| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
|---|
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | CN1714412A Method for increasing the copper to superconductor ratio in a superconductor wire |
| 12/28/2005 | CN1714176A Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 12/28/2005 | CN1712573A Surface cladding treatment of ferro-manganese aluminium alloy |
| 12/28/2005 | CN1712562A Non-electrolytic gold plating method on polycarbnate contained resin |
| 12/27/2005 | US6979645 Method of producing a semiconductor device having copper wiring |
| 12/27/2005 | US6979515 Surface-treated steel plate for battery case and battery case |
| 12/27/2005 | US6979393 Method for plating copper conductors and devices formed |
| 12/27/2005 | US6979391 continuous reel-to-reel electrolysis and electrolytic cell; insulating wall between electrodes; one- or two-sided metallization; conductive foils for printed circuits |
| 12/22/2005 | WO2005122297A1 Metal foil with carrier foil, method for producing such metal foil with carrier foil, collector for nonaqueous electrolyte secondary battery using such metal foil with carrier foil |
| 12/22/2005 | US20050282399 Electroformed metallization |
| 12/22/2005 | US20050282371 Sequential station tool for wet processing of semiconductor wafers |
| 12/22/2005 | US20050280498 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/22/2005 | US20050279643 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/22/2005 | US20050279642 Common rack for electroplating and PVD coating operations |
| 12/22/2005 | US20050279641 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 12/22/2005 | US20050279640 Method of forming a lead-free bump and a plating apparatus therefor |
| 12/22/2005 | US20050279638 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode |
| 12/22/2005 | DE102005024071A1 Rollelement und Verfahren zu dessen Herstellung Rolling element and process for its preparation |
| 12/21/2005 | EP1608209A1 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/21/2005 | EP1607496A1 Electroformed metallization |
| 12/21/2005 | EP1606107A2 Composite article comprising a ceramic coating |
| 12/21/2005 | EP1606085A2 High precision multi-grit slicing blade |
| 12/20/2005 | US6977223 Three dimensional microfabrication |
| 12/15/2005 | WO2005118918A2 Efficient analysis of organic additives in an acid copper plating bath |
| 12/15/2005 | US20050277293 Fabrication method of wafer level chip scale packages |
| 12/15/2005 | US20050276992 Method for metallizing a non-metallic surface and the metallized surface structure thereof |
| 12/15/2005 | US20050276914 Method for manufacturing light guide plate mold cores |
| 12/15/2005 | US20050276743 Method for fabrication of porous metal templates and growth of carbon nanotubes and utilization thereof |
| 12/15/2005 | US20050274622 Plating chemistry and method of single-step electroplating of copper on a barrier metal |
| 12/15/2005 | US20050274621 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 12/15/2005 | US20050274594 Metallic keypad and method for making the same |
| 12/15/2005 | US20050274445 Method for manufacturing decoration of imitation metal |
| 12/14/2005 | EP1605481A1 Metallic keypad and method for making the same |
| 12/14/2005 | EP1240365B1 Method for producing an electrolytically coated cold rolled strip and battery sheath produced therefrom |
| 12/14/2005 | CN1707759A Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 12/14/2005 | CN1231290C Vibration stirring device, and device and method for processing using stirring device |
| 12/13/2005 | US6974636 Protective coating for turbine engine component |
| 12/13/2005 | US6974531 Current or voltage is changed during plating resulting in an average current increase from an initially small current to a final current corresponding to the desired current density for the total plated area. |
| 12/13/2005 | US6974530 Method and system for controlling ion distribution during plating of a metal on a workpiece surface |
| 12/08/2005 | US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 12/08/2005 | US20050269212 Method of making rolling electrical contact to wafer front surface |
| 12/08/2005 | US20050269206 Production method of wiring substrate having ultra-fine pattern, and wiring substrate |
| 12/08/2005 | DE19727264B4 Halbleitervorrichtung mit einer t-förmigen Feldoxidschicht und Verfahren zu deren Herstellung A semiconductor device comprising a T-shaped field oxide film and methods for their preparation |
| 12/08/2005 | DE10011455B4 Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme A method of applying metallic interconnects as electrodes on a channel plate glass for large flat panel displays |
| 12/07/2005 | EP1602750A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
| 12/07/2005 | EP1602127A2 Plating apparatus |
| 12/07/2005 | EP1601822A1 Method of electroplating a workpiece having high-aspect ratio holes |
| 12/07/2005 | EP1601821A1 Electroplating pcb components |
| 12/07/2005 | CN1705774A Integrated plating and planarization process and apparatus therefor |
