Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
---|
10/05/2005 | CN1678428A Brazing product and method of manufacturing a brazing product |
10/05/2005 | CN1222203C Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
10/04/2005 | US6951765 Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor |
09/29/2005 | WO2005091074A1 Positively radiation-sensitive resin composition |
09/29/2005 | WO2005090454A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material |
09/29/2005 | WO2004083491A8 Method for the production of sanitary fittings with a stainless steel finish |
09/29/2005 | US20050216291 Complete mold system |
09/29/2005 | US20050215079 Method for making thin-film semiconductors based on i-III-vi<sb>2</sb> compounds, for photovoltaic applications |
09/29/2005 | US20050215046 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
09/29/2005 | US20050214564 Honeycomb structure thermal barrier coating |
09/29/2005 | US20050214542 Plating a semi-bright Ni finish layer onto a base metal of an automotive part, particularly a seat belt tongue; overplating with a bright Ni finish layer; and overplating with a Ni alloy layer having a Vickers hardness of 400 VHN or greater. |
09/29/2005 | US20050211563 stabilizer selected from sodium citrate, potassium citrate or ammonium citrate, for increasing the stability of metal electrodeposition |
09/29/2005 | US20050211562 Electroplating a thin dense chromium layer by immersing in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics; electrochemistry |
09/29/2005 | US20050211560 applying cothodic potentials to electroconductive layers formed on substrate having depression patterns, then dipping in a solution that is in contact with an anode, to form films; electrochemistry; electrodepostion |
09/29/2005 | US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces |
09/29/2005 | US20050211461 Flat cable conductor, method of making the same and flat cable using the same |
09/29/2005 | DE102004026489B3 Verfahren zur Metallisierung von Kunststoffoberflächen Process for the metallization of plastic surfaces |
09/28/2005 | EP1580300A1 Process for increasing strength, flexibility and fatigue life of metals |
09/28/2005 | EP1579463A2 Method for increasing the copper to superconductor ratio in a superconductor wire |
09/28/2005 | EP1455981B1 Wire for high-speed electrical discharge machining |
09/28/2005 | EP0886894B1 Contact carriers for populating substrates with spring contacts |
09/28/2005 | CN1674359A 压配合端子 Press-fit terminal |
09/28/2005 | CN1674231A Plating apparatus |
09/28/2005 | CN1220798C Pad designs and structures for universal material working equipment |
09/27/2005 | US6949172 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
09/27/2005 | US6949171 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
09/22/2005 | WO2005087981A1 Steel sheet for fuel tank and method for manufacture thereof |
09/22/2005 | WO2005066392A3 Surface structuring by means of a film |
09/22/2005 | US20050208340 Magnetic thin film head |
09/22/2005 | US20050205430 Treatment of substrates, formation of multilayer three dimensional structure; contact masks; selectively etching the deposit of the first material to form a void; mating surface of contact mask and substrate at a low relative speed prior to contact |
09/22/2005 | US20050205429 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
09/22/2005 | US20050205425 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
09/22/2005 | US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces |
09/22/2005 | US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces |
09/22/2005 | DE202005011141U1 Galvanic bath with electrolyte injector for surface treatment of suspended workpieces with guide plates, upper lower, and side plates and anode plates useful in electrodeposition of metals |
09/22/2005 | DE10297178T5 Korrosionsbeständige Beschichtungsfilmstruktur des nichtsechswertigen Chromtyps, die eine Kunstharzschicht und eine Metallschicht aufweis, die im Hinblick auf die Adhäsion an der Kunstharzschicht überlegen ist A corrosion resistant coating film structure of nichtsechswertigen chromium type, the demonstration of a synthetic resin layer and a metal layer that is superior in terms of adhesion to the resin layer |
09/21/2005 | EP1576207A2 Methods of and apparatus for molding structures |
09/21/2005 | CN1671886A Multilayer plated fuel line parts for automobile |
09/21/2005 | CN1670261A Aluminium sheet embossing roll |
09/21/2005 | CN1670260A Conductor roll restoring method |
09/21/2005 | CN1669788A Metallized polyimide film |
09/20/2005 | US6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness |
09/20/2005 | US6946065 cathodic polarization; vapor deposition; bottom-up filling of trenches/vias within sidewalls to avoid production of seams/voids; for production of integrated circuits |
09/20/2005 | CA2358667C Apparatus for controlling flow in an electrodeposition process |
09/15/2005 | WO2005085498A1 Metal surface treating agent |
09/15/2005 | US20050203637 Structures and devices for parenteral drug delivery and diagnostic sampling |
09/15/2005 | US20050202660 Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions |
