Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
10/2005
10/05/2005CN1678428A Brazing product and method of manufacturing a brazing product
10/05/2005CN1222203C Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet
10/04/2005US6951765 Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor
09/2005
09/29/2005WO2005091074A1 Positively radiation-sensitive resin composition
09/29/2005WO2005090454A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
09/29/2005WO2004083491A8 Method for the production of sanitary fittings with a stainless steel finish
09/29/2005US20050216291 Complete mold system
09/29/2005US20050215079 Method for making thin-film semiconductors based on i-III-vi<sb>2</sb> compounds, for photovoltaic applications
09/29/2005US20050215046 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
09/29/2005US20050214564 Honeycomb structure thermal barrier coating
09/29/2005US20050214542 Plating a semi-bright Ni finish layer onto a base metal of an automotive part, particularly a seat belt tongue; overplating with a bright Ni finish layer; and overplating with a Ni alloy layer having a Vickers hardness of 400 VHN or greater.
09/29/2005US20050211563 stabilizer selected from sodium citrate, potassium citrate or ammonium citrate, for increasing the stability of metal electrodeposition
09/29/2005US20050211562 Electroplating a thin dense chromium layer by immersing in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics; electrochemistry
09/29/2005US20050211560 applying cothodic potentials to electroconductive layers formed on substrate having depression patterns, then dipping in a solution that is in contact with an anode, to form films; electrochemistry; electrodepostion
09/29/2005US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/29/2005US20050211461 Flat cable conductor, method of making the same and flat cable using the same
09/29/2005DE102004026489B3 Verfahren zur Metallisierung von Kunststoffoberflächen Process for the metallization of plastic surfaces
09/28/2005EP1580300A1 Process for increasing strength, flexibility and fatigue life of metals
09/28/2005EP1579463A2 Method for increasing the copper to superconductor ratio in a superconductor wire
09/28/2005EP1455981B1 Wire for high-speed electrical discharge machining
09/28/2005EP0886894B1 Contact carriers for populating substrates with spring contacts
09/28/2005CN1674359A 压配合端子 Press-fit terminal
09/28/2005CN1674231A Plating apparatus
09/28/2005CN1220798C Pad designs and structures for universal material working equipment
09/27/2005US6949172 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement
09/27/2005US6949171 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
09/22/2005WO2005087981A1 Steel sheet for fuel tank and method for manufacture thereof
09/22/2005WO2005066392A3 Surface structuring by means of a film
09/22/2005US20050208340 Magnetic thin film head
09/22/2005US20050205430 Treatment of substrates, formation of multilayer three dimensional structure; contact masks; selectively etching the deposit of the first material to form a void; mating surface of contact mask and substrate at a low relative speed prior to contact
09/22/2005US20050205429 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
09/22/2005US20050205425 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
09/22/2005US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces
09/22/2005US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/22/2005DE202005011141U1 Galvanic bath with electrolyte injector for surface treatment of suspended workpieces with guide plates, upper lower, and side plates and anode plates useful in electrodeposition of metals
09/22/2005DE10297178T5 Korrosionsbeständige Beschichtungsfilmstruktur des nichtsechswertigen Chromtyps, die eine Kunstharzschicht und eine Metallschicht aufweis, die im Hinblick auf die Adhäsion an der Kunstharzschicht überlegen ist A corrosion resistant coating film structure of nichtsechswertigen chromium type, the demonstration of a synthetic resin layer and a metal layer that is superior in terms of adhesion to the resin layer
09/21/2005EP1576207A2 Methods of and apparatus for molding structures
09/21/2005CN1671886A Multilayer plated fuel line parts for automobile
09/21/2005CN1670261A Aluminium sheet embossing roll
09/21/2005CN1670260A Conductor roll restoring method
09/21/2005CN1669788A Metallized polyimide film
09/20/2005US6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness
09/20/2005US6946065 cathodic polarization; vapor deposition; bottom-up filling of trenches/vias within sidewalls to avoid production of seams/voids; for production of integrated circuits
09/20/2005CA2358667C Apparatus for controlling flow in an electrodeposition process
09/15/2005WO2005085498A1 Metal surface treating agent
09/15/2005US20050203637 Structures and devices for parenteral drug delivery and diagnostic sampling
09/15/2005US20050202660 Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
