| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 02/20/2007 | US7178238 Method of producing a workpiece having at least one bearing eye |
| 02/15/2007 | WO2007017279A1 Device for picking up and holding a plurality of substrates and an electroplating device |
| 02/15/2007 | WO2006112522A3 Surface-treated doctor blade |
| 02/15/2007 | US20070034516 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 02/15/2007 | DE10229001B4 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface |
| 02/15/2007 | CA2617502A1 Device for receiving or holding several substrates and galvanizing device |
| 02/14/2007 | CN1914359A Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| 02/13/2007 | US7175920 Copper foil for high-density ultra-fine printed wiring board |
| 02/13/2007 | US7174637 Bearings |
| 02/13/2007 | US7174626 Method of manufacturing a plated electronic termination |
| 02/13/2007 | CA2186482C Palladium colloid solution and its utilisation |
| 02/08/2007 | WO2007015692A1 Electrodeposition of biaxially textured layers on a substrate |
| 02/08/2007 | DE102005014748B4 Technik zum elektrochemischen Abscheiden einer Legierung mit chemischer Ordnung Technology for the electrochemical deposition of an alloy with chemical ordering |
| 02/07/2007 | EP1750491A2 System and method for manufacturing flexible copper clad laminate film |
| 02/07/2007 | EP1444386A4 Elemental silicon nanoparticle plating and method for the same |
| 02/07/2007 | EP1231300B1 Plating method and device, and plating system |
| 02/07/2007 | CN1910307A Alloy coating for diffusion barrier, method for forming same, and high-temperature device member |
| 02/07/2007 | CN1299548C Method for metal coating of substrates |
| 02/07/2007 | CN1299544C Nickel coated copper as electrodes for embedded passive devices |
| 02/06/2007 | US7172818 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 02/06/2007 | US7172684 Performing extrusion via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken; pattern of deposition may vary over the course of deposition by including relative motion |
| 02/06/2007 | US7172683 Method of managing a plating liquid used in a plating apparatus |
| 02/01/2007 | US20070023277 Plating apparatus, plating cup and cathode ring |
| 02/01/2007 | US20070023070 Meniscus, vacuum, IPA vapor, drying manifold |
| 01/31/2007 | EP1748092A1 Copper foil and its manufacturing method |
| 01/30/2007 | US7169705 Plating method and plating apparatus |
| 01/30/2007 | US7169280 Apparatus and method for deposition of an electrophoretic emulsion |
| 01/30/2007 | US7169269 Plating apparatus, plating cup and cathode ring |
| 01/30/2007 | US7169216 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 01/25/2007 | WO2007010982A1 Retainer for rolling bearing and rolling bearing |
| 01/25/2007 | WO2007009448A1 System for electrodepositing a conductive layer on a nonconductive carrier material |
| 01/25/2007 | US20070020912 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 01/25/2007 | US20070017816 Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil |
| 01/25/2007 | DE102005034731A1 Corrosion-resistant electroplating of automobile wheel rim of light metal alloy, by applying layer of fluidized acrylonitrile-butadiene-s tyrene terpolymer to mechanically treated rim and hardening before plating |
| 01/24/2007 | CN1902994A Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter |
| 01/24/2007 | CN1900597A Process for treating lighter cast shell surface and sticking sheet for lighter shell |
| 01/24/2007 | CN1900380A Apparatus and process for electroplating treatment of foils from roller to roller |
| 01/24/2007 | CN1296524C Container, reactor and method for electrochemically processing workpiece |
| 01/23/2007 | US7166206 Generating a stream of bubbles containing a source of the material, and applying a potential difference across the cathode and anode so that the resulting glow discharge forms a plasma of ionised gaseous molecules within the bubbles |
| 01/23/2007 | US7166204 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated. |
| 01/18/2007 | WO2007007870A1 Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
| 01/18/2007 | WO2007006755A1 Electrode arrangement and method for removing a layer comprising metal from a workpiece surface |
| 01/18/2007 | US20070012573 Lithographic printing plate support, method of manufacturing the same, and presensitized plate |
| 01/18/2007 | US20070012560 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/18/2007 | US20070011905 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/17/2007 | CN1899002A Printed-circuit board, its manufacturing method and circuit device |
| 01/17/2007 | CN1898415A Silver-coated stainless strip for movable contact and method for production thereof |
| 01/17/2007 | CN1897236A Production of manganese-doped zinc oxide thin-film and nano-column by electrochemical deposition |
| 01/16/2007 | US7163614 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 01/16/2007 | US7163613 Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses |
