12/28/2011	CN102299184A Mim电容器及其制造方法 Mim capacitor and manufacturing method
12/28/2011	CN102299183A Jfet晶体管及其形成方法 Jfet transistor and method of forming
12/28/2011	CN102299182A 薄膜晶体管及其制造方法 A thin film transistor and manufacturing method thereof
12/28/2011	CN102299181A Mos晶体管及其制造方法 Mos transistor and manufacturing method thereof
12/28/2011	CN102299180A 包含单元区和具有高击穿电压结构的外围区的半导体器件 The semiconductor device includes a cell region and a high breakdown voltage structure of the peripheral region
12/28/2011	CN102299178A 一种半导体结构及其制备方法 A semiconductor structure and method of preparation
12/28/2011	CN102299177A 一种接触的制造方法以及具有该接触的半导体器件 A method of manufacturing a semiconductor device having a contact and the contact
12/28/2011	CN102299175A InAlN/GaN异质结有源区的埋层结构和激活方法 InAlN / GaN heterostructure buried layer structure and method of activation of the active region
12/28/2011	CN102299171A 与cmos工艺兼容的硅纳米线器件及其制作方法 Silicon nanowire devices compatible with cmos technology and production methods
12/28/2011	CN102299160A 影像感测元件及其制造方法 Image sensing device and manufacturing method
12/28/2011	CN102299157A 分栅式闪存及其制造方法 Sub-gate type flash memory and manufacturing method thereof
12/28/2011	CN102299156A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
12/28/2011	CN102299155A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
12/28/2011	CN102299154A 半导体结构及其制作方法 The semiconductor structure and method of making
12/28/2011	CN102299153A 具有低栅极输入电阻的功率半导体组件及其制作方法 Power semiconductor components and their production methods with low gate input resistance
12/28/2011	CN102299152A 双导通半导体组件及其制作方法 Double conducting semiconductor components and production methods
12/28/2011	CN102299151A 具有异质结双极晶体管和场效应晶体管的半导体器件 A semiconductor device having a heterojunction bipolar transistors and field-effect transistors
12/28/2011	CN102299150A 具有可调输出电容值的功率半导体组件以及制作方法 With adjustable output capacitance value of the power semiconductor components, and production methods
12/28/2011	CN102299149A 半导体电感器件及其制造方法 Semiconductor device and manufacturing method thereof inductor
12/28/2011	CN102299142A 具有天线的封装结构及其制作方法 Package structure and a method of preparing an antenna
12/28/2011	CN102299140A Package for a wireless enabled integrated circuit
12/28/2011	CN102299138A 金铁合金互联线及其制作方法 Ferroalloys interconnection lines and production methods
12/28/2011	CN102299137A Semiconductor device and method of fabricating the same
12/28/2011	CN102299136A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/28/2011	CN102299135A 半导体结构 Semiconductor structure
12/28/2011	CN102299133A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
12/28/2011	CN102299130A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/28/2011	CN102299127A 用于封装元件的双向散热器及其组装方法 Bidirectional radiator assembly and method for encapsulating components
12/28/2011	CN102299126A 散热基底以及制造该散热基底的方法 Cooling the substrate and a method of manufacturing the heat dissipation substrate
12/28/2011	CN102299124A 树脂密封型电子控制装置及其制造方法 Apparatus and method for manufacturing a resin sealed type electronic control
12/28/2011	CN102299117A 具有冷却机制的半导体模块及其生产方法 Semiconductor module and production method having a cooling mechanism
12/28/2011	CN102299115A 具有包含势垒金属的凸块组合件的晶片级封装(wlp)装置 Having a barrier metal comprising a bump wafer-level package assembly (wlp) means
12/28/2011	CN102299114A 集成电路组装方法 IC assembly method
12/28/2011	CN102299113A 减小半导体器件热载流子注入损伤的制造方法 Semiconductor devices reduce hot carrier injection method of producing injury
12/28/2011	CN102299112A 制作沟槽和浅沟槽隔离结构的方法 Production methods and shallow trench isolation trench structure
12/28/2011	CN102299111A 制作互补型金属氧化物半导体器件结构的方法 The method of making a complementary metal oxide semiconductor device structure
12/28/2011	CN102299110A 一种半导体器件的形成方法及其半导体器件 The method for forming a semiconductor device and a semiconductor device
12/28/2011	CN102299109A 半导体功率组件与其制作方法 Semiconductor power component and its manufacturing method
12/28/2011	CN102299108A 重叠沟槽式栅极半导体组件及其制作方法 Overlapping trench-gate semiconductor components and production methods
12/28/2011	CN102299107A 相变存储器存储单元底电极的制作方法 The method of making a memory cell of the bottom electrode of the phase change
12/28/2011	CN102299106A 相变存储器存储单元及其制作方法 Memory cell and method of making the phase transition
12/28/2011	CN102299105A 蓝宝石晶片的分割方法 Segmentation sapphire wafer
12/28/2011	CN102299104A Tft阵列基板的制作方法及tft阵列基板 Production Method Tft array substrate and the array substrate tft
12/28/2011	CN102299103A 制作半导体组件的方法 The method of manufacturing a semiconductor component
12/28/2011	CN102299102A 具备漏极电压保护的功率半导体组件及其制作方法 Drain voltage protection with power semiconductor components and production methods
