C25D 7 - Electroplating characterised by the article coated

Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2006
12/13/2006	CN1290120C Conductive paste and conductive film, plating method and production method for fine metal component
12/13/2006	CN1289719C Segmented counter electrode for an electrolytic treatment system
12/13/2006	CN1289712C Anode assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte
12/12/2006	US7148426 Lead-free solder, and connection lead and electrical component using said lead-free solder
12/12/2006	US7148148 Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
12/12/2006	US7148141 Method for manufacturing metal structure having different heights
12/12/2006	US7147899 Process of masking cooling holes of a gas turbine component
12/12/2006	US7147766 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal
12/12/2006	US7147765 Apparatus and method for deposition of an electrophoretic emulsion
12/12/2006	US7147760 Electroplating apparatus with segmented anode array
12/07/2006	WO2006129806A1 Separator for fuel cell and method for manufacturing the same
12/07/2006	WO2006129602A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
12/07/2006	WO2006129540A1 Nb-Al TYPE SUPERCONDUCTING WIRE HAVING STABILIZING COPPER DEPOSIT TENACIOUSLY ADHERENT THERETO AND PROCESS FOR PRODUCING THE SAME
12/07/2006	DE10234285B4 Vorrichtung zur galvanischen Abscheidung prothetischer, metallischer Dentalformteile Apparatus for electrodepositing prosthetic, metallic, molded dental components
12/06/2006	EP1019954A4 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
12/06/2006	CN2844144Y Electric brush coated auxiliary tool
12/06/2006	CN1873939A Manufacturing method for semiconductor device
12/06/2006	CN1288946C Method for preparing surface treated copper foil
12/06/2006	CN1288945C Method for preparing surface treated copper foil
12/05/2006	US7144490 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad
11/2006
11/30/2006	WO2006126518A1 Gravure cylinder-use copper plating method and device
11/30/2006	WO2004094702A3 Multi-chemistry plating system
11/30/2006	US20060266800 Copper welding solid wire with good arc stability
11/30/2006	US20060266655 Multiple chemistry electrochemical plating method
11/29/2006	EP1726690A2 In-situ profile measurement in an electroplating process
11/29/2006	CN1871376A Support layer for thin copper foil
11/29/2006	CN1868657A Solid copper plating welding wires with excellent arc stability
11/28/2006	US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006	US7141146 Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
11/28/2006	US7140949 Tool and process for chrome plating a vehicle wheel surface
11/28/2006	US7140929 Electronic connector terminal, a method for plating, and a terminal stack
11/28/2006	US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/23/2006	US20060260932 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
11/23/2006	DE112004002419T5 Elektromagnetisches Wellenabschirmfilter und Verfahren zur Herstellung desselben Electromagnetic Wellenabschirmfilter and method of manufacturing the same
11/23/2006	DE10120847B4 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece
11/22/2006	CN1867703A Electroplating compositions and methods for electroplating
11/22/2006	CN1865519A Electroplating apparatus
11/22/2006	CN1865517A Process for preparing cyanide-free alkaline zinc-electroplating anti-fingerprint rolled board
11/22/2006	CN1285419C Internal heat spreader plating methods and devices
11/21/2006	US7138043 Coating lining on internal combustion engines; corrosion and wear resistance
11/21/2006	US7138040 Suppressing the generation of copper or copper oxide particles on anode, use a formed black film composed of copper phosphide and copper chloride formed on the anode surface due to electrolysis
11/21/2006	US7138039 Liquid isolation of contact rings
11/21/2006	US7138014 Electroless deposition apparatus
11/16/2006	US20060254924 Process for electroplating for producing an iron platinum magnetic material having an especially strong coercive force and excellent properties by using electroplating solution containing ionic iron, ionic platinum, and a complexing agent
11/15/2006	EP1099012A4 Method and apparatus for copper plating using electroless plating and electroplating
11/15/2006	CN1284885C Electrolyzing apparatus
11/14/2006	US7135770 Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection
