Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23F - Non-mechanical removal of metallic material from surfaces; Inhibiting corrosion of metallic material; Inhibiting incrustation in general; Multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass  or or class › C23F 1 - Etching metallic material by chemical means
Patents for C23F 1 - Etching metallic material by chemical means (16,062)
06/2003
06/19/2003US20030111180 Plasma etching apparatus
06/19/2003US20030111093 Method for treating brass
06/17/2003US6579806 Method of etching tungsten or tungsten nitride in semiconductor structures
06/17/2003US6579796 Method of etching platinum using a silicon carbide mask
06/17/2003US6579591 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
06/17/2003US6579407 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
06/17/2003CA2305839C Stainless steel product for producing polymer electrode fuel cell
06/12/2003US20030107023 Etchant for etching metal wiring layers and method for forming thin film transistor by using the same
06/11/2003CN1423835A Inhibition of titanium corrosion
06/11/2003CN1422982A Acid detinning and deleading agent
06/11/2003CN1422924A Binding-aid composition, multilayer printed circuit making method and rotary coating copper surface
06/10/2003US6575817 Process for treating the interior of a hollow component
06/05/2003WO2002051741A3 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
06/05/2003US20030103871 Minimum volume oven for producing uniform pyrolytic oxide coatings on capacitor anodes
06/04/2003EP1116421B1 Method for producing etched circuits
06/04/2003EP1034072B1 Rapid texture prototyping
06/04/2003CN1421906A Etching agent
06/04/2003CN1421905A Method of and apparatus for producing semiconductor device
06/04/2003CN1110583C Waste liquid treatment pocess for aluminium material surface treatment
06/04/2003CN1110580C Multiple low-temperature aluminizing technology for steel blade of aircraft engine
06/03/2003US6572742 Apparatus for electrochemical fabrication using a conformable mask
05/2003
05/30/2003WO2003043747A2 Manufacture having double sided features in a metal-containing web formed by etching
05/30/2003CA2467716A1 Manufacture having double sided features in a metal-containing web formed by etching
05/29/2003US20030100191 Etching liquid
05/29/2003US20030098241 Process and apparatus for manufacturing a semiconductor device
05/29/2003US20030098041 Method for treating brass
05/28/2003EP0928431A4 Tapered capillary optics
05/22/2003WO2003042433A1 Electropolishing assembly and methods for electropolishing conductive layers
05/22/2003US20030097168 Expandable stents and method for making same
05/22/2003CA2464423A1 Electropolishing assembly and methods for electropolishing conductive layers
05/21/2003EP1311714A1 Surface treatments to improve corrosion resistance of austenitic stainless steels
05/21/2003EP1159467B1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
05/21/2003EP0883582B1 Method of post-etching a mechanically treated substrate
05/21/2003CN1418941A Detergent
05/20/2003US6565763 Method for manufacturing porous structure and method for forming pattern
05/20/2003US6565693 Rapid texture prototyping
05/20/2003US6565676 Material for a stretched mask for color picture tube
05/20/2003US6565664 Using mixture comprising an ammonium salt, an amine, and water
05/15/2003WO2003041461A2 Method and device for treating objects by means of a liquid
05/15/2003US20030092954 Nuclear fuel dissolution
05/15/2003US20030092282 Susceptor of apparatus for manufacturing semiconductor device
05/15/2003US20030092272 Method of stabilizing oxide etch and chamber performance using seasoning
05/15/2003US20030092264 Substrate processing apparatus and method
05/15/2003US20030089680 Method and apparatus for the etching of photomask substrates using pulsed plasma
05/15/2003US20030089616 Anodizing the base to obtain a layer of oxidation film, removing or partially covering an area, anodizing again on a different area to create a three-dimensional decorative effect because of the different thicknesses; computers
05/15/2003DE20303815U1 Silicon etching composition used in semiconductor industry contains hydrogen fluoride and chlorine
05/14/2003EP1310142A2 Improved adhesion of polymeric materials to metal surfaces
05/14/2003CN1417384A Chemical etching process of forming texture on aluminium section for copying machine, fax printer and printer
