Patents for C23F 1 - Etching metallic material by chemical means (16,062)
09/2003
09/04/2003US20030166330 Bump fabrication process
09/04/2003US20030164466 For copper surfaces on printed circuit boards, copper surfaces being suitable for the subsequent coating with plating resists, etch resists, solder masks and other dielectric films; copper substrates having roughened surfaces
09/04/2003US20030164226 Wafer processing apparatus and a wafer stage and a wafer processing method
09/03/2003EP1080249B1 Method for inserting at least one groove into a borehole
09/03/2003CN1440466A Acidic treatment liquid and method of treating copper surfaces
09/03/2003CN1120246C Fe-Ni alloy shadow mask with excellent eveness of diameter for electronic penetrated holes
09/02/2003US6613681 Method of removing etch residues
09/02/2003US6613242 Process for treating solid surface and substrate surface
08/2003
08/28/2003US20030162402 Method of through-etching substrate
08/28/2003US20030161789 Containing enzyme; degradation layers
08/27/2003CN1439118A Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on hear infrared spectrometer
08/27/2003CN1438831A Plasma treatment method and apparatus
08/27/2003CN1438668A Method for making shadow mask and corossion-resisting layer coating device for making shadow mask
08/27/2003CN1438361A Apparatus for spraying printed circuit-board
08/27/2003CN1437916A Method fo making arteria coronaria undercarriage
08/21/2003WO2003069636A1 Etching solution for forming an embedded resistor
08/21/2003WO2003043747A3 Manufacture having double sided features in a metal-containing web formed by etching
08/21/2003WO2001089420A3 Methods and apparatus for manufacturing an intravascular stent
08/21/2003US20030157802 Method and solution for preparing SEM samples for low-K materials
08/21/2003US20030154921 Contains flax pulp; no increase in loading material promoting combustion
08/20/2003EP0938597B1 Method for anisotropic etching of structures in conducting materials
08/20/2003EP0892840B1 A composition for cleaning and etching electronic display and substrate
08/20/2003CN1437212A Method for producing shadow mask and corrosion-resisting layer coating apparatus for shadow mask production
08/19/2003US6607987 Method for improving uniformity in batch processing of semiconductor wafers
08/14/2003WO2003066939A1 Electrolytic recycling device
08/14/2003US20030153194 Plasma etching uniformity control
08/14/2003US20030150840 For etching a nickel-chromium alloy, comprising: hydrochloric acid and thiourea.
08/14/2003US20030150562 Apparatus and method to control the uniformity of plasma by reducing radial loss
08/14/2003US20030150381 Apparatus for the spray treatment of printed circuit boards
08/13/2003CN1435321A Base of liquid jet device and forming method thereof
08/13/2003CN1117882C Stainless steel material for solid polymer fuel battery
08/12/2003US6605258 Evaluating activity of stripper or cleaning solution on turbine engine; obtain turbine, incubate with stripper or screening agent , evaluate performan ce of stripper or cleaner
08/07/2003WO2003065419A2 Plasma etching of ni-containing materials
08/07/2003WO2003064150A1 Composite material of aluminum alloy and resin and production method therefor
08/07/2003US20030146191 Etching method for nickel-vanadium alloy
08/07/2003US20030146188 Substrate and method of forming substrate for fluid ejection device
08/06/2003EP1332241A1 Electrostatically clamped edge ring for plasma processing
08/06/2003CN1434492A Chemical solution treatment apparatus for semiconductor substrate
08/06/2003CN1434488A Chip protector
08/05/2003US6602726 Bond surface conditioning system for improved bondability
08/05/2003US6602440 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
07/2003
07/31/2003US20030144162 Composition and method for removing copper-compatible resist
07/31/2003US20030143778 Bond surface conditioning system for improved bondability
07/31/2003US20030141280 Substrate and method of forming substrate for fluid ejection device
07/31/2003US20030141278 Method of fabricating a semiconductor memory device
07/30/2003EP1331287A2 Treating metal surfaces with a modified oxide replacement composition
07/30/2003EP0832407B1 Passive gas substrate thermal conditioning apparatus and method
07/30/2003CN1433049A Processing liquid compounding and supplying method and device
07/29/2003US6600229 Planarizers for spin etch planarization of electronic components
07/29/2003US6599839 Plasma etch process for nonhomogenous film
07/29/2003US6599370 For stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants
