| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 08/02/2005 | US6923892 Method for electrodeposited film formation, method for electrode formation, and apparatus for electrodeposited film formation |
| 07/28/2005 | WO2005069705A1 Metal pattern and process for producing the same |
| 07/28/2005 | WO2005068688A2 Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
| 07/28/2005 | US20050164495 Method to improve planarity of electroplated copper |
| 07/28/2005 | US20050162835 Production of via hole in flexible circuit printable board |
| 07/28/2005 | US20050161338 activation of conductive surface on semiconductors and to depositing capping layers on the conductive layers as part of electronics |
| 07/28/2005 | US20050160977 Method and apparatus for fluid processing a workpiece |
| 07/28/2005 | DE102004001107A1 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
| 07/27/2005 | EP1557484A2 Aluminium sheet embossing roll |
| 07/27/2005 | CN1647264A Method for the production of thin metal-containing layers having low electrical resistance |
| 07/27/2005 | CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 07/27/2005 | CN1646263A Electrochemical mechanical processing with advancible sweeper |
| 07/27/2005 | CN1645570A Method for removing particles from wafer surface |
| 07/27/2005 | CN1644760A Manufacture of composite aluminum products |
| 07/27/2005 | CN1212680C Surface treatment steel plate for battery case, battery case and battery using the case |
| 07/27/2005 | CN1212425C Non-cyanide gold imitation electro plating method of flowers and plants |
| 07/26/2005 | US6921551 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits |
| 07/26/2005 | US6921468 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 07/26/2005 | CA2402205C Brazing sheet product and method of manufacturing an assembly using the brazing sheet product |
| 07/26/2005 | CA2233329C Method for electrolytic deposition of metal coatings |
| 07/21/2005 | WO2005067354A1 Printed wiring board, method for manufacturing same, and circuit device |
| 07/21/2005 | WO2005066392A2 Surface structuring by means of a film |
| 07/21/2005 | WO2005065436A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 07/21/2005 | WO2005065433A2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| 07/21/2005 | WO2005065430A2 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
| 07/21/2005 | WO2005065281A2 Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same |
| 07/21/2005 | WO2005017971A3 Nanomachined and micromachined electrodes for electrochemical devices |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | US20050159281 Aluminum sheet embossing roll |
| 07/21/2005 | US20050158574 A printed circuit board having high-density wiring of ultra-fine width and line/spacing of <15 mu m or less where a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, use of electrolytic copper foil having a specific roughness profile specific; antipeeling agents |
| 07/21/2005 | US20050157475 Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| 07/21/2005 | US20050155869 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis |
| 07/21/2005 | US20050155864 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece |
| 07/20/2005 | EP1554414A2 Aqueous alkaline zincate solutions and methods |
| 07/20/2005 | CN1641075A Magnesium and Mg alloy surface activating method and surface palting method |
| 07/19/2005 | US6919012 Method of making a composite article comprising a ceramic coating |
| 07/19/2005 | US6919011 Electrolytic cell; vibration, agitation |
| 07/19/2005 | CA2224382C An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys |
| 07/14/2005 | WO2005064044A1 Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil |
| 07/14/2005 | WO2005064043A2 Improved metal strip electroplating |
| 07/14/2005 | WO2004101856A3 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization |
| 07/14/2005 | WO2004081261B1 Plating apparatus |
| 07/14/2005 | US20050153532 Methods and apparatus to reduce growth formations on plated conductive leads |
| 07/14/2005 | US20050153154 Metal hydride composite materials |
| 07/14/2005 | US20050150773 Method for forming deposition film and method for producing photovoltaic device |
| 07/14/2005 | US20050150770 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 07/14/2005 | DE10361119A1 Metal object, in particular injection molding tool, manufacture involves repeated electrolytic deposition of metal onto a masked flat surface to build up a three-dimensional structure |
| 07/14/2005 | CA2551273A1 Improved metal strip electroplating |
| 07/13/2005 | EP1553212A1 Electromagnetic wave shield material and process for producing the same |
| 07/13/2005 | EP1553211A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 07/13/2005 | EP1552415A2 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 07/13/2005 | CN1638604A Method and device for contactless treatment of flat objects in through type treatment equipment |
