Patents for C23F 1 - Etching metallic material by chemical means (16,062)
11/2002
11/07/2002DE10121126A1 Identifikationsträger und Verfahren zu dessen Herstellung Identification carrier and process for its preparation
11/05/2002US6475704 Method for forming fine structure
11/05/2002US6475638 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
11/05/2002US6475597 Thermoplastic resin-coated aluminum alloy plate and method and apparatus for manufacturing the same
11/05/2002US6475373 Method of controlling NOx gas emission by hydrogen peroxide
11/05/2002US6475369 Method for electrochemical fabrication
11/05/2002US6475233 Stent having tapered struts
10/2002
10/31/2002WO2002086197A1 Method of plating and pretreating aluminium workpieces
10/31/2002WO2002086180A2 A process for converting a metal carbide to diamond by etching in halogens
10/31/2002WO2002010480A3 Etching composition and use thereof with feedback control of hf in beol clean
10/31/2002US20020160856 Golf club striking plate with variable thickness
10/31/2002US20020160786 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
10/31/2002US20020160607 Electrode pad in semiconductor device and method of producing the same
10/31/2002US20020160545 Method of fabricating reflection-mode EUV diffusers
10/31/2002US20020158044 Magnetically patterning conductors
10/31/2002US20020157792 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
10/31/2002CA2440756A1 Method of plating and pretreating aluminium workpieces
10/30/2002EP1252369A1 Pickling agent containing urea and method of producing it
10/30/2002EP1252358A1 System and method for depositing inorganic/organic dielectric films
10/30/2002EP1252247A1 Polishing compositions for semiconductor substrates
10/30/2002EP1252028A2 Temporary bridge for micro machined structures
10/29/2002US6472331 Method and apparatus for measuring and dispensing a wafer etchant
10/29/2002US6471604 Multiple material golf head
10/24/2002US20020155048 For selectively removing materials containing nickel from substrates
10/24/2002US20020153030 Stripping copper using wet copper stripping chemicals whereby an eluent is produced; continuously analyzing eluent for presence of copper; stopping copper stripping process when presence of copper is no longer detected
10/23/2002EP1251398A2 Method for printing etch masks using phase-change materials
10/23/2002CN1376262A Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition
10/23/2002CN1375743A Making process of micro text and pattern mold
10/23/2002CN1093047C Ornamental steel plate and manufacturing method therefor
10/22/2002US6468439 Etching of metallic composite articles
10/22/2002US6468413 Electrochemical etch for high tin solder bumps
10/22/2002US6468357 Remover for a ruthenium containing metal and use thereof
10/17/2002WO2002081775A2 On-line removal of copper deposits on steam turbine blades
10/17/2002US20020151379 Golf club head
10/17/2002US20020150196 Dissolution and decontamination process
10/17/2002US20020148998 Potassium hypochlorite, hydrofluoric acid and deionized water
10/17/2002US20020148488 Method of decoating a turbine blade
10/17/2002CA2381957A1 Process to remove ferric iron impurities from an acidic aqueous solution used in the electro-winning of copper
10/16/2002EP1248938A1 Foil bridge initiator and method of production of same by photolithography
10/16/2002CN2516566Y Thin copper sheet etching machine
10/16/2002CN1092698C Chemical-mechanical grinding composition for manufacturing semiconductor
10/15/2002US6465363 Vacuum processing method and vacuum processing apparatus
10/15/2002US6464893 Process for preparation of thin metallic foils and organic thin-film-metal structures
10/10/2002WO2002079542A2 Improved adhesion of polymeric materials to metal surfaces
10/10/2002US20020144973 Selective treatment of the surface of a microelectronic workpiece
10/10/2002US20020144972 Immersing a surface layer of said substrate in a solution that is able to remove the surface layer, and forming bubbles in solution on the surface of the layer, removing the solution; semiconductors
10/10/2002CA2416019A1 Improved adhesion of polymeric materials to metal surfaces
10/09/2002CN1373817A Method for producing conductor pattern on dielectric substrate
10/08/2002US6461978 Method of manufacturing a substrate for an electronic device by using etchant and electronic device having the substrate
10/08/2002US6461972 Integrated circuit fabrication dual plasma process with separate introduction of different gases into gas flow
