Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
10/2006
10/11/2006CN1278799C Method and device for continuous casting steel strip
10/10/2006US7118658 Electroplating reactor
10/10/2006US7117583 Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure
10/10/2006CA2329514C Multi-layer engine bearings and method of manufacture
10/05/2006US20060219573 Apparatus with conductive pad for electroprocessing
10/05/2006US20060219560 Method of manufacturing master disks for magnetic transferring, system of controlling content concentrations in electroforming bath, and magnetic recording medium
10/05/2006DE102005014748A1 Technique for electrochemical depositing of an alloy e.g., for microstructures, involves generating current between consumer electrode and surface
10/04/2006EP1392889A4 Anode assembly and process for supplying electrolyte to a planar substrate surface
10/04/2006CN1842618A Apparatus and method for depositing and planarizing thin films of semiconductor wafers
10/04/2006CN1277958C Electroplating method
10/03/2006US7115510 Method for electrochemically processing a workpiece
10/03/2006US7115196 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
10/03/2006US7114693 Stable cell platform
10/03/2006US7114251 Method of producing of circuit board; for semiconductor device
09/2006
09/28/2006DE102005012923A1 Production of composite metal plates comprising at least two outer metal plates and metal plate between them, useful for bar grates (sic) , lamella screens and honeycomb structures (sic), has plates joined by hot galvanizing
09/27/2006EP1705259A1 Sliding member
09/27/2006EP1648242A4 Emulsions
09/27/2006EP1360348A4 Method and apparatus for controlling thickness uniformity of electroplated layer
09/27/2006EP1354078A4 Spouted bed apparatus for contacting objects with a fluid
09/27/2006EP1295312A4 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/27/2006CN1276997C Method of producing high temperature heat resistant electrolytic copper foil with carrier foil and electrolytic copper foil obtained by the method
09/27/2006CN1276996C Composite foil and its manufacturing process
09/26/2006US7113367 FeNiRe soft magnetic film and thin film magnetic head using the same for simultaneous adjustment of resistivity and saturated magnetic flux density
09/26/2006US7112268 Plating device and plating method
09/26/2006US7112264 For performing plating on a long conductive substrate
09/26/2006US7111799 Narrow diameter needle having reduced inner diameter tip
09/21/2006WO2006098338A1 Plating method, light-transmitting conductive film and electromagnetic shielding film
09/21/2006WO2006098336A1 Plating method, light-transmitting conductive film and electromagnetic shielding film
09/21/2006WO2006013735A8 Composite copper foil and method for production thereof
09/21/2006US20060207636 Multi-menisci processing apparatus
09/20/2006EP1702018A2 Chambers, systems, and methods for electrochemically processing microfeature workpieces
09/20/2006CN2818504Y Coninuous production line of alkali zinc-plated and coating-resistant fingerprint film on rolling plate
09/20/2006CN1835191A Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof
09/20/2006CN1834304A Method of preparing thin sheet net-like metallic short fiberous material
09/20/2006CN1276132C Strip processing device
09/19/2006US7109056 Electro-and electroless plating of metal in the manufacture of PCRAM devices
09/19/2006US7108819 Process for fabricating high aspect ratio embossing tool and microstructures
09/19/2006US7108776 Plating apparatus and plating method
09/14/2006WO2006095683A1 Negative electrode collector for dry cell
09/14/2006WO2006094755A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
09/14/2006WO2006060520A3 Membrane-limited selective electroplating of a conductive surface
09/14/2006US20060204741 Contact surfaces for electrical contacts and method for producing the same
09/14/2006US20060201817 Device and method for electrolytically treating electrically insulated structures
09/14/2006DE102006004192A1 Heat exchange tube for cooling chip, comprises closed tube with capillary structure for carrying condensed fluid back to heat-receiving end
09/14/2006CA2599183A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
09/13/2006EP1700933A1 Electrical lead wire with aluminium or aluminium alloy core
09/13/2006EP1699949A2 Improved metal strip electroplating
09/13/2006CN1831209A Electroplating apparatus
09/12/2006US7106157 Solenoid switch and plating method thereof
09/12/2006US7105082 Using a metal compound; polymerization inhibitor ,promoter and electrolyte; heating, controlling temperature