| 07/13/2005 | CN1638603A Method and device for treating flat objects in through type treating apparatus |
| 07/13/2005 | CN1637173A Anode unit for continuous electroplating of belt poor conductor |
| 07/13/2005 | CN1637172A Anode unit for continuous electroplating of linear poor conductor |
| 07/13/2005 | CN1637168A Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method |
| 07/13/2005 | CN1637166A Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby |
| 07/12/2005 | US6916741 Capture compounds for electronic plating compositions and electronic packaging device manufacture |
| 07/12/2005 | US6916518 Electroplating a metal powder layer, printing a pattern on the metal layer, etching, shaping caused pattern to protrude, washing; cartoon adhesive paper or tattoo stickers for decoration |
| 07/12/2005 | US6916413 Electro-plating apparatus and method |
| 07/12/2005 | US6916412 Divided housing |
| 07/12/2005 | CA2238061C Protective coating for metallic parts offering good corrosion resistance in salt air, and the metallic parts covered with such a protective coating |
| 07/07/2005 | US20050148197 Substrate proximity processing structures and methods for using and making the same |
| 07/07/2005 | US20050145997 Layer sequence for producing a composite material for electromechanical components |
| 07/07/2005 | US20050145503 Platinum aluminide coating and method thereof |
| 07/07/2005 | US20050145501 Utilizing a high-volume, high-energy electro-deposition plating for coating soft metal or alloys( tin, pb, au, ag, ni, cu or indium) to resilience metal seal (stainless steel ); enhanced leakage control of the seals; continuously moving the seals in series through an electro-plating stage |
| 07/07/2005 | US20050145500 Plating apparatus, plating method, and manufacturing method of semiconductor device |
| 07/07/2005 | US20050145499 Using electrolytic cell; uniformity |
| 07/07/2005 | US20050145484 Apparatus for avoiding particle accumulation in electrochemical processing |
| 07/07/2005 | US20050145265 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 07/06/2005 | EP1550739A1 Plated polyester resin article and method for production thereof |
| 07/06/2005 | EP1419289B1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 07/06/2005 | CN1636085A Brazing sheet product and method of its manufacture |
| 07/06/2005 | CN1636084A Dynamic pulse plating for high aspect ratio features |
| 07/06/2005 | CN1636083A Copper bath capable of depositing lackluster copper coat and method thereof |
| 07/06/2005 | CN1636073A Heat treatment method for a cold-rolled strip with an Ni and/or Co surface coating, sheet metal producible by said method and battery can producible by said method |
| 07/06/2005 | CN1635652A A method for tin barrel plating of alkali manganese cell copper needle |
| 07/06/2005 | CN1635188A Copper pin indium barrel plating process for cell |
| 07/06/2005 | CN1209493C Plasma electroplating |
| 07/05/2005 | US6913791 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
| 07/05/2005 | US6913681 Plating method and plating apparatus |
| 07/05/2005 | US6913680 Applying a voltage between anode and plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface. |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 07/05/2005 | US6913184 Alloy composition and method for low temperature fluxless brazing |
| 07/05/2005 | US6912771 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
| 06/30/2005 | US20050142846 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 06/30/2005 | US20050142374 Flexible copper foil structure and fabrication method thereof |
| 06/30/2005 | US20050141830 Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby |
| 06/30/2005 | US20050139968 Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
| 06/30/2005 | US20050139482 Plating method and plating apparatus |
| 06/30/2005 | US20050139478 forming copper seed layer by applying electroplating power with current density of between about 1.0 mA/cm2 and about 5.0 mA/cm2, in periodic pulses; enhancing the deposition of copper layer; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 06/30/2005 | CA2549526A1 Rolling bearing having a nickel-phosphorus coating |
| 06/29/2005 | EP1546435A1 Method for pretreating a surface of a non-conducting material to be plated |
| 06/29/2005 | CN1632176A Process of gold plating for industrial pure titanium |
| 06/29/2005 | CN1632175A Method for reducing coating hydrogen embrittlement degree |
| 06/29/2005 | CN1632174A Electroplating isolation glue |
| 06/29/2005 | CN1208782C Aqueous carbon composition and method for coating a non-conductive substrate |
| 06/29/2005 | CN1208503C Titanium base material platinum coating method |
| 06/29/2005 | CN1208139C Low etch alkaline zincate composition and process for zincating aluminum |
| 06/28/2005 | US6911396 Method of producing metallic film |