| 12/07/2005 | CN1705770A Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
| 12/07/2005 | CN1230575C Continuous nickel plating process for stainless steel wire |
| 12/06/2005 | US6972082 Method for the selectively electroplating a strip-shaped, metal support material |
| 12/06/2005 | US6972081 Fabrication of embedded vertical spiral inductor for multichip module (MCM) package |
| 12/01/2005 | WO2005078164A3 Method of anodizing metallic surfaces and compositions therefore |
| 12/01/2005 | US20050266165 Method for metallizing plastic surfaces |
| 12/01/2005 | US20050263400 Method of applying cladding material on conductive lines of MRAM devices |
| 12/01/2005 | US20050263399 No cell cleaning and rinsing between the analyses; reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated |
| 12/01/2005 | US20050263273 Electroformed microchannel cooler and methods of making same |
| 12/01/2005 | DE102004022297A1 Verfahren und System zum selektiven Beschichten oder Ätzen von Oberflächen A method and system for selectively coating or etching surfaces |
| 12/01/2005 | DE102004021926A1 Verfahren zur Herstellung einer Beschichtung sowie Anode zur Verwendung in einem solchen Verfahren A process for preparing a coating and anode for use in such a method |
| 12/01/2005 | DE102004021214A1 Producing and maintaining a prescribed gas composition in the environment of a band material after immersion treatment comprises moving the band material in a sealed housing from an immersion bath |
| 11/30/2005 | EP1601006A2 An apparatus and a method for processing a fluid meniscus |
| 11/30/2005 | EP1600528A2 Method for the metallisation of plastic surfaces |
| 11/30/2005 | EP1407062B1 Composite foil and its manufacturing process |
| 11/30/2005 | CN1703535A Aqueous alkaline zincate solutions and methods |
| 11/30/2005 | CN1229525C Gradient composite plating coat for continuous casting crystallizer copper plate and production method thereof |
| 11/29/2005 | US6969672 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation |
| 11/29/2005 | US6969557 Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same |
| 11/29/2005 | CA2376377C Tin-plated steel sheet |
| 11/24/2005 | WO2005111275A2 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
| 11/24/2005 | WO2005111274A2 Selective catalytic activation of non-conductive substrates |
| 11/24/2005 | WO2005110287A2 Electroplating solution for gold-tin eutectic alloy |
| 11/24/2005 | US20050258047 Process for electrochemical deposition of tantalum and an article having a surface modification |
| 11/24/2005 | US20050258046 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 11/24/2005 | US20050258044 Magnetic focus rings for improved copper plating |
| 11/23/2005 | EP1598449A2 Improved plating method |
| 11/23/2005 | EP1598448A1 Lead-free bump and method for forming the same |
| 11/23/2005 | CN1701137A Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti |
| 11/23/2005 | CN1701136A Low-force electrochemical mechanical processing method and apparatus |
| 11/23/2005 | CN1699634A Method for electroplating magnesium and magnesium alloy |
| 11/22/2005 | US6967166 Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing |
| 11/22/2005 | CA2302916C Anodizing method and apparatus for performing the same |
| 11/17/2005 | WO2005109972A2 Design and method for plating pci express (pcie) edge connector |
| 11/17/2005 | WO2005108651A2 Method for production of a coating and anode used in such a method |
| 11/17/2005 | WO2005108650A1 Methods and apparatus for determining organic component concentrations in an electrolytic solution |
| 11/17/2005 | WO2005108649A2 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution |
| 11/17/2005 | WO2005108648A2 Production of a structured hard chromium layer and production of a coating |
| 11/17/2005 | WO2005108058A1 Process for producing a new high-strength dual-phase steel product from lightly alloyed steel |
| 11/17/2005 | WO2005107982A1 Tool holder with vibration damping means and a method for manufacturing the same |
| 11/17/2005 | US20050255581 Self-organized nanopore arrays with controlled symmetry and order |
| 11/17/2005 | US20050252783 Electroplating solution for gold-tin eutectic alloy |
| 11/17/2005 | US20050252780 Seeding a magnetic layer alloy of nickel, iron, and/or cobalt ; removing portion to define a feature; depositing nonmagnetic conductive layer of tantalum or rhodium; forming cavities; electroplating |
| 11/17/2005 | US20050252583 Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper film |
| 11/17/2005 | US20050252262 Hot press forming method, and a plated steel material therefor and its manufacturing method |
| 11/16/2005 | EP1595289A2 Thermal interconnect systems methods of production and uses thereof |
| 11/16/2005 | EP1595001A1 Surface-coating method |
| 11/16/2005 | CN1697893A Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 11/16/2005 | CN1696353A Method for making Nano surface of metal material |
| 11/15/2005 | US6964792 Using diffuser membrane in electrolytic cells |