Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/2005
11/10/2005WO2005106081A1 Method and system for selectively coating or etching surfaces
11/10/2005WO2005105356A2 Electrochemical mechanical planarization process and apparatus
11/10/2005WO2005065281A3 Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same
11/10/2005US20050250327 Copper plating of semiconductor devices using intermediate immersion step
11/10/2005US20050249969 Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
11/10/2005US20050249968 Whisker inhibition in tin surfaces of electronic components
11/10/2005US20050249927 Copper foil for high-density ultra-fine printed wiring board
11/10/2005US20050247567 Method of plating
11/10/2005US20050247566 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece
11/10/2005US20050247556 Electrolytic reactor
11/10/2005US20050247382 Process for producing a new high-strength dual-phase steel product from lightly alloyed steel
11/10/2005DE10326337B4 Vorrichtung zum Entfernen von Dendriten an den Kanten eines Metall-Bandes An apparatus for removing dendrites at the edges of a metal band
11/09/2005CN1694603A Electrolytic gold plating method of printed circuit board
11/09/2005CN1693538A Method of coating metal layer on roller surface of biroller thin belt continuous casting machine
11/09/2005CN1226468C Rare earth chromium composite electroplating layer preparing method
11/09/2005CN1226467C Method for micro-arc depositing ceramic layer onto positive and negative bipolarities on magnesium alloy
11/09/2005CN1226466C Pre-electroplating treatment process of electronic element
11/09/2005CN1226464C Method for plating dense chromium
11/08/2005US6962649 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
11/03/2005WO2005104268A1 Plated steel plate for cell vessel, cell vessel using the plated steel plate for cell vessel, cell using the cell vessel
11/03/2005WO2005104267A1 Plated steel sheet for battery container, battery container utilizing the plated steel sheet and battery utilizing the battery container
11/03/2005WO2005103340A1 Composite foil, method for producing same, current collector using such composite foil, electrode for nonaqueous electrolyte secondary battery, and nonaqueous electrolyte secondary battery
11/03/2005WO2005065430A3 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
11/03/2005WO2005033377A3 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/03/2005US20050245083 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
11/03/2005US20050242443 A palladium layer and a gold layer are formed by an electrolytic plating on a solderd part having a nickel layer; thickness of the palladium layer is 0.007 to 0.1 mu m; thickness of the gold layer is 0.003 to 0.02 mu; the gold layer partially laps a palladium strike surface
11/03/2005US20050241955 Substrate processing apparatus and substrate processing method
11/03/2005US20050241954 Electrolytic gold plating method of printed circuit board
11/03/2005US20050241953 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying tin sensitizer, rinsing, then palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin
11/03/2005US20050241952 Method for manufacturing semiconductor device
11/03/2005US20050241951 Selective catalytic activation of non-conductive substrates
11/03/2005US20050241950 Method for forming a coating on a wheel and the structure of the coating
11/03/2005US20050241949 Selective catalytic activation of non-conductive substrates
11/03/2005US20050241948 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
11/03/2005US20050241946 electrodeposition of copper or silver; for filling fine interconnect recesses such as trenches and via holes in semiconductor substrate with uniform coatings; control the movement of the conductive layer and the porous member relatively to each other without passing electric current
11/03/2005US20050241945 Plating analyzing method and apparatus
11/03/2005US20050241848 Design and Method for plating PCI express (PCIE) edge connector
11/02/2005EP1590506A1 Stencil manufacture
11/02/2005EP0776385B1 High fatigue ductility electrodeposited copper foil
11/02/2005CN1691416A Electronic part and surface treatment method of the same
11/02/2005CN1691292A Method for manufacturing semiconductor device
11/02/2005CN1690254A Process chamber component having electroplated yttrium containing coating
11/02/2005CN1225571C Zn-Co-W alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it
11/01/2005US6960370 Methods of forming medical devices
11/01/2005US6959853 aluminum-silicon clad aluminum brazing sheet composites; physical vapor deposition and layered sequencing of a metal substrate, eutectic-forming layer and braze-promoting layer; plasma or ion-cleaning minimizes environmental impact
