| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 08/09/2006 | CN1268790C Copper electroplating method, phosphorus-copper anode for copper electroplating, and semiconductor wafer with minimal particle adhesion plated by using them |
| 08/09/2006 | CN1268789C Technique method for electroplating inner surfaces of gear wheel holes and dedicated equipments |
| 08/09/2006 | CN1268470C Method and apparatus for plating and polishing a semiconductor substrate |
| 08/08/2006 | US7087315 Method for forming plating film |
| 08/08/2006 | US7087144 Contact ring with embedded flexible contacts |
| 08/08/2006 | US7087143 Plating system for semiconductor materials |
| 08/08/2006 | US7087117 Substrate processing apparatus and substrate processing method |
| 08/08/2006 | US7086149 Method of making a contact structure with a distinctly formed tip structure |
| 08/03/2006 | WO2006080148A1 Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom |
| 08/02/2006 | EP1685280A2 Apparatus for electroless deposition |
| 08/02/2006 | CN1267586C Hollow ball for barrel plating |
| 08/01/2006 | US7083706 For filling copper in interconnection recesses of a semiconductor |
| 08/01/2006 | US7082682 Contact structures and methods for making same |
| 07/27/2006 | US20060165973 Process equipment wear surfaces of extended resistance and methods for their manufacture |
| 07/27/2006 | US20060163077 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 07/27/2006 | US20060163076 Method and apparatus for electrochemical plating semiconductor wafers |
| 07/27/2006 | US20060163075 Method and apparatus for downhole pipe or casing repair |
| 07/27/2006 | DE10319135B4 Verfahren zum Elektroplattieren von Kupfer über einer strukturierten dielektrischen Schicht, um die Prozess-Gleichförmigkeit eines nachfolgenden CMP-Prozesses zu verbessern A method for electroplating copper on a patterned dielectric layer in order to improve process uniformity of a subsequent CMP process |
| 07/27/2006 | DE102005010095A1 Low magnetic loss metal tape used as substrate for manufacturing, e.g. coated conductor, includes non-magnetic metal layer deposited on nickel layer |
| 07/26/2006 | CN1807699A Wafer electroplating apparatus for improving process uniformity |
| 07/20/2006 | DE19724059B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards |
| 07/19/2006 | EP1681376A1 Plating layer for a sliding portion and a method for forming the same |
| 07/19/2006 | EP1680536A2 Support for workpiece to be electrolytically coated |
| 07/19/2006 | EP1680535A2 Electroplating compositions and methods for electroplating |
| 07/19/2006 | EP1680534A1 Support layer for thin copper foil |
| 07/19/2006 | CN1804147A Electroplating device with real-time feedback system |
| 07/19/2006 | CN1804146A 电镀装置及电镀方法 Plating apparatus and plating method |
| 07/19/2006 | CN1804141A Method for producing plated molded button of mobile phone |
| 07/19/2006 | CN1804140A Method for producing mobile phone button |
| 07/19/2006 | CN1265686C Flexible printed circuit board |
| 07/19/2006 | CN1265450C Thin film bearing belt for assembling electronic parts |
| 07/19/2006 | CN1265425C Substrate processing apparatus |
| 07/18/2006 | US7078340 Metal deposit process |
| 07/13/2006 | US20060151330 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 07/13/2006 | US20060151328 Method of electroplating a workpiece having high-aspect ratio holes |
| 07/13/2006 | US20060151317 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| 07/13/2006 | US20060150435 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 07/12/2006 | EP1678352A2 Method and apparatus for fluid processing a workpiece |
| 07/12/2006 | CN1800668A Composite material for sliding bearing and preparation method thereof |
| 07/12/2006 | CN1263898C Composite copper foil and manufacturing method thereof |
| 07/11/2006 | US7074514 Separator of fuel cell and method for producing same |
| 07/11/2006 | US7074315 For depositing copper coating onto surface of a printed circuit board |
| 07/11/2006 | US7074246 Modular semiconductor workpiece processing tool |
| 07/06/2006 | WO2006047500A9 Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
| 07/06/2006 | WO2006047500A2 Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
| 07/06/2006 | WO2005048375A3 Low contact resistance bonding method for bipolar plates in a pem fuel cell |
| 07/06/2006 | US20060147802 Anode for nonaqueous secondary battery, process of producing the anode, and nonaqueous secondary battery |
| 07/06/2006 | US20060147742 Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil |
| 07/06/2006 | US20060147138 Bearings |
| 07/06/2006 | US20060144714 Substrate plating method and apparatus |
| 07/06/2006 | DE102004030017B4 Gleitelement Slider |
