| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 07/03/2007 | US7238092 Low-force electrochemical mechanical processing method and apparatus |
| 06/28/2007 | WO2007073339A1 A device and a method for metal plating |
| 06/28/2007 | WO2006055145A3 Current collimation for thin seed and direct plating |
| 06/28/2007 | US20070145584 Printed wiring board, method for manufacturing same, and circuit device |
| 06/28/2007 | US20070144913 Method of preparing printed or daubed image and printed or daubed image element by it. |
| 06/28/2007 | US20070144912 Linearly translating agitators for processing microfeature workpieces, and associated methods |
| 06/28/2007 | DE102005060667A1 Hochdruckverbindung und Verfahren zum Herstellen einer Hochdruckverbindung High-pressure connection and method of manufacturing a high-pressure connection |
| 06/27/2007 | EP1801851A2 Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces |
| 06/27/2007 | EP1801267A1 Method and apparatus for plating automotive bumpers |
| 06/27/2007 | CN1989793A Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil |
| 06/27/2007 | CN1989272A Coated copper, method for inhibiting generation of whisker, printed wiring board and semiconductor device |
| 06/27/2007 | CN1986901A Technological process of double zinc electroplating during coiled steel plate production |
| 06/26/2007 | CA2286326C Article, method, and apparatus for electrochemical fabrication |
| 06/21/2007 | WO2007069466A1 Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same |
| 06/21/2007 | US20070141380 substrate contains a reactive element, such as titanium, silicon or magnesium between the support and release layer, so blistering is eliminated during heat treatment; use in making circuit boards |
| 06/21/2007 | DE102005060235A1 Part for a coating system comprising a metal body with flat and narrow sides with a metal coating useful for electroplating narrow sides of flat metal parts, e.g. with Cr coating |
| 06/20/2007 | EP1798314A1 Leveler compounds |
| 06/20/2007 | CN1985333A Conductive material for connecting part and method for manufacturing the conductive material |
| 06/20/2007 | CN1985026A Multi-chemistry plating system |
| 06/20/2007 | CN1984737A Tool holder with vibration damping means and a method for manufacturing the same |
| 06/20/2007 | CN1982521A System part and chromium plating-process |
| 06/19/2007 | US7233072 Electronic part and surface treatment method of the same |
| 06/14/2007 | US20070135022 Apparatus for reduction of defects in wet procssed layers |
| 06/14/2007 | US20070131557 low-resistance; improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) |
| 06/14/2007 | US20070131542 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 06/13/2007 | EP1795336A1 Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same |
| 06/13/2007 | CN2910969Y Electroplating apparatus for semiconductor package rear terminal frame |
| 06/13/2007 | CN1981565A Flexible printed wiring board terminal part or flexible flat cable terminal part |
| 06/13/2007 | CN1321226C Plating machine and process for producing film carrier tapes for mounting electronic parts |
| 06/12/2007 | US7229916 Method of manufacturing a semiconductor device |
| 06/12/2007 | US7229544 cells of the mask comprise independently controllable electrodes; pattern of dielectric material extends beyond the electrodes for contacting the substrate and for forming electrochemical process pockets when contacted ; deposition selectivity |
| 06/07/2007 | WO2007063951A1 Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same |
| 06/07/2007 | US20070128869 Method and apparatus for annealing copper films |
| 06/06/2007 | EP1793017A1 Plating apparatus and plating liquid removing method |
| 06/06/2007 | EP1791693A1 Electroplated metals with silvery-white appearance and method of making |
| 06/06/2007 | EP1638732A4 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
| 06/06/2007 | EP1377441A4 Coated article having a stainless steel color |
| 06/06/2007 | CN1974871A Double titanium-base anode voltage controlling system for continuous strip steel galvanizing electrobath |
| 06/06/2007 | CN1320672C Nano-electrolytic copper foil suitable to lithium ion cell and preparation method |
| 06/05/2007 | US7226634 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness |
| 06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |
| 05/31/2007 | WO2007061112A1 Circuit member, method for manufacturing circuit member, and semiconductor device comprising circuit member |
| 05/31/2007 | US20070119715 Corrosion Resistant Wire Products and Method of Making Same |
| 05/31/2007 | DE202004021264U1 Korrosionsschicht und gehärtetes Stahlbauteil Corrosion layer and hardened steel component |
| 05/30/2007 | EP1313895B1 Method for metal coating the surface of high temperature superconductors |
| 05/30/2007 | CN1319145C Apparatus and method of substrate surface treatment of integrated circuit |
