| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 04/24/2007 | US7208069 Device for etching semiconductors with a large surface area |
| 04/24/2007 | CA2143354C Surface-treated wire for use in composite elements of elastomeric material and manufacturing process of same |
| 04/19/2007 | WO2006094755A8 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 04/19/2007 | DE19506656B4 Verfahren zur Keramisierung von Leichtmetalloberflächen Method for ceramizing light metal surfaces |
| 04/18/2007 | CN1311103C Method for electroplating electrode of ceramic wafer electronic component |
| 04/17/2007 | US7204924 Method and apparatus to deposit layers with uniform properties |
| 04/17/2007 | US7204917 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
| 04/17/2007 | US7204916 Plating apparatus and plating method |
| 04/12/2007 | WO2007040191A1 Method of surface treatment for the inhibition of wiskers |
| 04/12/2007 | US20070082216 Copper-tin-oxygen alloy plating |
| 04/12/2007 | US20070080057 Plating apparatus, plating cup and cathode ring |
| 04/12/2007 | US20070079727 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 04/12/2007 | DE10124251B4 Vorrichtung zum Halten von Werkstücken A device for holding workpieces |
| 04/11/2007 | EP1397828A4 Electrolytic processing device and substrate processing apparatus |
| 04/11/2007 | CN1947220A Single workpiece processing chamber |
| 04/11/2007 | CN1946879A Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom |
| 04/11/2007 | CN1944716A Non-cyanogen type electrolytic gold plating bath for bump forming |
| 04/11/2007 | CN1310312C Semiconductor integrated circuit, method and apparatus for mfg. same |
| 04/11/2007 | CN1310289C Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 04/11/2007 | CN1309880C Metal strip for epitaxial coating and method for production thereof |
| 04/11/2007 | CN1309878C Continuous processing device for plate processing element and electric contact method |
| 04/11/2007 | CN1309874C Tin plating method |
| 04/10/2007 | US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 04/10/2007 | US7201829 Mask plate design |
| 04/10/2007 | US7201828 Planar plating apparatus |
| 04/10/2007 | US7200930 Probe for semiconductor devices |
| 04/05/2007 | US20070077441 Metal plating using seed film |
| 04/05/2007 | US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts |
| 04/04/2007 | EP1118413B1 Structure and method for joining metal members |
| 04/04/2007 | CN1940147A Formation method of gold bump or gold wiring |
| 04/04/2007 | CN1940144A Production of zirconium hydride surface Cr CO hydrogen penetration barrier layer |
| 04/04/2007 | CN1940137A Heat resistant film, its manufacturing method, and electrical and electronic parts |
| 04/04/2007 | CN1308497C Cartridge plating device and design method |
| 04/04/2007 | CN1308495C Copper electroplating film method |
| 04/04/2007 | CN1308494C Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle |
| 04/03/2007 | US7199052 Seed layers for metallic interconnects |
| 04/03/2007 | US7199036 Under-bump metallization layers and electroplated solder bumping technology for flip-chip |
| 04/03/2007 | US7198705 Plating-rinse-plating process for fabricating copper interconnects |
| 04/03/2007 | US7198055 Meniscus, vacuum, IPA vapor, drying manifold |
| 03/29/2007 | WO2007034921A1 Electrical contact and socket for electrical component |
| 03/29/2007 | US20070071994 Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability |
| 03/29/2007 | US20070068801 System for plating |
| 03/29/2007 | CA2622917A1 Electroplating composition for coating a substrate surface with a metal |
| 03/28/2007 | EP1766106A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 03/28/2007 | CN1938456A Copper foil and its manufacturing method |
| 03/28/2007 | CN1935392A Method for the passivation of the surface of coated metal bands and device for the application of the passive layer on a metal coated steel band |
| 03/28/2007 | CN1935391A Method for lowering the coefficient of friction of the surface of metal bands with a coating and device for applying a metallic coating onto a steel band |
| 03/28/2007 | CN1307327C Electroplating method |
| 03/27/2007 | US7195796 Composite , rigid sheet; pretreated steel sheet; multilayer polymer coating containing alpha-olefin |
| 03/27/2007 | US7195696 Anodes; shaping plate; liquid electrolytes; electrical contactors; electroplating |
| 03/22/2007 | WO2007031276A1 Process for producing tinplate, tinplate produced using said process and packaging produced thereof |
| 03/22/2007 | WO2006002969A3 Device and method for chemically and electrolytically treating work pieces |
| 03/22/2007 | US20070063245 Metal plating using seed film |