| 07/05/2006 | EP1529126A4 Electrolytic copper plating solutions |
| 07/05/2006 | EP1451392B1 Pretreatment process for coating of aluminium materials |
| 07/05/2006 | EP1064417A4 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 07/05/2006 | EP1042541A4 Method for producing abrasive tips for gas turbine blades |
| 07/05/2006 | CN1262691C An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 07/04/2006 | US7071026 Production method for making film carrier tape for mounting electronic devices thereon |
| 07/04/2006 | US7070687 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 07/04/2006 | US7070686 Retaining object between cathode and anode in electrochemical reactor to present surface of object for electrochemical reaction; applying electric field by flowing current through electrolyte; dynamically inflating or deflating the bladder |
| 07/04/2006 | US7070335 Rolling bearing |
| 07/04/2006 | US7069937 Vertical proximity processor |
| 06/29/2006 | US20060141809 Single side workpiece processing |
| 06/29/2006 | US20060141157 Plating apparatus and plating method |
| 06/29/2006 | US20060137974 Wafer electroplating apparatus |
| 06/29/2006 | DE69635227T2 Kontakträger zum bestücken von substraten mit federkontakten Contact carrier of fitting substrates with spring contacts |
| 06/28/2006 | EP1675132A1 R-T-B permanent magnet and plating film |
| 06/28/2006 | EP1495161A4 Electropolishing and electroplating methods |
| 06/28/2006 | CN1261980C Method and apparatus for controlling a plating process |
| 06/28/2006 | CN1261621C Method for producing electro-conductive particles |
| 06/28/2006 | CN1261620C Phosphate film processing method |
| 06/28/2006 | CA2530270A1 Highly corrosion-resistant/highly workable plated steel wire, plating bath composition, method for producing the plated steel wire and wire netting product |
| 06/27/2006 | US7067172 Component formation via plating technology |
| 06/27/2006 | US7067045 Method and apparatus for sealing electrical contacts during an electrochemical deposition process |
| 06/22/2006 | WO2006065580A2 Wafer support apparatus for electroplating process and method for using the same |
| 06/22/2006 | WO2006064803A1 Method for forming corrosion-resistant coating in process for producing steel pipe |
| 06/22/2006 | WO2006064711A1 Plating device, plating method, semiconductor device, and semiconductor device manufacturing method |
| 06/22/2006 | WO2006012112A3 Electrochemical plating cell with an auxiliary electrode in an isolated anolyte compartment |
| 06/22/2006 | WO2006005549A3 Clamping device for printing cylinder |
| 06/22/2006 | US20060131177 Means to eliminate bubble entrapment during electrochemical processing of workpiece surface |
| 06/21/2006 | EP1672088A1 Method for manufacturing a body featuring very high mechanical properties, forming by drawing from a rolled steel sheet, in particular hot rolled and coated sheet |
| 06/21/2006 | EP1201792B1 Composite plating method |
| 06/21/2006 | CN2789280Y Strap aluminium foil oxidation dyeing automatic machine |
| 06/21/2006 | CN1260789C Circuit board, semiconductor device mfg. method, and electroplating system |
| 06/21/2006 | CN1260778C Substrate processing method |
| 06/21/2006 | CN1260401C Small plated body-electroplating device |
| 06/21/2006 | CN1260400C Composite electroplating method |
| 06/21/2006 | CN1260398C Electrolysis method of micro-chip, microchip electroplating system, copper electroplating composition and use |
| 06/20/2006 | US7064566 Probe card assembly and kit |
| 06/20/2006 | US7064068 Method to improve planarity of electroplated copper |
| 06/20/2006 | US7063897 Slide member |
| 06/15/2006 | WO2006062627A1 Method and apparatus for coating a medical device by electroplating |
| 06/15/2006 | WO2006062015A1 Pneumatic tire |
| 06/15/2006 | WO2006061659A1 Process and apparatus for multiple surface treatments of battery cans |
| 06/15/2006 | WO2006046346A8 Battery subjected to nickel bright electroplating |
| 06/15/2006 | US20060127768 electrodeposition; flexibility; controlling thickness, hardness; drum surface with apertures filled with dielectric resin |
| 06/15/2006 | US20060124474 Method and apparatus for local polishing control |
| 06/15/2006 | US20060124468 Contact plating apparatus |
| 06/15/2006 | US20060124451 Wafer support apparatus for electroplating process and method for using the same |
| 06/14/2006 | EP1668174A2 Plating method and apparatus |
| 06/14/2006 | DE102005031948B3 Device for electrolytically treating strip-like material comprises contact rollers made from metal arranged on at least one side of the material and counter rollers arranged on the opposite-lying side of the strip as a contact pair |