Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
09/2007
09/20/2007WO2007105635A1 Surface treated elctrolytic copper foil and process for producing the same
09/20/2007WO2007087795A3 Oligodynamically effective device and method for production thereof
09/20/2007US20070215481 In-situ cleaning processes for semiconductor electroplating electrodes
09/19/2007CN101039743A Filter for purifying hydrogen and method for manufacture thereof
09/19/2007CN101037781A Zinc alloy slide fastener electroplating device
09/13/2007WO2007101363A1 An automatic device for plating inside the hollow workpieces
09/13/2007US20070212566 Composite copper foil and method for production thereof
09/12/2007CN200946165Y Wringing roller surface cleaning and quality checking device
09/11/2007US7268438 Semiconductor element including a wet prevention film
09/11/2007US7268021 Lead frame and method of manufacturing the same
09/11/2007US7267749 Workpiece processor having processing chamber with improved processing fluid flow
09/07/2007WO2007099210A1 Method for electrochemically structuring a conductuve or semiconductor material, and device for implementing it
09/05/2007EP1766106A4 Pulse reverse electrolysis of acidic copper electroplating solutions
09/05/2007CN200943579Y Tungsten-plating base amorphous alloy antiseptic oil pump
09/05/2007CN101029410A Fluidized-bed preplating reactor and preplating method
09/05/2007CN100336219C Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof
09/05/2007CN100335200C Process for electrolytic coating of a strand casting mould
09/04/2007US7264988 Electro-and electroless plating of metal in the manufacture of PCRAM devices
09/04/2007US7264698 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/04/2007US7264007 Method and apparatus for cleaning a substrate using megasonic power
08/2007
08/30/2007WO2007097356A1 Ultrafine coaxial line and ultrafine coaxial barrel and production method for them
08/30/2007WO2007097338A1 Plating material and electrical and electronic component using the plating material
08/30/2007WO2007097335A1 Plating apparatus and method of plating
08/30/2007US20070202246 Designing a plated pattern in printed wiring board
08/29/2007EP1826296A1 Process and apparatus for the manufacturing of an embossed and galvanised die-cast component
08/29/2007EP1826295A1 METHOD FOR FORMING Sn-Ag-Cu THREE-ELEMENT ALLOY THIN FILM ON BASE
08/29/2007EP1826294A1 Process for electroplating metallic and metal matrix composite foils and microcomponents
08/29/2007EP1825030A1 Method and apparatus for coating a medical device by electroplating
08/29/2007EP1825029A1 Strong, lightweight article containing a fine-grained metallic layer
08/29/2007EP1753896B1 Method and system for selectively coating or etching surfaces
08/29/2007EP1636845A4 Wet chemical processing chambers for processing microfeature workpieces
08/29/2007CN101027431A Plating method and plating apparatus
08/29/2007CN101024890A Wire material electroplating or pretreating heating technology
08/28/2007US7262132 Metal plating using seed film
08/28/2007CA2462295C Elemental silicon nanoparticle plating and method for the same
08/23/2007WO2007095434A2 Internal coating technique for non-cylindrical components
08/23/2007US20070193884 Method for producing a composite copper wire
08/22/2007EP1821368A1 Connector between substrates, and circuit board device using connector between substrates
08/22/2007EP1820667A1 Pneumatic tire
08/22/2007CN1333442C Plating system with remote secondary anode for semiconductor manufacturing
08/22/2007CN101023205A Method for producing rare earth element based permanent magnet having copper plating film on surface thereof
08/22/2007CN101023204A Plating apparatus
08/21/2007US7259095 Semiconductor device and manufacturing process therefor as well as plating solution
08/16/2007WO2007091602A1 Process for production of rare earth permanent magnets having copper plating films on the surfaces
08/16/2007US20070191761 Method of molding for microneedle arrays
08/15/2007EP1818428A1 Method of electrolytic ceramic coating for metal, electrolyte for use in electrolytic ceramic coating for metal and metal material
08/15/2007EP1817443A2 Membrane-limited selective electroplating of a conductive surface
08/15/2007CN1332066C Multilayer plated fuel line parts for automobile