09/15/2005 | US20050202346 when the sealing rubber is pressed the thin negative resist layer bends because it is made from a flexible resin and capillary phenomenon occurs ao sealing rubber is elastically deformed when entering the plating pattern; thus plating solution does not leak; electrode on semiconductor wafer |
09/15/2005 | US20050202269 Composite magnetic particles and foils |
09/15/2005 | US20050202180 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
09/15/2005 | US20050201176 Method for the preparation of nanometer scale particle arrays and the particle arrays prepared thereby |
09/15/2005 | US20050199583 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
09/15/2005 | US20050199505 Manufacturing process of aluminum support for planographic printing plate, aluminum support for planographic printing plate, planographic printing plate material and image formation process |
09/15/2005 | US20050199504 Process for preparing a non-conductive substrate for electroplating |
09/15/2005 | US20050199502 Current density; electrical resistance |
09/15/2005 | DE102005005926A1 Kontaktstecker Contact plug |
09/15/2005 | CA2500921A1 Solution for the electroplating of soft magnetic co-fe-ni alloys |
09/15/2005 | CA2461107A1 Solution for the electroplating of soft magnetic co-fe-ni alloys |
09/14/2005 | EP1574303A1 Cutting tool |
09/14/2005 | EP1573096A1 Method for removing at least one surface area of a component |
09/14/2005 | EP1573095A1 Method for removing at least one surface area of at least two components |
09/14/2005 | EP1573093A1 Method for improving the interaction between electrolyte and component |
09/14/2005 | EP1573092A2 Method and device for filling material separations on a surface |
09/14/2005 | EP1573090A2 Method for the deposition of an alloy on a substrate |
09/14/2005 | EP1572415A1 Brazing sheet product having a clad layer and a coated layer of iron alloy and method of its manufacture |
09/14/2005 | CN1668783A Electromagnetic wave shield material and process for producing the same |
09/14/2005 | CN1667879A Electronic connector terminal, a method for plating, and a terminal stack |
09/14/2005 | CN1667802A Plating method |
09/09/2005 | WO2005082574A1 Methods and apparatuses for electrochemical-mechanical polishing |
09/09/2005 | WO2005064043A3 Improved metal strip electroplating |
09/09/2005 | WO2005017971A9 Nanomachined and micromachined electrodes for electrochemical devices |
09/08/2005 | US20050196963 Methods and apparatuses for electrochemical-mechanical polishing |
09/08/2005 | US20050196634 Metal member and electric contact using same |
09/08/2005 | US20050196523 Uniform copper wiring formation in recesses; heat accelerated solution deposition |
09/08/2005 | US20050194259 conductive particles applied to substrate in such a manner that they are in mechanical and therefore also electrical contact with one another over the entire surface of the substrate. Consequently, it is possible to generate a homogenous i.e. completely continuous, metal layer |
09/08/2005 | US20050194258 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
09/08/2005 | US20050194257 Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current |
09/08/2005 | US20050194255 Self-activated electroless metal deposition |
09/08/2005 | US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces |
09/07/2005 | EP1570115A2 Method for the electrolytic deposition of magnesium on galvanised sheet metal |
09/07/2005 | EP1570102A2 Method for coating piston rings for internal combustion engines |
09/07/2005 | CN1665958A Precoat metal plate excellent in press workability and method for production thereof |
09/07/2005 | CN1665592A Device and method for increasing mass transport at liquid-solid diffusion boundary layer |
09/07/2005 | CN1664174A Method for copperizing continuously |
09/06/2005 | US6939622 Chip-on-film use copper foil |
09/06/2005 | US6939621 Plated copper alloy material and process for production thereof |
09/06/2005 | US6939455 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
09/06/2005 | US6939448 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
09/06/2005 | US6939447 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
09/01/2005 | WO2005080633A2 Method for zinc coating aluminum |
09/01/2005 | WO2003071008A3 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
09/01/2005 | US20050191786 Integrated circuit packaging using electrochemically fabricated structures |
09/01/2005 | US20050191473 Wired circuit board |
09/01/2005 | US20050191422 Applying mask material to cooling holes so that holes are at partially filled with mask material in portion closest to external surface and up to the level of the external surface, thickening portion of mask material within cooling holes, coating, removing thickened mask material |
09/01/2005 | US20050189628 Resin composition, process for producing the same and electrophotographic fixing member |
09/01/2005 | US20050189228 Electroplating apparatus |
09/01/2005 | US20050189227 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
09/01/2005 | US20050189226 Contacting negatively charged electrode and pattern during immersion and movement of substrate in electrolytic bath; industrial scale, continuous process, economical |
09/01/2005 | US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces |
09/01/2005 | US20050189213 Method and apparatus for copper plating using electroless plating and electroplating |