09/08/2006WO2006093155A1 Connector between substrates, and circuit board device using connector between substrates
09/07/2006US20060199381 Electro-chemical deposition apparatus and method of preventing cavities in an ecd copper film
09/07/2006US20060198948 Method of coating electric wire and insulated wire
09/07/2006DE102006009504A1 Component module with cooling fins consisting of connector and numerous cooling fins and made of heat conductive materials containing metal and crystalline carbon with high heat conductive coefficient
09/07/2006DE102006003754A1 Air cooler system for chips with fan, numerous cooling fins, cooler body and heat exchange tube, with cooler body formed by metal and crystalline carbon of high heat
09/06/2006EP1697561A1 Copper electrodeposition in microelectronics
09/06/2006CN1829817A Method for producing a hardened steel part
09/06/2006CN1274011C Crystalline grain in metal film growth control method
09/06/2006CN1273648C Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
08/2006
08/31/2006WO2006090785A1 Plated member for fuel cell, and method and apparatus for manufacturing same
08/31/2006US20060191795 Apparatus and method for electrochemically processing a microelectronic workpiece
08/31/2006US20060191790 Apparatus and method for electrochemically processing a microelectronic workpiece
08/30/2006EP1694886A2 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
08/30/2006EP1694885A2 Multi-chemistry plating system
08/30/2006CN1824843A Strip treating apparatus
08/30/2006CN1272474C Wafer electroplating device and method
08/29/2006US7098136 Structure having flush circuit features and method of making
08/29/2006US7098133 Method of forming copper wiring in a semiconductor device
08/29/2006US7097410 Methods and apparatus for controlled-angle wafer positioning
08/24/2006WO2006088526A1 Color-coded stainless steel fittings and ferrules
08/24/2006WO2006087743A1 Anode for an apparatus for the galvanic coating of the running surfaces of cylinders
08/24/2006WO2006087585A1 Ultrasonic treatment plant
08/24/2006WO2004110698A3 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
08/24/2006US20060189127 Method to improve palanarity of electroplated copper
08/24/2006US20060185976 Plating apparatus and method
08/24/2006CA2598028A1 Ultrasonic treatment plant
08/24/2006CA2597634A1 Color-coded stainless steel fittings and ferrules
08/23/2006EP1520064B1 Plain bearing having an overlay alloy layer
08/23/2006EP1303650A4 Method of reducing a band mark of an electroplating steel sheet
08/23/2006EP1194613A4 Workpiece processor having processing chamber with improved processing fluid flow
08/23/2006EP1192298A4 System for electrochemically processing a workpiece
08/23/2006CN1271683C Filming method of substrate
08/23/2006CN1271645C Plated material and method of manufacturing the same, terminal member for connector, and connector
08/22/2006US7095070 Method for fabricating Bi thin film and device using the same
08/22/2006US7094444 Method for repairing coated components using NiAl bond coats
08/17/2006WO2006084973A1 Method for treating surfaces of hollow parts, tank for carrying out a method of this type, installation for continuously treating surfaces comprising such a tank
08/17/2006WO2005060379A3 Chambers, systems, and methods for electrochemically processing microfeature workpieces
08/17/2006US20060182879 Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
08/16/2006EP1690963A1 Silver-coated stainless strip for movable contact and method for production thereof
08/16/2006EP1268881A4 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
08/16/2006CN1819741A Copper foil for polyimide like flexible copper laminated board, polyimide like flexible copper laminated board and polyimide like flexible printed circuit board
08/16/2006CN1269589C Pressing die and its mfg. method
08/15/2006US7090751 Apparatus and methods for electrochemical processing of microelectronic workpieces
08/15/2006US7090750 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution
08/10/2006US20060175202 Membrane-limited selective electroplating of a conductive surface
08/10/2006DE102005006014A1 Bauteil mit einer Beschichtung zur Verringerung der Benetzbarkeit der Oberfläche und Verfahren zu dessen Herstellung Component having a coating for reducing the wettability of the surface and method for its production
08/09/2006EP1688518A2 Process and apparatus for continuous electrochemical treatment of pieces
08/09/2006EP1570102B1 Method for coating piston rings for internal combustion engines
08/09/2006CN1816650A Electrochemical processing cell
08/09/2006CN1269182C A vertically configured chamber used for multiple processes
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