Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
09/2005
09/01/2005DE102004019370B3 Production of optionally coated structurized hard chrome layer, used e.g. for decoration, protection or functional coating on printing roller or stamping, embossing or deep drawing tool uses aliphatic sulfonic acid in acid plating bath
09/01/2005DE102004006562A1 Method of forming lead strip materials, for battery electrode grids, involves coating lead strip materials with a plated metal or alloy in one or more plating baths
09/01/2005DE102004006098A1 Coating articles comprises applying first corrosion-resistant metallic coating to article, applying second corrosion-resistant metallic coating over first coating and partially removing second coating to expose first
08/2005
08/31/2005CN1663329A Production of via hole in flexible circuit printable board
08/31/2005CN1663036A Electropolishing metal layers on wafers having trenches or vias with dummy structures
08/31/2005CN1662679A Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/31/2005CN1662117A Wired circuit substate
08/31/2005CN1661793A Mfg. method for conductor fig.
08/31/2005CN1217034C Workpiece processor having processing chamber with improved processing fluid flow
08/31/2005CN1217030C Method for plating polymer molding material, circuit forming component and method for producing circuit forming component
08/30/2005US6936925 Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface
08/25/2005WO2005079130A1 Copper foil having blackened surface or layer
08/25/2005WO2005078823A1 Plated steel sheet for battery container, battery container using such plated steel sheet, and battery using such battery container
08/25/2005WO2005078165A1 Method of anodizing metallic surfaces and compositions therefore
08/25/2005WO2005078164A2 Method of anodizing metallic surfaces and compositions therefore
08/25/2005WO2005078162A1 Diamond tool
08/25/2005WO2005078161A1 Electroplating in presence of co2
08/25/2005WO2005077677A1 Physical vapor deposition components, and methods of treating components
08/25/2005WO2005076977A2 Plating apparatus and method
08/25/2005US20050184369 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/25/2005US20050183960 Selective electroless deposition; conductive polymer as seed layer for plating the metal electrode; semiconductor processing, lithographic techniques for metal patterning on a ferroelectric polymer layer; eliminates aggressive and environmentally unsafe chemical based photoresist removal processes
08/25/2005DE102004006127A1 Verfahren zur Herstellung von korrosionsbeständigen und dekorativen Beschichtungen und Schichtsystemen für Substrate aus Metallen A process for producing corrosion-resistant and decorative coatings and coating systems for substrates made of metals
08/24/2005EP1566460A1 Cold rolled steel sheet for gasket material, method for production thereof and gasket material produced by the method
08/24/2005EP1565597A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating
08/24/2005CN1659936A Flexible printed circuit board and process for producing the same
08/24/2005CN1659317A Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
08/24/2005CN1659315A Apparatus and methods for electrochemical processing of microelectronic workpieces
08/24/2005CN1659296A Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus
08/24/2005CN1216385C Thin film resistor element and its producing method
08/23/2005US6933052 Diffusion barrier and protective coating for turbine engine component and method for forming
08/23/2005US6933008 Lead-coated complex porous structures and corresponding method of conductive activation
08/23/2005US6932897 Titanium-containing metals with adherent coatings and methods for producing same
08/23/2005US6932896 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits
08/23/2005US6932874 Method for increasing the copper to superconductor ratio in a superconductor wire
08/18/2005WO2005076680A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
08/18/2005WO2005075697A1 High-carbon steel wire with nickel sub coating
08/18/2005WO2005075696A2 Low-carbon steel wire with nickel sub coating
08/18/2005WO2003095712A3 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
08/18/2005WO2003095711A3 Electrochemically fabricated structures having dielectric or active bases
08/18/2005WO2003095708A3 Methods of and apparatus for molding structures
08/18/2005US20050181316 With improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process
08/18/2005US20050181315 Provides simplified data manipulation techniques for defining cross-sectional data representing layers of structure (microscale or mesoscale) that are to be formed where data takes the form of a plurality of adjacent and similarly oriented, elongated rectangular structures
08/18/2005US20050181252 Polymer electrolyte membrane for electrochemical and other applications
08/18/2005US20050178669 Method of electroplating aluminum
08/18/2005US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers
08/18/2005US20050178667 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith
08/18/2005US20050178666 to effectively provide a surface having a desired pattern; masking; electrochemical deposition; conductive base structure comprises a fabric layer; woven conductive fiber material or a woven dielectric fiber at least partially covered with a conductive material
08/18/2005US20050178665 Electroplating tool
08/18/2005US20050178664 Method of anodizing metallic surfaces and compositions therefore