11/01/2005CA2176579C Method and apparatus for electrolytically metallising or etching material
10/2005
10/27/2005WO2005100641A1 Method for imparting excellent resistance to hydrogen to article and article exhibiting excellent resistance to hydrogen
10/27/2005US20050236275 Method of using an etchant solution for removing a thin metallic layer
10/27/2005US20050236274 Methods and apparatus for determining organic component concentrations in an electrolytic solution
10/27/2005US20050236273 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
10/27/2005US20050236060 Multilayer plated fuel line parts for automobile
10/26/2005EP1587968A2 Coating method
10/26/2005EP1587967A1 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same
10/26/2005CN1688746A Method of electroless plating
10/20/2005WO2005098095A1 Method for preparing multi-component alloy onto substrate by molten salt electrolysis
10/20/2005US20050233653 Electronic connector terminal, a method for plating, and a terminal stack
10/20/2005US20050233566 Lead frame and method of manufacturing the same
10/20/2005US20050230264 Electroplating solution and method for electroplating
10/20/2005US20050230262 Electrochemical methods for the formation of protective features on metallized features
10/20/2005US20050230261 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
10/20/2005US20050230260 Plating apparatus and method
10/20/2005DE202005012618U1 Surface structure of an iron object comprises an iron object, a tin coating deposited on the surface of the object and a transparent protective layer for covering the surface of the tin coating
10/19/2005EP1586679A1 Metal plating coating film having sliding function and article coated therewith
10/19/2005CN1685087A Method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys
10/19/2005CN1685086A Electropolishing and electroplating methods
10/19/2005CN1684238A Lead frame and method of manufacturing the same
10/19/2005CN1223702C Plating method of metal film on surface of polymer
10/13/2005WO2005095678A2 Electroplating system and method
10/13/2005WO2005095667A1 Chromium plating
10/13/2005WO2005094438A2 Complete mold system
10/13/2005WO2005094409A2 Process for preparing a non-conductive substrate for electroplating
10/13/2005US20050227483 Planar metal electroprocessing
10/13/2005US20050224361 Plating for automotive part
10/13/2005US20050224360 Titania nanotube arrays for use as sensors and method of producing
10/13/2005US20050224359 Method and apparatus for electroplating
10/13/2005US20050224358 Method for improved local planarity control during electropolishing
10/13/2005US20050224340 System for electrochemically processing a workpiece
10/13/2005CA2559152A1 Electroplating system and method
10/12/2005EP1583871A2 Security film and method for the production thereof
10/12/2005CN1681973A Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case
10/12/2005CN1681971A Surface treated steel plate for battery cases and battery case using same
10/12/2005CN1681967A Non-cyanide copper plating process for zinc and zinc alloys
10/12/2005CN1681964A Plated polyester resin article and method for production thereof
10/12/2005CN1680631A Electrolysis treating method and apparatus
10/12/2005CN1680630A Technology of non-cyanide silver coating
10/12/2005CN1222641C Plating apparatus and method
10/11/2005US6953986 Leadframes for high adhesion semiconductor devices and method of fabrication
10/06/2005WO2005075696A3 Low-carbon steel wire with nickel sub coating
10/06/2005WO2005074026A3 Tin-based coating of electronic component
10/06/2005WO2004113594A3 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
10/06/2005US20050221621 Proximity head heating method and apparatus
10/06/2005US20050221529 Complex microdevices and apparatus and methods for fabricating such devices
10/06/2005US20050221113 Packagin for dilute hypochlorite
10/06/2005US20050218004 Process for making a composite aluminum article
10/06/2005US20050218002 Electroplating using an apparatus with a selective shield/material flow assembly between the anode and the cathode and forming adjustable openings having adjustable sizes for selectively and controllably adjusting the amount of electric flux passing through the assembly and distribution on the workpiece
10/06/2005US20050218000 Conditioning of contact leads for metal plating systems
10/05/2005EP1583138A1 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
10/05/2005EP1583135A1 Proximity head heating method and apparatus
10/05/2005EP1583112A2 Layered product
10/05/2005CN1678429A Brazing product and method of manufacturing a brazing product
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