09/15/2005US20050202346 when the sealing rubber is pressed the thin negative resist layer bends because it is made from a flexible resin and capillary phenomenon occurs ao sealing rubber is elastically deformed when entering the plating pattern; thus plating solution does not leak; electrode on semiconductor wafer
09/15/2005US20050202269 Composite magnetic particles and foils
09/15/2005US20050202180 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
09/15/2005US20050201176 Method for the preparation of nanometer scale particle arrays and the particle arrays prepared thereby
09/15/2005US20050199583 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
09/15/2005US20050199505 Manufacturing process of aluminum support for planographic printing plate, aluminum support for planographic printing plate, planographic printing plate material and image formation process
09/15/2005US20050199504 Process for preparing a non-conductive substrate for electroplating
09/15/2005US20050199502 Current density; electrical resistance
09/15/2005DE102005005926A1 Kontaktstecker Contact plug
09/15/2005CA2500921A1 Solution for the electroplating of soft magnetic co-fe-ni alloys
09/15/2005CA2461107A1 Solution for the electroplating of soft magnetic co-fe-ni alloys
09/14/2005EP1574303A1 Cutting tool
09/14/2005EP1573096A1 Method for removing at least one surface area of a component
09/14/2005EP1573095A1 Method for removing at least one surface area of at least two components
09/14/2005EP1573093A1 Method for improving the interaction between electrolyte and component
09/14/2005EP1573092A2 Method and device for filling material separations on a surface
09/14/2005EP1573090A2 Method for the deposition of an alloy on a substrate
09/14/2005EP1572415A1 Brazing sheet product having a clad layer and a coated layer of iron alloy and method of its manufacture
09/14/2005CN1668783A Electromagnetic wave shield material and process for producing the same
09/14/2005CN1667879A Electronic connector terminal, a method for plating, and a terminal stack
09/14/2005CN1667802A Plating method
09/09/2005WO2005082574A1 Methods and apparatuses for electrochemical-mechanical polishing
09/09/2005WO2005064043A3 Improved metal strip electroplating
09/09/2005WO2005017971A9 Nanomachined and micromachined electrodes for electrochemical devices
09/08/2005US20050196963 Methods and apparatuses for electrochemical-mechanical polishing
09/08/2005US20050196634 Metal member and electric contact using same
09/08/2005US20050196523 Uniform copper wiring formation in recesses; heat accelerated solution deposition
09/08/2005US20050194259 conductive particles applied to substrate in such a manner that they are in mechanical and therefore also electrical contact with one another over the entire surface of the substrate. Consequently, it is possible to generate a homogenous i.e. completely continuous, metal layer
09/08/2005US20050194258 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
09/08/2005US20050194257 Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current
09/08/2005US20050194255 Self-activated electroless metal deposition
09/08/2005US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/07/2005EP1570115A2 Method for the electrolytic deposition of magnesium on galvanised sheet metal
09/07/2005EP1570102A2 Method for coating piston rings for internal combustion engines
09/07/2005CN1665958A Precoat metal plate excellent in press workability and method for production thereof
09/07/2005CN1665592A Device and method for increasing mass transport at liquid-solid diffusion boundary layer
09/07/2005CN1664174A Method for copperizing continuously
09/06/2005US6939622 Chip-on-film use copper foil
09/06/2005US6939621 Plated copper alloy material and process for production thereof
09/06/2005US6939455 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
09/06/2005US6939448 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/06/2005US6939447 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
09/01/2005WO2005080633A2 Method for zinc coating aluminum
09/01/2005WO2003071008A3 Methods of and apparatus for making high aspect ratio microelectromechanical structures
09/01/2005US20050191786 Integrated circuit packaging using electrochemically fabricated structures
09/01/2005US20050191473 Wired circuit board
09/01/2005US20050191422 Applying mask material to cooling holes so that holes are at partially filled with mask material in portion closest to external surface and up to the level of the external surface, thickening portion of mask material within cooling holes, coating, removing thickened mask material
09/01/2005US20050189628 Resin composition, process for producing the same and electrophotographic fixing member
09/01/2005US20050189228 Electroplating apparatus
09/01/2005US20050189227 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/01/2005US20050189226 Contacting negatively charged electrode and pattern during immersion and movement of substrate in electrolytic bath; industrial scale, continuous process, economical
09/01/2005US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/01/2005US20050189213 Method and apparatus for copper plating using electroless plating and electroplating