08/15/2007CN101016645A Plating apparatus, plating cup and cathode ring
08/15/2007CN101016644A Internal heat spreader plating methods and systems
08/15/2007CN101016640A Method of electrodepositing metal bellows and cathode rotation device
08/15/2007CN101016638A Method for direct electroplating of copper onto a non-copper plateable layer
08/14/2007US7256495 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/14/2007US7256115 Asymmetric plating
08/09/2007WO2007088600A1 Process for producing ceramic electronic part, and plating bath
08/09/2007WO2007087795A2 Oligodynamically effective device and method for production thereof
08/09/2007US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing
08/09/2007US20070181326 Electromagnetic wave shielding film and method for producing the same
08/09/2007US20070180671 Machine for forming a pattern on a nonwoven and process for manufacturing a sleeve for this machine
08/08/2007EP1816730A1 Process for producing permanent magnet for use in automotive ipm motor
08/08/2007CN1330795C Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
08/08/2007CN101014460A Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same
08/08/2007CN101012570A Method for plating hard chrome on complex bore element and special fixture therefor
08/02/2007WO2007086510A1 Plating apparatus and plating method
08/02/2007WO2006061081A3 Electrochemical deposition of tantalum and/or copper in ionic liquids
08/02/2007US20070176619 Probe For Semiconductor Devices
08/02/2007US20070175759 Apparatus and method for deposition of an electrophoretic emulsion
08/02/2007US20070175752 Anolyte for copper plating
08/01/2007EP1813375A1 Electric arc welding wire with an electrically conductive layer of copper or copper alloy
08/01/2007CN1329968C Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/01/2007CN1329946C Method of forming semiconductor apparatus
08/01/2007CN1329550C Steel wire with bright looking surface
08/01/2007CN101008614A Method of monitoring depositing temperature of cu seed layer and method for forming cu layer by using the same
07/2007
07/31/2007CA2341192C Non-lambertian glass diffuser and method of making
07/31/2007CA2337246C Casting steel strip
07/26/2007US20070172625 Reflective or Semi-Reflective Metal Alloy Coatings
07/25/2007CN1328733C Conductor for flat cabal and its producing method and flat cabal
07/25/2007CN101003907A Method for preparing metal and dielectric composite grains of silicon dioxide coated by Nano silver
07/24/2007US7247563 Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)
07/24/2007US7247226 Coating support and method for the selective coating of conductive tracks on one such support
07/24/2007US7247223 Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
07/24/2007US7247222 Electrochemical processing cell
07/18/2007CN2923745Y Piston ring chromium-plating claming machine
07/18/2007CN1327479C Method of manufacturing electronic device
07/18/2007CN1326692C Nickel plated metal printing masterplate and its producing method
07/17/2007US7245006 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
07/17/2007US7244347 Method and system to provide electrical contacts for electrotreating processes
07/12/2007US20070160315 Bearings
07/12/2007US20070158197 Anodized substrate layer with solid lubricant
07/11/2007CN1995475A Diameter-controllable nm-tube array preparation method
07/11/2007CN1995473A Enivironment-friendly type surface treatment process for electrolytic copper foil
07/11/2007CN1995468A Diameter-controllable metal nm-line array preparation method
07/11/2007CN1325696C Heat-resistance protection film, its manufacture method and electric electronic element
07/10/2007US7241372 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated
07/10/2007US7240679 System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
07/05/2007US20070151858 Method and electrode for defining and replicating structures in conducting materials
07/05/2007DE10205586B4 Verfahren und Vorrichtung zur galvanischen Beschichtung von Endlosmaterial Method and apparatus for electroplating of continuous media
07/04/2007CN1993501A Composite copper foil and method for production thereof
07/03/2007US7238615 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment
07/03/2007US7238264 Galvanizing device
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