12/28/2011	CN102299101A 刻蚀终止层的制作方法 The method of making the etch stop layer
12/28/2011	CN102299100A 接触孔的制作方法 The method of making a contact hole
12/28/2011	CN102299099A 半导体结构的形成方法及半导体结构 The method of forming a semiconductor structure and semiconductor structure
12/28/2011	CN102299098A 接触孔结构形成方法 The method for forming a contact hole structure
12/28/2011	CN102299097A 一种金属连线刻蚀方法 Metal wiring etching method
12/28/2011	CN102299096A 半导体器件的接触的制造方法及具有该接触的半导体器件 The method of manufacturing a semiconductor device of the contact and the contact of a semiconductor device having
12/28/2011	CN102299095A 层间介质层、具有该介质层的半导体器件及制造方法 An interlayer dielectric layer, a semiconductor device and manufacturing method of the dielectric layer
12/28/2011	CN102299094A 熔丝结构的制作方法 The method of making fuse structure
12/28/2011	CN102299093A 制备带有绝缘埋层的半导体衬底的方法以及半导体衬底 The method of preparing a semiconductor substrate with a buried insulating layer and the semiconductor substrate
12/28/2011	CN102299092A 一种半导体器件及其形成方法 A semiconductor device and method of forming
12/28/2011	CN102299091A 等离子体处理装置、基板保持机构和位置偏移检测方法 Plasma processing apparatus, the substrate holding mechanism and the position displacement detection method
12/28/2011	CN102299090A 顶针及具有该顶针的等离子体刻蚀装置 Thimble and plasma etching apparatus having the thimble
12/28/2011	CN102299089A 一种邦定平台 One kind of bonding platform
12/28/2011	CN102299088A Insertion piece for testing separator and device for operating the insertion piece
12/28/2011	CN102299087A 晶圆凸点检测装置 Wafer bumping detection device
12/28/2011	CN102299086A 半导体封装件及其制造方法和系统 Semiconductor package and its manufacturing method and system
12/28/2011	CN102299085A Packaged semiconductor device having improved locking properties
12/28/2011	CN102299084A 一种塑封模具及其中的上引线条和下引线条 One kind of plastic molds and the lead lines and lower access lines
12/28/2011	CN102299083A 薄半导体封装及其制造方法 A thin semiconductor package and its manufacturing method
12/28/2011	CN102299082A 半导体承载元件的制造方法及应用其的封装件的制造方法 Semiconductor device and manufacturing method of carrying application method of producing a package of its
12/28/2011	CN102299081A 一种封装基板制造方法及封装基板 A package board manufacturing method and package substrate
12/28/2011	CN102299080A 一种基板及其加工方法 A substrate processing method and
12/28/2011	CN102299079A 制造具有散热器和半导体芯片的树脂模制装配件的半导体模块的方法 The method of manufacturing a semiconductor chip having a heat sink and a resin molded assembly of the semiconductor module
12/28/2011	CN102299078A 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/28/2011	CN102299077A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
12/28/2011	CN102299076A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/28/2011	CN102299075A 制作半导体器件结构的方法 The method of fabricating a semiconductor device structure
12/28/2011	CN102299074A 一种半导体器件及其形成方法 A semiconductor device and method of forming
12/28/2011	CN102299073A Vdmos器件及其制作方法 Vdmos device and manufacturing method thereof
12/28/2011	CN102299072A 沟槽型超级结器件的制作方法及得到的器件 Trench method of making super junction devices and the resulting device
12/28/2011	CN102299071A 一种提高AlGaN/GaN HEMT频率特性的方法 Method for improving AlGaN / GaN HEMT frequency characteristic of a
12/28/2011	CN102299070A 横向pnp晶体管的制造方法 Lateral pnp transistor manufacturing method
12/28/2011	CN102299069A 制造垂直pin型二极管的方法及垂直pin型二极管 The method of fabricating a vertical pin diodes and vertical pin diode
12/28/2011	CN102299068A 基板处理方法 Substrate processing method
12/28/2011	CN102299067A Substrate processing method and substrate processing apparatus
12/28/2011	CN102299066A InAlN材料的酸碱交替选择湿法腐蚀方法 PH InAlN material alternating wet etching method selection
12/28/2011	CN102299065A 晶片的加工方法 Wafer processing method
12/28/2011	CN102299064A 栅结构氧化的方法 Gate structure oxidation method
12/28/2011	CN102299063A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/28/2011	CN102299062A 制造半导体器件栅极侧墙的方法 Manufacturing method of semiconductor device gate sidewall
12/28/2011	CN102299061A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/28/2011	CN102299060A 连续扩散处理装置 Continuous diffusion processing means
12/28/2011	CN102299059A 连续扩散处理装置 Continuous diffusion processing means
12/28/2011	CN102299058A 通过多级异质结构纳米材料构筑微电子器件的方法 Through a multi-level heterogeneous structure of nanomaterials method to build microelectronic devices
12/28/2011	CN102299057A 半导体器件精细图案的制作方法 The method of making a fine pattern of a semiconductor device
12/28/2011	CN102299056A 一种三族氮化物量子点结构的制备方法 Preparation of a Group III nitride quantum dot structures

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