H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/22/2011	US20110312171 Methods Of Forming Integrated Circuitry Comprising Charge Storage Transistors
12/22/2011	US20110312170 Semiconductor device and fabrication mehtod of the semiconductor device
12/22/2011	US20110312169 Anti-fuse memory cell
12/22/2011	US20110312168 Formation of shallow junctions by diffusion from a dielectric doped by cluster or molecular ion beams
12/22/2011	US20110312167 Plasma processing apparatus, and deposition method an etching method using the plasma processing apparatus
12/22/2011	US20110312166 Methods of Manufacturing Power Semiconductor Devices with Shield and Gate Contacts
12/22/2011	US20110312165 Method for manufacturing semiconductor device
12/22/2011	US20110312164 Forming an electrode having reduced corrosion and water decomposition on surface using a custom oxide layer
12/22/2011	US20110312163 Large Area Nanoenabled Macroelectronic Substrates and Uses Therefor
12/22/2011	US20110312162 chemical vapour deposition system and process
12/22/2011	US20110312161 Method for manufacturing silicon carbide semiconductor device
12/22/2011	US20110312160 Liquid precursor for deposition of copper selenide and method of preparing the same
12/22/2011	US20110312159 Methods of Fabricating Nitride Semiconductor Structures with Interlayer Structures
12/22/2011	US20110312158 Method and apparatus for dividing thin film device into separate cells
12/22/2011	US20110312157 Wafer dicing using femtosecond-based laser and plasma etch
12/22/2011	US20110312156 Controlled temperature implantation
12/22/2011	US20110312155 Nonvolatile semiconductor memory device and method of fabricating the same
12/22/2011	US20110312154 Semiconductor device and method for manufacturing the same
12/22/2011	US20110312153 Method of making a floating gate non-volatile mos semiconductor memory device with improved capacitive coupling and device thus obtained
12/22/2011	US20110312152 Methods of Fabricating Integrated Circuit Devices Using Selective Etching Techniques that Account for Etching Distance Variations
12/22/2011	US20110312151 Pillar structure for memory device and method
12/22/2011	US20110312149 Phase change memory device and method for manufacturing the same
12/22/2011	US20110312148 Chemical vapor deposition of ruthenium films containing oxygen or carbon
12/22/2011	US20110312147 Transistor structure with a sidewall-defined intrinsic base to extrinsic base link-up region and method of forming the transistor
12/22/2011	US20110312146 Bipolar device having buried contacts
12/22/2011	US20110312145 Source and drain feature profile for improving device performance and method of manufacturing same
12/22/2011	US20110312144 Novel method to enhance channel stress in cmos processes
12/22/2011	US20110312143 Strain-compensated field effect transistor and associated method of forming the transistor
12/22/2011	US20110312142 Semiconductor device and semiconductor device manufacturing method
12/22/2011	US20110312141 Semiconductor device fabrication method including hard mask and sacrificial spacer elements
12/22/2011	US20110312140 Multiple-gate transistors and processes of making same
12/22/2011	US20110312139 Semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area and method for manufacturing the same
12/22/2011	US20110312138 Methods of Manufacturing Power Semiconductor Devices with Trenched Shielded Split Gate Transistor
12/22/2011	US20110312137 Vertical Power MOSFET and IGBT Fabrication Process with Two Fewer Photomasks
12/22/2011	US20110312136 STRUCTURE AND METHOD FOR COMPACT LONG-CHANNEL FETs
12/22/2011	US20110312135 Method of forming a polycrystalline silicon layer and method of manufacturing thin film transistor
12/22/2011	US20110312134 Manufacturing method for semiconductor devices
12/22/2011	US20110312133 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
12/22/2011	US20110312132 Method for positioning chips during the production of a reconstituted wafer
12/22/2011	US20110312131 Forming A Semiconductor Package Including A Thermal Interface Material
12/22/2011	US20110312130 Stacked package and method of manufacturing the same
12/22/2011	US20110312129 Interconnection in multi-chip with interposers and bridges
12/22/2011	US20110312128 Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
12/22/2011	US20110312127 Method for manufacturing semiconductor device
12/22/2011	US20110312126 Method fabricating a phase-change semiconductor memory device
12/22/2011	US20110312118 Semiconductor device and method for manufacturing the same
12/22/2011	US20110312115 Laser machining method and method for manufacturing compound semiconductor light-emitting element
12/22/2011	US20110312111 Semiconductor device and manufacturing method thereof
12/22/2011	US20110312108 Semiconductor device and fabrication method therefor