05/14/2003CN1417383A Etchant and substrate with etched copper wire array
05/13/2003US6562728 Surface treatment method of germanium-containing semiconductor substrate that includes immersion of the substrate in chemical solutions to remove foreign matter
05/13/2003US6562249 Method utilizing a magnetic assembly during etching thin shadow masks
05/13/2003US6562149 For firmly bonding laminated multilayered printed circuit boards and for bonding resists to copper
05/08/2003US20030087528 Process for planarizing substrates of semiconductor technology
05/08/2003US20030087201 Solvent-free overcoating for metals; radiation curable polymer
05/08/2003US20030084997 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
05/07/2003EP1308538A2 Radiation curable maskant and line sealer for protecting metal substrates
05/07/2003CN1107970C Wet processing methods for mfg. electronic components
05/06/2003US6558496 Rapid texture prototyping
05/06/2003US6557348 On-line removal of copper deposits on steam turbine blades
05/02/2003EP1305169A1 System and method for adjusting the properties of a device by gcib processing
05/01/2003WO2003036707A1 Etching method for aluminum-molybdenum laminate film
05/01/2003WO2002068712A3 Removal of etchant residues
05/01/2003US20030083213 Using an aqueous solution of an acid such as hexafluorozirconic acid, H2ZrF6 or precursor thereof; for repair of turbine coatings
05/01/2003US20030082913 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
05/01/2003US20030080092 Rework method for finishing metallurgy on chip carriers
04/2003
04/29/2003US6555916 Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides
04/29/2003US6554205 Gas polishing method, gas polishing nozzle and polishing apparatus
04/29/2003CA2081578C Method for treating etchant
04/24/2003WO2003034479A1 Substrate processing apparatus
04/24/2003US20030075274 Wafer support system
04/23/2003CN1411890A Fog-remover and air purifier
04/22/2003US6551660 Method for removing reactive metal from a reactor system
04/22/2003US6551521 Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition
04/17/2003WO2003032380A1 Device and method for processing substrate
04/17/2003WO2003031688A1 Etchant composition
04/17/2003WO2002059962A3 Viscous protective overlayers for planarization of integrated circuits
04/17/2003US20030073322 Ashing apparatus, ashing methods, and methods for manufacturing semiconductor devices
04/17/2003US20030071019 Method for removing metal cladding from airfoil substrate
04/16/2003EP1302569A2 Stripping solution
04/16/2003EP1302562A1 Method for removing metal cladding from airfoil substrate
04/16/2003EP1301652A1 Improving effectiveness of artificial hip by gcib
04/16/2003CN1106135C Method for forming coarse inversion coating on metal surface
04/15/2003US6548419 Wet etching system for manufacturing semiconductor devices and wet etching method using the same
04/15/2003US6547979 Methods of enhancing selectivity of etching silicon dioxide relative to one or more organic substances; and plasma reaction chambers
04/10/2003WO2003029521A1 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
04/10/2003WO2002071447A3 Ruthenium silicide wet etch
04/10/2003US20030066818 Milling solution mixture of nitric and hydrofluoric acid, dissolved titanium, wetting agent and surfactant
04/09/2003EP1299904A2 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
04/09/2003EP1299575A2 Acidic treatment liquid and method of treating copper surfaces
04/08/2003US6545748 Apparatus for the method of manufacturing a stent
04/08/2003US6544436 Etchant, method for roughening copper surface and method for producing printed wiring board
04/08/2003US6544342 Acid bath for removing contaminants from a metallic article
04/03/2003WO2003028078A1 Plasma processing device
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003WO2003027647A1 Method and apparatus for real-time dynamic chemical analysis
04/03/2003WO2003027359A2 External counter electrode and method for chemical milling and cleaning metal
04/03/2003US20030065401 Textured surface having undercut micro recesses in a surface
04/03/2003US20030064669 Low-force electrochemical mechanical processing method and apparatus
04/03/2003US20030062338 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process
04/02/2003EP1298230A1 Process for removing corrosion products from metallic parts
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