08/17/2005EP1564311A1 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon
08/17/2005EP1388186A4 Electrically conductive patterns, antennas and methods of manufacture
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/17/2005CN2717985Y Electroplating device with function of rectifying and voltage detecting
08/17/2005CN1656243A Shields usable with an inductively coupled plasma reactor
08/17/2005CN1655893A Process for electrolytic coating of a strand casting mould
08/17/2005CN1215202C Porous nickel foil for alkaline battery cathode, production method and device therefor
08/16/2005US6930266 Push-button switch
08/16/2005US6929723 Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
08/11/2005WO2005074026A2 Tin-based coating of electronic component
08/11/2005WO2005073437A1 Composite chromium plating film, and sliding member having the film and method for manufacture thereof
08/11/2005WO2005073435A1 Sealing agent, method of sealing and printed circuit board treated with the sealing agent
08/11/2005WO2005047570A3 Surface finishing method for silver and its alloys
08/11/2005WO2004099460B8 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface
08/11/2005US20050176267 Press-fit terminal
08/11/2005US20050176238 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
08/11/2005US20050175785 Applying an adhesion layer to a substrate by chromatizing or phosphatizing; lacquering; plasma enhanced vapor deposition of the metal and galvanic application of the chrome plating
08/11/2005US20050174722 Flexible printed circuit board and process for producing the same
08/11/2005US20050173374 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
08/11/2005US20050173254 applying currents to electrolytic baths containing brighteners, ionic nickel, cobalt and boron, so that alloy are depositied on the cathode; electrodeposition/metals
08/11/2005US20050173253 Minimizing voids and cracks from thermal shock; dispensing heat processing fluid onto substrate prior to annealing; high throughput
08/11/2005US20050173252 electroplating the copper ions from the plating solution directly onto the barrier layer of a microelectronic workpiece; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures
08/11/2005US20050173251 Hydrophilic treatment method and wiring pattern forming method
08/11/2005US20050173243 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
08/11/2005DE102004003412A1 Process for high rate electrodeposition on metals and substrates by a pulsed stream technique to avoid dendritic crystal growth useful for corrosion protection of components in the automobile industry
08/10/2005EP1562412A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
08/10/2005EP1562409A2 Hydrophilic treatment and wiring pattern formation including It
08/10/2005EP1561843A2 Process for the production of corrosion resistant and decorative coatings and coating systems for substrates of light-metal or light-metal alloys
08/10/2005EP1560949A1 Integrated plating and planarization process and apparatus therefor
08/10/2005CN1652667A Hydrophilic treatment method and wiring pattern forming method
08/10/2005CN1651607A Process for the production of corrosion resistant decorative coatings and coating systems for substrates of light-metal
08/10/2005CN1214134C Conditioning composition for improving adhesion and covering rate of conductive coating on surface with through hole and method for making welding surface non-air hole
08/10/2005CN1214133C Method and apparatus for electrochemical mechanical deposition
08/09/2005US6927072 Method of applying cladding material on conductive lines of MRAM devices
08/09/2005US6926818 Method to enhance the adhesion between dry film and seed metal
08/09/2005US6926816 computer simulation in the pattern plating
08/09/2005US6926813 Electrical contacting element made of an elastic material
08/04/2005WO2005072040A1 Electromagnetic shielding film and method for manufacturing same
08/04/2005US20050170201 wear resistant coating for air plane parts; low compressive residual stress, adhesion to ferrous, nickel alloys, low fatigue debit, corrosion resistant crack free structure; meets or exceeds engineering properties of hard chromium plating; no chemicals restricted by Environmental Protection Agency
08/04/2005US20050170198 Includes an intermediate layer that contains at least one element selected from Mo, Cr, Ni, Si, Fe, Al and an oxygen and water barrier film; can enhance the bonding strength between a conductive layer and a polyimide film at high temperatures
08/04/2005US20050167276 Process for electrolytic coating of a strand casting mould
08/04/2005US20050167275 Method and apparatus for fluid processing a workpiece
08/04/2005US20050167274 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167273 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167265 System for electrochemically processing a workpiece
08/03/2005CN1649038A Conductor for flat cabal and its producing method and flat cabal
08/03/2005CN1213645C Method for producing surface treated copper foil
08/03/2005CN1213174C Process for anodizing aluminium materials and application members whereby
08/03/2005CN1213169C Light metal alloy surface coating method
08/02/2005US6924043 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
08/02/2005US6923897 Coating nickel with a cobalt containing layer in a galvanic process; low electrical contact resistance between cathode and inside of the cupular battery shell