12/22/2011	US20110312107 Method and device for measuring temperature during deposition of semiconductor
12/22/2011	US20110312106 Method for preparing a light-emitting device using gas cluster ion beam processing
12/22/2011	US20110311828 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crysal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes
12/22/2011	US20110311340 Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program
12/22/2011	US20110311339 Substrate processing apparatus and method of manufacturing semiconductor device
12/22/2011	US20110311276 Method for transferring functional regions, led array, led printer head, and led printer
12/22/2011	US20110311081 Mems microphone and manufacturing method thereof
12/22/2011	US20110310920 Epitaxial growth of in-plane nanowires and nanowire devices
12/22/2011	US20110310524 Wafer chuck for euv lithography
12/22/2011	US20110310323 Thin film transistor substrate, liquid crystal display having the same, and method of manufacturing the same
12/22/2011	US20110310322 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes
12/22/2011	US20110310229 Profile measuring device, profile measuring method, and method of manufacturing semiconductor package
12/22/2011	US20110309892 Semiconductor Device and Method of Integrating Balun and RF Coupler on a Common Substrate
12/22/2011	US20110309876 Thin film transistor and display device
12/22/2011	US20110309717 Two-dimensional comb-drive actuator and manufacturing method thereof
12/22/2011	US20110309532 Semiconductor structure with alignment control mask
12/22/2011	US20110309531 Molded beam for optoelectronic sensor chip substrate
12/22/2011	US20110309530 Integrated circuit packaging system with leadframe and method of manufacture thereof
12/22/2011	US20110309529 Module substrate that allows replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
12/22/2011	US20110309528 Electronic Modules and Methods for Forming the Same
12/22/2011	US20110309527 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
12/22/2011	US20110309524 Semiconductor device and method of forming metal line of semiconductor device
12/22/2011	US20110309520 Semiconductor device and manufacturing method of the device
12/22/2011	US20110309517 Semiconductor device and method of manufacturing the same
12/22/2011	US20110309516 Semiconductor package and method for making the same
12/22/2011	US20110309514 Packaged semiconductor device having improved locking properties
12/22/2011	US20110309513 Buried thermally conductive layers for heat extraction and shielding
12/22/2011	US20110309511 METHOD FOR PRODUCING LOW-k FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME
12/22/2011	US20110309510 Array substrate, display device having the same and method of manufacturing the same
12/22/2011	US20110309509 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same
12/22/2011	US20110309508 Method and Structure of Forming Silicide and Diffusion Barrier Layer With Direct Deposited Film on Silicon
12/22/2011	US20110309507 Methodology for evaluation of electrical characteristics of carbon nanotubes
12/22/2011	US20110309505 Semiconductor device and method for fabricating the same
12/22/2011	US20110309503 Semiconductor device and manufacturing method thereof
12/22/2011	US20110309502 Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
12/22/2011	US20110309500 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
12/22/2011	US20110309493 Electronic Device Package Locking System and Method
12/22/2011	US20110309492 Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
12/22/2011	US20110309491 Tungsten stiffener for flexible substrate assembly
12/22/2011	US20110309490 Plasma Treatment for Semiconductor Devices
12/22/2011	US20110309489 Method for forming a doped region in a semiconductor layer of a substrate and use of such method
12/22/2011	US20110309488 Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage
12/22/2011	US20110309487 Semiconductor device, a method of manufacturing the same and an electronic device
12/22/2011	US20110309486 Method of Etching and Singulating a Cap Wafer
12/22/2011	US20110309484 Lead frame, method of manufacturing the same, and semiconductor package using the same
12/22/2011	US20110309482 Finger sensor including encapsulating layer over sensing area and related methods
12/22/2011	US20110309481 Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
12/22/2011	US20110309480 Process for manufacturing power integrated devices having surface corrugations, and power integrated device having surface corrugations
12/22/2011	US20110309479 Plasma Dicing and Semiconductor Devices Formed Thereof
12/22/2011	US20110309478 Semiconductor wafer pre-process annealing and gettering method and system for solar cell formation
12/22/2011	US20110309476 Semiconductor device and method of manufacturing the same

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