07/29/2003US6599322 Method for producing undercut micro recesses in a surface, a surgical implant made thereby, and method for fixing an implant to bone
07/29/2003CA2055945C Chemically machined sheet metal cutting tools and method
07/24/2003US20030139046 Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor device
07/24/2003US20030139045 Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
07/24/2003US20030136764 Immersing lead-containing copper-based alloy into weak acidic or neutral etching solution having buffer effect which is formed by adding organic acid into complexing agent having high ability to form complexing ion with lead, removing lead
07/24/2003US20030136763 Processing solution preparation and supply method and apparatus
07/24/2003US20030136761 Via hole defining process performed in one chamber
07/24/2003US20030136755 Etched metal oxide film
07/23/2003EP0644227B1 Solid surface modifying method and apparatus
07/23/2003CN1432073A Surface treatment to improve corrosion resistance of austenitic stainless steels
07/23/2003CN1431939A Process for improving adhesion of polymeric materials to metal surfaces
07/23/2003CN1431685A Method by using wet etching with non-equivalence in directions to carry out even process
07/23/2003CN1431683A Chips and their mfg. methods
07/23/2003CN1115183C Tech for prepn. of stainless steel board filter screen
07/22/2003US6596628 Electrode pad in semiconductor device and method of producing the same
07/22/2003US6596022 Expandable stents and method for making same
07/17/2003US20030134516 Inexpensive fabrication of large-area pixel arrays for displays and sensors
07/17/2003US20030132443 Method for manufacturing a thin film transistor for a crystal display
07/17/2003US20030132416 Stripping tin or tin alloys with organic sulfonic acids, nitro-substituted organic compounds and sulfuric acid or a nonionic surfactant with a cloud point of 50-80 degrees c
07/17/2003US20030132199 Wafer protection device
07/16/2003EP1326951A1 Stabilized alkaline compositions for cleaning microelectronic substrates
07/16/2003CN1429929A Method and device of monitering ion concentration in etching cavity body in sputtering etching process
07/15/2003US6592677 Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions
07/10/2003WO2003056614A1 Substrate processing apparatus and method
07/10/2003US20030129850 System for planarizing metal conductive layers
07/10/2003US20030127426 Method for pitch reduction
07/09/2003CN1113979C Method for making aluminium alloy plate decorative pattern
07/08/2003US6589406 Electrode characterized by highly adhering superficial catalytic layer and method for its production
07/03/2003WO2003053669A1 Textured surface having undercut micro recesses in a surface
07/03/2003US20030124851 Etching solution for etching Cu and Cu/Ti metal layer of liquid crystal display device and method of fabricating the same
07/03/2003US20030124831 Method of forming a bump
07/03/2003US20030121891 Ruthenium and ruthenium dioxide removal method and material
07/03/2003CA2470068A1 Textured surface having undercut micro recesses in a surface
07/02/2003EP1322550A1 Metal bearing membranes
07/02/2003EP1015669A4 Article, method, and apparatus for electrochemical fabrication
07/01/2003US6586342 Edge bevel removal of copper from silicon wafers
07/01/2003US6586161 For prevention of contamination of wafers, made of transition metal (platinum, ruthenium, copper, and perovskite) thin film wherein the edges are removed via orthoperiodic acid and nitric acid, then lithography
07/01/2003US6585910 Etchant
06/2003
06/26/2003US20030116536 Overcoating with passivation film; oxidation, etching using acid
06/26/2003US20030116535 Method and apparatus for removing coating layers from alignment marks on a wafer
06/26/2003US20030116237 Oxidation, corrosion resistant protective coatings; surface treatment; controlling temperature
06/25/2003EP1322145A2 Process for etching a conductive layer
06/25/2003EP1321970A2 Chemical solution treatment apparatus for semiconductor substrate
06/25/2003EP1321536A2 Process for rejuvenating a diffusion aluminide coating
06/25/2003EP1198344B1 Method for producing microcomponents
06/25/2003CN1425802A Method for wet cleaning metal copper back
06/24/2003US6582321 Golf club head
06/19/2003US20030113578 Heat-dissipating substrate, method for making the same, and semiconductor device including the same
06/19/2003US20030111440 Method of fabricating and a device that includes nanosize pores having well controlled geometries