| 01/11/2007 | WO2007004581A1 Sn-PLATED COPPER ALLOY BAR HAVING EXCELLENT FATIGUE CHARACTERISTICS |
| 01/11/2007 | WO2003000937A3 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 01/10/2007 | CN1894444A Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/10/2007 | CN1894442A Method and apparatus for fluid processing a workpiece |
| 01/10/2007 | CN1294296C Method and electrode for defining and replicating structures in conducting materials |
| 01/09/2007 | US7161794 Component formation via plating technology |
| 01/09/2007 | US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 01/09/2007 | US7160421 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 01/09/2007 | CA2385468C Integrated circuit plating using highly-complexed copper plating baths |
| 01/04/2007 | WO2007002956A1 Composite metal layer formed using metal nanocrystalline particles in an electroplating bath |
| 01/04/2007 | WO2005105356A3 Electrochemical mechanical planarization process and apparatus |
| 01/04/2007 | US20070000117 Method for producing hardened parts from sheet steel |
| 01/03/2007 | EP1664390B1 Device and method for electrolytically treating electrically insulated structures |
| 01/03/2007 | CN1293236C Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 01/03/2007 | CN1292966C Belt apparatus, holding apparatus, belt device and application device and method for the same |
| 01/02/2007 | US7157370 Semiconductor device and method for manufacturing the same |
| 01/02/2007 | US7157152 Copper-tin-oxygen alloy plating |
| 01/02/2007 | US7156972 High quality metal or alloy thin film deposition on magnetic head; dissolving hydrogen in solution; low cost impurity reduction |
| 01/02/2007 | CA2396514C Surface-treated tin-plated steel sheet and surface treatment solution |
| 12/28/2006 | WO2006137555A1 Apparatus and method for manufacturing plated film |
| 12/28/2006 | WO2006137240A1 Copper foil for printed wiring board |
| 12/28/2006 | DE112005000224T5 Blatt zur Abschirmung elektromagnetischer Wellen und Verfahren zu dessen Herstellung Sheet for shielding electromagnetic waves and process for its preparation |
| 12/27/2006 | EP1736569A1 Electroplating jig |
| 12/27/2006 | EP1735817A1 Single workpiece processing chamber |
| 12/27/2006 | CN1885443A Method for improving critical current density of Bi-2223 strip material |
| 12/27/2006 | CN1292471C Method of forming planar Cu interconnects without chemical mechanical polishing |
| 12/26/2006 | US7154044 Flat cable conductor, method of making the same and flat cable using the same |
| 12/26/2006 | US7153591 Sliding member |
| 12/26/2006 | US7153590 Composite copper foil and manufacturing method thereof |
| 12/26/2006 | US7153410 Alternating current, direct current power sources; switches |
| 12/26/2006 | US7153408 deposit has a stable hardness and is free from self-annealing during high speed plating; copper methane sulphonate. methane sulphonic acid, hydrochloric acid as source of chloride ions, an alkylthioalkylsulfonic acid, and a polyether |
| 12/26/2006 | US7153400 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
| 12/21/2006 | WO2006134665A1 Member provided with coating composed mainly of tin, method of coating formation and method of soldering |
| 12/21/2006 | US20060286828 Contact Structures Comprising A Core Structure And An Overcoat |
| 12/21/2006 | US20060286369 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| 12/21/2006 | US20060283712 Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures |
| 12/21/2006 | US20060283710 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 12/21/2006 | US20060283213 Water-permeable drum for the hydrodynamic needling of webs of textile materials, and method for the production of said drum |
| 12/21/2006 | DE202006013555U1 Zinc-plated cast iron pivot bearing for automobile front suspensions has a crystalline zinc coating |
| 12/21/2006 | DE10223957B4 Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht An improved method for electroplating copper on a patterned dielectric layer |
| 12/20/2006 | CN1880517A Electrochemical processing cell |
| 12/20/2006 | CN1291069C Technology for electrolyzing and manufacturing micro-gap counter-assembled welding projects |
| 12/19/2006 | US7151049 Electroplating compositions and methods |
| 12/19/2006 | US7150924 Metal based resistance heating element and method for preparation therefor |
| 12/19/2006 | US7150819 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 12/19/2006 | US7150816 Enables use of electrophoretic resists in the microfabrication industry for production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology |
| 12/14/2006 | US20060279300 Probe Card Assembly And Kit |
| 12/13/2006 | EP1732113A2 Silver metallization by damascene method |
| 12/13/2006 | CN1290385C Printed wiring board-use copper foil and copper clad laminated sheet using printed wiring board-use copper foil |
| 12/13/2006 | CN1290160C Metallization method for producing integrated circuit copper interconnecting wire by separating bipolar acid chemical plating |