| 05/30/2007 | CN1319130C Apparatus for handling semiconductor substrate, method for handling semiconductor substrate |
| 05/30/2007 | CN1318651C Plating apparatus, plating method and method for manufacturing semiconductor device |
| 05/29/2007 | US7223690 Substrate processing method |
| 05/29/2007 | US7223481 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 05/29/2007 | US7223323 Multi-chemistry plating system |
| 05/24/2007 | WO2007057528A1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 05/24/2007 | US20070117379 Multiple seed layers for interconnects |
| 05/24/2007 | US20070117365 Plating method and apparatus |
| 05/24/2007 | US20070114133 Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| 05/23/2007 | EP1788585A1 Conductive material for connecting part and method for manufacturing the conductive material |
| 05/23/2007 | EP1526943B1 Brazing product and method of manufacturing a brazing product with use of a plating bath |
| 05/23/2007 | CN1969065A Device and method for electrolytically treating flat work pieces |
| 05/17/2007 | US20070111016 Laser ablation resistant copper foil |
| 05/17/2007 | US20070107756 Meniscus proximity system for cleaning semiconductor substrate surfaces |
| 05/16/2007 | CN1965109A Method for imparting resistance to hydrogen to article |
| 05/16/2007 | CN1962962A Plating tank |
| 05/16/2007 | CN1962957A Method for ultrasonic electroplating of diamond drilling bit |
| 05/16/2007 | CN1962956A System and method for electrolytic plating |
| 05/16/2007 | CN1316570C Planar metal electroprocessing |
| 05/16/2007 | CN1316557C Method and system to provide electrical contacts for electrotreating processes |
| 05/16/2007 | CN1316066C Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 05/15/2007 | US7217464 Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method |
| 05/15/2007 | US7217353 Pretreatment; removal bubbles adsorbed on substrate; rotation, immersion in plating solution |
| 05/10/2007 | US20070102299 Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures |
| 05/09/2007 | EP1784064A1 Flexible printed wiring board terminal part or flexible flat cable terminal part |
| 05/09/2007 | CN1961099A Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 05/09/2007 | CN1960799A Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
| 05/09/2007 | CN1958873A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 05/09/2007 | CN1958871A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 05/09/2007 | CN1958868A Plating apparatus and manufacturing process for semiconductor device |
| 05/09/2007 | CN1958865A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 05/09/2007 | CN1315158C Method for selective electroplating of semiconductor device i/o pads |
| 05/09/2007 | CN1314839C Copper bath capable of depositing lackluster copper coat and method thereof |
| 05/08/2007 | US7215235 Conductive substrate with resistance layer, resistance board, and resistance circuit board |
| 05/08/2007 | US7214440 Metallic separator for fuel cell and production method for the same |
| 05/08/2007 | US7214305 forming concave zone in substrate surface; forming an electroconductive seed layer; electrolytic plating |
| 05/08/2007 | US7214297 Substrate support element for an electrochemical plating cell |
| 05/03/2007 | WO2007049456A1 Multilayer electronic component and its manufacturing method |
| 05/02/2007 | EP1780313A2 Treated Aluminum Article And Method For Making Same |
| 05/02/2007 | EP1778896A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 05/02/2007 | EP1702018A4 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 05/02/2007 | CN1957115A Method for electroplating bath chemistry control |
| 05/02/2007 | CN1957113A External palladium plating structure of semiconductor component and semiconductor device manufacturing method |
| 05/01/2007 | US7211186 Forming conductive layers on a semiconductor wafer surface without losing space on the surface by clamping; a relative motion, rotational and lateral, established between the contacts and the wafer surface; consistancy |
| 05/01/2007 | US7211174 Method and system to provide electrical contacts for electrotreating processes |
| 05/01/2007 | CA2178724C Cracking processes |
| 04/26/2007 | WO2007046327A1 Negative electrode for rechargeable battery with nonaqueous electrolyte |
| 04/25/2007 | EP1777736A1 Electrolytic processing device and substrate processing apparatus |
| 04/25/2007 | EP1776739A2 Laser ablation resistant copper foil |
| 04/25/2007 | EP1776492A1 Method for providing a metal coating on plastic capacitor films and device for carrying out said method |
| 04/25/2007 | CN1952217A Process for applying waste and old zinc to continuous zinc coating of steel plate |
| 04/24/2007 | US7208349 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 04/24/2007 | US7208073 Media for use in plating electronic components |
| 04/24/2007 | US7208070 Stent manufacture |