11/14/2006	US7135404 Method for applying metal features onto barrier layers using electrochemical deposition
11/14/2006	US7135098 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/09/2006	WO2006117920A1 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution
11/08/2006	EP1719827A1 Composite chromium plating film and sliding member having the same and its production method
11/08/2006	EP1579031A4 Peel strength enhancement of copper laminates 102426-201
11/08/2006	EP1214191A4 Treated copper foil and process for making treated copper foil
11/08/2006	CN2835267Y Conductive roll
11/08/2006	CN1860259A A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/08/2006	CN1860258A Method of preparing printed or daubed image and printed or daubed image element by it
11/08/2006	CN1283849C Ni-plated steel plate for alkali-manganese dry cell anode can and alkali manganese dry cell anode can
11/08/2006	CN1283848C Method of copper-plating small-diameter holes
11/08/2006	CN1283847C Electro-plating apparatus and method
11/07/2006	US7132158 Support layer for thin copper foil
11/02/2006	WO2006114564A1 A method of forming mirrors on a conducting substrate
11/02/2006	US20060246690 Electro-chemical deposition system
11/02/2006	US20060244364 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device
11/02/2006	US20060243596 Uniform current distribution for ECP loading of wafers
11/02/2006	US20060243205 Substrate processing apparatus and substrate processing method
11/02/2006	US20060243204 Substrate processing apparatus and substrate processing method
11/02/2006	EP1717352A2 Electroplating apparatus
11/02/2006	EP1717020A1 Cable with aluminum central conductor
11/01/2006	CN1856596A Electrochemical deposition chambers for depositing materials onto microfeature workpieces
10/2006
10/31/2006	US7129161 Depositing a tantalum film
10/31/2006	US7128981 Sliding member
10/31/2006	US7128823 Anolyte for copper plating
10/31/2006	US7128821 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis
10/31/2006	US7128469 Lightweight bearing and wave gear drive
10/31/2006	US7127831 Methods and systems for processing a substrate using a dynamic liquid meniscus
10/26/2006	WO2006112522A2 Surface-treated doctor blade
10/26/2006	US20060240274 Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case
10/26/2006	US20060240272 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon
10/26/2006	US20060237325 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps
10/26/2006	US20060237308 Contact ring with embedded flexible contacts
10/26/2006	US20060237307 Electrochemical processing cell
10/26/2006	US20060236929 Substrate processing apparatus and substrate processing method
10/25/2006	EP1715081A1 Alloy coating for diffusion barrier, method for forming same, and high-temperature device member
10/19/2006	WO2006109650A1 Press fit joining method
10/19/2006	US20060234503 Substrate processing apparatus, substrate processing method, and substrate holding apparatus
10/19/2006	US20060231408 forming a roughened area in an area of a substrate, forming a surface-active agent layer above the roughened area, forming a catalyst layer above the surface-active agent layer, and precipitating a metal layer above the catalyst layer; improved reliability
10/18/2006	CN1849415A Device and method for electrolytically treating electrically insulated structures
10/18/2006	CN1847465A Plating method for printing circuit board
10/18/2006	CN1280872C Plating apparatus
10/18/2006	CN1280448C Forming method of plating chrome on copper layer of printed circuit board
10/12/2006	WO2006108140A1 Continuous plating system and method with mask registration
10/12/2006	US20060226021 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
10/12/2006	US20060226019 Die-level wafer contact for direct-on-barrier plating
10/12/2006	DE10006992B4 Verfahren zur Beschichtung eines Implantats und Implantat mit Beschichtung A method for coating an implant and implant coating
10/11/2006	EP1361837B1 Endoprothesis with galvanised silver layer
10/11/2006	CN2825657Y Titanium anode basket for electroplating in the internal wall of copper tube used in mould
10/11/2006	CN1844481A Metallization treatment method for short carbon fiber
10/11/2006	CN1844479A Secondary alloying nickel and stannum -plating steel plate and belt and method for preparing same
10/11/2006	CN1279513C Method for seed layer removal for magnetic heads
10/11/2006	CN1279294C Brake and its mfg. method

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