| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 02/08/2006 | EP1623690A2 Laser protection glasses or frame for laser protection glasses |
| 02/08/2006 | EP1623056A2 Method and device for coating a substrate |
| 02/08/2006 | CN1732291A Lead free bump and method of forming the same |
| 02/07/2006 | US6996425 Cellular phone housing |
| 02/07/2006 | US6994919 Core sheet overcoated with aluminum alloy |
| 02/02/2006 | WO2006011922A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 02/02/2006 | WO2006010888A1 A process for manufacturing micro- and nano- devices |
| 02/02/2006 | US20060021878 Nano icrystals copper material with super high strength and conductivity and method of preparing thereof |
| 02/02/2006 | DE102004034078A1 Verfahren zur Erzeugung einer lokalen Beschichtung und kombinatorisches Substrat diese aufweisend A method for generating a local coating and combinatorial substrate comprising these |
| 02/01/2006 | CN1729315A Method for producing galvanically deposited antennae for RFID labels using an adhesive that is selectively applied |
| 02/01/2006 | CN1729314A Method for the deposition of an alloy on a substrate |
| 02/01/2006 | CN1729313A Method and device for filling material separations on a surface |
| 02/01/2006 | CN1728347A Apparatus and method for plating semiconductor wafers |
| 02/01/2006 | CN1239753C Nickel base alloy composite conductor roll and manufacturing method |
| 02/01/2006 | CN1239751C Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/31/2006 | US6991717 Web processing method and apparatus |
| 01/31/2006 | US6991711 Cup type plating apparatus |
| 01/26/2006 | WO2006009686A1 Common rack for electroplating and pvd coating operations |
| 01/26/2006 | WO2005095678A3 Electroplating system and method |
| 01/26/2006 | WO2005018311A3 Fishhook |
| 01/26/2006 | US20060016691 Electrochemical deposition method utilizing microdroplets of solution |
| 01/26/2006 | US20060016690 Method for producing a hard coating with high corrosion resistance on articles made anodizable metals or alloys |
| 01/26/2006 | CA2474367A1 Electrolytic jet plasma process and apparatus for cleaning, case hardening, coating and anodizing |
| 01/25/2006 | EP1619275A2 Apparatus and method for plating semiconductor wafers |
| 01/25/2006 | EP1112125B1 Metallization structures for microelectronic applications and process for forming the structures |
| 01/25/2006 | CN1726112A Brazing sheet product having a clad layer and a coated layer of iron alloy and method of its manufacture |
| 01/25/2006 | CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer |
| 01/25/2006 | CN1724720A Preparation technology of carbon nanometer pipe nickel base friction resistant heat resistant composite coating layer |
| 01/25/2006 | CN1724718A Method of leaking stoppage by electroplating in electro vacuum device |
| 01/25/2006 | CN1724717A Method of repair nickel coating no metal coated piece |
| 01/25/2006 | CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 01/25/2006 | CN1238891C Novel chip interconnect and packaging deposition methods and structures |
| 01/25/2006 | CN1238769C Mask forming and removing method, and semiconductor device, electric circuit, display module, color filter and emissive device manufactured by the same method |
| 01/25/2006 | CN1238572C Process for making plastic surface by electroplating |
| 01/25/2006 | CN1238571C Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 01/25/2006 | CN1238570C Coating method |
| 01/24/2006 | US6989087 Electrodeposition of chromium; pretreatment with silver, or alloy thereof; corrosion resistance finish |
| 01/24/2006 | US6989084 Semiconductor wafer plating cell assembly |
| 01/24/2006 | US6988327 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/19/2006 | US20060012044 Plating method |
| 01/19/2006 | US20060011487 Submicron and nano size particle encapsulation by electrochemical process and apparatus |
| 01/19/2006 | US20060011486 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization |
| 01/19/2006 | US20060011485 Multi step electrodeposition process for reducing defects and minimizing film thickness |
| 01/19/2006 | US20060011484 Magnetic head having thermally assisted write head with encapsulated heater element, and method of fabrication thereof |
| 01/19/2006 | US20060011483 Process for electroplating metals into microscopic recessed features |
| 01/19/2006 | DE102004030726A1 Process to etch manufacture printed circuit board by regulation of electrolytic cell voltage transverse to the direction of travel |
| 01/19/2006 | DE10148045B4 Reparaturverfahren für strukturierte und/oder glatte Stahloberflächen auf Endlosbändern oder Pressblechen Repair method for structured and / or smooth steel surfaces of endless belts or press plates |
| 01/18/2006 | EP1616047A1 Compositions and coatings including quasicrystals |
| 01/18/2006 | CN1722374A Substrate proximity processing structures and methods for using and making the same |