10/08/2002US6461534 Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same
10/03/2002WO2000026440A3 Circular method for pickling copper and copper alloys
10/03/2002US20020142599 XeF2 source chamber having a tray or ampoule for XeF2 crystals, a reservoir coupled to the chamber via a valve that allows sublimation to XeF2 gas, a flow controller fed by the reservoir
10/03/2002US20020139481 Apparatus and method for exposing substrates
10/02/2002DE10110823A1 Verfahren zum Abtragen von Materialablagerungen, die bei einer Laserbearbeitung entstehen A method for removing material deposits formed at a laser machining
10/02/2002CN1371665A Method for making miniature concave on surface, surgicla implant prepared by same with method for fixing implant on bone
10/01/2002US6458711 Self-aligned silicide process
10/01/2002US6458513 Forming cavities, masking and etching silicon substrate to form three dimensional structure
09/2002
09/26/2002US20020134753 Vacuum processing method and vacuum processing apparatus
09/25/2002CN1371528A Polishing compound for chemimachanical polishing and method for polishing substrate
09/24/2002US6454958 Method and device for operating etching baths
09/24/2002US6454957 Ruthenium and ruthenium dioxide removal method and material
09/24/2002US6454954 Desmear etchant and use thereof
09/24/2002US6454866 Wafer support system
09/19/2002WO2002071918A2 Method for producing undercut surface recesses
09/19/2002WO2002004706A9 Acidic treatment liquid and method of treating copper surfaces
09/19/2002CA2435914A1 Method for producing undercut surface recesses
09/18/2002EP1240646A2 Nuclear fuel dissolution
09/17/2002US6451451 Mask, and method and apparatus for making it
09/17/2002US6451218 Method for the wet chemical pyramidal texture etching of silicon surfaces
09/17/2002US6451214 Etching, shaping, or patterning layers or films with ceric ammonium nitrate in fabrication of semiconductor systems
09/12/2002WO2002071447A2 Ruthenium silicide wet etch
09/12/2002WO2002023588A3 Capacitively coupled plasma reactor
09/12/2002US20020125605 Molding of fastening hooks and other devices
09/12/2002US20020125215 Chemical milling of gas turbine engine blisks
09/12/2002US20020125214 Silver stain removal by chemical etching and sonication
09/12/2002US20020124768 Process for improving the adhesion of polymeric materials to metal surfaces
09/11/2002EP1239059A2 Chemical milling of the blades of a gas turbine engine
09/11/2002CN1368563A Composition for removing aluminium surface stain
09/11/2002CN1090890C Method for forming electroplated layer on through-hole inwall of PC board with through-hole
09/11/2002CN1090686C Copper and copper alloy micro-etching agent
09/10/2002US6448084 Solution of acetic acid, ammonium fluoride and nitric acid; for clarifying the physical characteristics of the metal layers, including grain size, thickness, and adhesion, which are visually analyzed with a scanning electron microscope
09/10/2002US6447616 Method for treating brass
09/06/2002WO2002068717A1 Method for etching electronic components containing tantalum
09/06/2002WO2002068712A2 Removal of etchant residues
09/05/2002US20020123235 Ruthenium silicide wet etch
09/05/2002US20020122255 Method of manufacturing diffractive optical element
09/05/2002US20020121502 Method for achieving improved selectivity in an etching process
09/05/2002US20020121497 Flexible stent and method of manufacture
09/05/2002US20020121109 Glass substrate processing method
09/04/2002EP1236447A2 Flexible stent and method of manufacture
09/04/2002EP0852615A4 Chemical mechanical polishing composition and process
09/03/2002US6444140 Contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source.
09/03/2002US6444010 Aqueous solution of hydrogen peroxide, hydrogen fluoride and high concentration of hydrochloric acid or sulfuric acid; dissolving palladium, iridium, osmium, ruthenium and rhenium for removal from silicon surface or silicon oxide film
09/02/2002CA2374082A1 Flexible stent
08/2002
08/29/2002WO2002049086B1 Transfer type substrate treating device
08/29/2002US20020119245 Method for etching electronic components containing tantalum
08/29/2002US20020117758 Planarizers for spin etch planarization of electronic components and methods of use thereof
08/29/2002US20020117472 Cleaning of multicompositional etchant residues
08/27/2002US6440870 Accuracy control of etching using plasma