| 03/22/2007 | DE10311575B4 Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis A method of electrolytic plating of workpieces with holes with a high aspect ratio |
| 03/21/2007 | CN1934293A Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surfac |
| 03/21/2007 | CN1305640C Ultrasonic vibration cutting tools and mfg. method therefor |
| 03/21/2007 | CN1305624C Wire for high-speed electrical discharge machining and producing method and usage thereof |
| 03/21/2007 | CA2558572A1 Method for lowering the coefficient of friction of the surface of metal bands with a coating and device for applying a metallic coating onto a steel band |
| 03/20/2007 | US7192662 Plating alloy using electrolytic cell; magnetic thin film |
| 03/20/2007 | US7192494 Method and apparatus for annealing copper films |
| 03/15/2007 | US20070056856 Apparatus and method for electrically contacting wafer in electronic chemical plating cell |
| 03/14/2007 | EP1761658A2 Device and method for chemically and electrolytically treating work pieces |
| 03/14/2007 | CN1305132C Lead frame and its electroplating method |
| 03/14/2007 | CN1305109C Metal element, semiconductor device, electronic device and electronic equipment and its manufacturing method |
| 03/13/2007 | US7190057 Packaging component and semiconductor package |
| 03/13/2007 | US7189630 Layer sequence for producing a composite material for electromechanical components |
| 03/13/2007 | US7189611 Metal plating using seed film |
| 03/13/2007 | US7189313 Substrate support with fluid retention band |
| 03/13/2007 | US7189146 Method for reduction of defects in wet processed layers |
| 03/08/2007 | WO2007026970A1 Threaded joint for steel pipes |
| 03/08/2007 | WO2007026562A2 Metal film and its production method, and multilayer electronic component production method and multilayer electronic component |
| 03/08/2007 | WO2002029137A9 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 03/08/2007 | US20070051635 Electrochemical Mechanical Deposition; process involves creating a differential between additives adsorbed on different portions of a workpiece using an external influence and thus either enhancing or retarding plating of a conductive material on these portions |
| 03/08/2007 | US20070051632 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 03/08/2007 | DE102005041404A1 Vorrichtung zum Haltern eines Kolbens in einer Anlage zum Beschichten von Kolben Means for supporting a piston in a plant for coating piston |
| 03/06/2007 | US7186164 Processing pad assembly with zone control |
| 03/01/2007 | WO2007024331A1 Close loop electrophoretic deposition of phosphors on semiconductor substrates |
| 03/01/2007 | WO2005081657A3 Laser ablation resistant copper foil |
| 03/01/2007 | US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology |
| 03/01/2007 | DE19728183B4 Herstellungsverfahren für leitende Drähte eines Halbleitergehäuses in Chipgrösse Manufacturing method for conductive wires of a semiconductor package in chip size |
| 03/01/2007 | DE112005000842T5 Verfahren zum Verleihen von Widerstand gegenüber Wasserstoff für Artikel A method of imparting resistance to hydrogen for products |
| 03/01/2007 | DE10229005B4 Vorrichtung und Verfahren zur elektrochemischen Metallabscheidung Apparatus and method for electro-chemical metal deposition |
| 02/28/2007 | EP1756336A1 Device and method for electrolytically treating flat work-pieces |
| 02/28/2007 | EP1755813A1 Tool holder with vibration damping means and a method for manufacturing the same |
| 02/28/2007 | EP1560949A4 Integrated plating and planarization process and apparatus therefor |
| 02/28/2007 | CN1922344A Apparatus for electroless deposition |
| 02/28/2007 | CN1920105A Method and apparatus for fluid processing a workpiece |
| 02/28/2007 | CN1302155C Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/27/2007 | US7181842 Method of producing a workpiece forming at least one bearing eye |
| 02/22/2007 | WO2007021358A1 Method of patterning ultra-small structures |
| 02/22/2007 | WO2006011922A3 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 02/22/2007 | US20070042212 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
| 02/22/2007 | US20070042155 Reflective or semi-reflective metal alloy coatings |
| 02/21/2007 | EP1753897A1 Method for electroplating bath chemistry control |
| 02/21/2007 | EP1753896A1 Method and system for selectively coating or etching surfaces |
| 02/21/2007 | CN1918328A Improved metal strip electroplating |
| 02/20/2007 | US7179716 Method of forming a metal-containing layer over selected regions of a semiconductor substrate |
| 02/20/2007 | US7179541 Achieving optimal embrittlement of grain boundaries; controlled temperature heating |
| 02/20/2007 | US7179361 Method of forming a mass over a semiconductor substrate |
| 02/20/2007 | US7179359 Cup-shaped plating apparatus |