| 01/18/2006 | CN1722372A Proximity head heating method and apparatus |
| 01/18/2006 | CN1721579A Method for preparing stable and dispersed composite plating solution used for carbon nanotube electro brush plating |
| 01/18/2006 | CN1237547C Lead-coated complex porous structures, and corresponding method for conductive activation |
| 01/18/2006 | CN1237209C Method for producing metal foams and furnace for producing same |
| 01/17/2006 | US6986838 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode |
| 01/12/2006 | WO2006004298A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2005040459A3 Electroplating compositions and methods for electroplating |
| 01/12/2006 | US20060006072 Cleaning and degreasing/activating the alloy surface with a first basic solution; electrolyzing with ultrasonic energy in a second basic solution to speed up activation to remove an oxidative layer; improved adhesion of the plating layer to a golf club head; corrosion resistance |
| 01/12/2006 | US20060005902 Method for production of thin metal-containing layers having low electrical resistance |
| 01/12/2006 | DE10347145B4 Verfahren zur Herstellung einer Verschleißschutzschicht A method for producing a wear-resistant layer |
| 01/11/2006 | CN1719644A Punch steel band for battery polar plate and mfg. method thereof |
| 01/11/2006 | CN1718868A Electrolytic film plating device |
| 01/10/2006 | US6984456 Flexible printed wiring board for chip-on flexibles |
| 01/10/2006 | US6984358 Joining by a palladium-based alloy foil which has low melting temperature, containing secondary element selected from Ni, Co, and Fe, corresponding to two tungsten alloy body; storage vessel, container, shields for electromagnetic radiation |
| 01/10/2006 | US6984302 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors |
| 01/10/2006 | US6984301 Methods of forming capacitor constructions |
| 01/10/2006 | US6984299 Methods for determining organic component concentrations in an electrolytic solution |
| 01/05/2006 | WO2006001594A1 Method for manufacturing black surface- treated copper foil for emi shield and copper foil the same and the composite material using it |
| 01/05/2006 | WO2005076680A3 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate |
| 01/05/2006 | US20060001132 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 01/05/2006 | US20060000720 Method for pretreating a surface of a non-conducting material to be plated |
| 01/05/2006 | US20060000719 Method and apparatus for feeding chips to a deposition location in a coating system |
| 01/05/2006 | US20060000718 Substrate plating methods and apparatus |
| 01/05/2006 | US20060000716 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 01/05/2006 | US20060000715 Manufacturing medical devices by vapor deposition |
| 01/04/2006 | EP1612298A2 Electroplating head and method for operating the same |
| 01/04/2006 | EP1611269A1 Method for the production of sanitary fittings with a stainless steel finish |
| 01/04/2006 | CN1717153A Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 01/04/2006 | CN1715456A Method for combining hub surface coating and electroplating process |
| 01/04/2006 | CN1715444A Method for metallizing plastic surfaces |
| 01/04/2006 | CN1234919C Electroplating apparatus |
| 01/04/2006 | CN1234916C Method and device for electrolytic treatment of electrically insulating film materials and use of said method |
| 01/03/2006 | US6982011 Method for producing improved cold-rolled strip that is capable of being deep-drawn or ironed, and cold-rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 01/03/2006 | US6981318 Printed circuit board manufacturing method |
| 01/03/2006 | CA2320278C Plating apparatus and method |
| 01/03/2006 | CA2191339C Method and device for continuous uniform electrolytic metallising or etching |
| 12/29/2005 | WO2005124905A1 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/29/2005 | WO2005123989A1 Plating apparatus |
| 12/29/2005 | WO2005123988A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 12/29/2005 | WO2005123987A1 Tin-based plating film and method for forming the same |
| 12/29/2005 | WO2005123986A1 Electrochemical reduction of metal oxides |
| 12/29/2005 | WO2004094702A8 Multi-chemistry plating system |
| 12/29/2005 | US20050287388 Metal based resistance heating element and method for preparation therefor |
| 12/29/2005 | US20050287376 Corrosion protection of zinc surfaces |
| 12/29/2005 | US20050284768 Method for coloring socket |
| 12/29/2005 | US20050284766 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 12/29/2005 | US20050284755 Substrate support element for an electrochemical plating cell |
| 12/29/2005 | DE102004001107B4 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
| 12/29/2005 | CA2571131A1 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/29/2005 | CA2568579A1 Plating apparatus |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |