| Patents for C23F 1 - Etching metallic material by chemical means (16,062) |
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| 01/16/2003 | US20030010748 Positive photosensitive compositions |
| 01/15/2003 | EP1274881A1 Surface treatment method for magnesium alloys and magnesium alloy members thus treated |
| 01/15/2003 | EP1196788A4 Merged-mask micro-machining process |
| 01/15/2003 | CN1391264A Photoetching method for nanoparticle pattern based on self organization |
| 01/14/2003 | US6506314 Adhesion of polymeric materials to metal surfaces |
| 01/14/2003 | US6506312 Vapor deposition chamber components and methods of making the same |
| 01/14/2003 | US6506127 Set of woods with face thickness variation based on loft angle |
| 01/09/2003 | US20030008517 Method of reducing particulates in a plasma etch chamber during a metal etch process |
| 01/09/2003 | US20030008245 Fine structure and devices employing it |
| 01/09/2003 | US20030006215 Etchant, method for roughening copper surface and method for producing printed wiring board |
| 01/08/2003 | EP1273033A1 Inhibition of titanium corrosion |
| 01/08/2003 | CN1389596A Copper or copper alloy corrodent and corrosion method |
| 01/07/2003 | US6504152 Probe tip configuration and a method of fabrication thereof |
| 01/07/2003 | US6503845 Method of etching a tantalum nitride layer in a high density plasma |
| 01/07/2003 | US6503566 Process for improving the adhesion of polymeric materials to metal surfaces |
| 01/07/2003 | US6503363 System for reducing wafer contamination using freshly, conditioned alkaline etching solution |
| 01/07/2003 | CA2079417C Expandable stents and method of making same |
| 01/03/2003 | WO2003000954A1 Surface treatment agent for copper and copper alloy |
| 01/02/2003 | US20030004080 Picking agent containing urea and method of producing it |
| 01/02/2003 | US20030003757 Method of etching tungsten or tungsten nitride in semiconductor structures |
| 01/02/2003 | US20030000920 Etching method using photoresist etch barrier |
| 01/02/2003 | EP1270129A2 Selective removal of brazing compound from joined assemblies |
| 12/27/2002 | WO2002103088A1 Method and device for locally removing coatings from parts |
| 12/26/2002 | US20020197878 Film forming method and film forming apparatus |
| 12/26/2002 | US20020197761 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
| 12/26/2002 | US20020195423 Method for vapor phase etching of silicon |
| 12/26/2002 | US20020195417 Wet and dry etching process on <110> silicon and resulting structures |
| 12/26/2002 | US20020195416 Method of etching a tantalum nitride layer in a high density plasma |
| 12/25/2002 | CN1386906A Process for removing Ni from waste etching FeCl3 solution containing Ni |
| 12/25/2002 | CN1097035C Method of post-etching mechanically treated substrate |
| 12/24/2002 | US6498110 Ruthenium silicide wet etch |
| 12/24/2002 | US6497994 Photolithographic process for the formation of a one-piece needle |
| 12/19/2002 | WO2002100778A1 Process for producing ammonium cerium(iv) nitrate |
| 12/19/2002 | WO2002071918A3 Method for producing undercut surface recesses |
| 12/19/2002 | US20020192957 Applications of oxide hardmasking in metal dry etch processors |
| 12/19/2002 | US20020190029 Adding an oxime to an appropriate injection point of an electric generating power plant powered by a steam turbine |
| 12/19/2002 | US20020190028 Method of improving uniformity of etching of a film on an article |
| 12/19/2002 | US20020190027 For performing microfabrication of semiconductor based logic, memory and optoelectronic devices and micromechanical systems |
| 12/19/2002 | US20020189721 Lead-selective surface etching to reduce the release of lead; employed in water distribution systems, in particular lead brass plumbing components for potable water circuits |
| 12/19/2002 | US20020189632 Method of removing deposits of material formed in laser machining |
| 12/19/2002 | DE10224935A1 Verfahren zum Ätzen von Öffnungen mit hohem Seitenverhältnis A method for etching high aspect ratio openings |
| 12/18/2002 | EP1267396A2 Magnetically patterning conductors |
| 12/18/2002 | CN1385743A Film transistor for LCD and making method |
| 12/18/2002 | CN1385271A Selectively removing braze composition from conneted assembly |
| 12/18/2002 | CN1096310C Method and apparatus for sheet products treatment like circuit board |
| 12/17/2002 | US6495464 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
| 12/17/2002 | US6495099 Wet processing methods for the manufacture of electronic components |
| 12/17/2002 | US6495055 Variable time etching system according to the accumulated number of devices being processed and a method for etching in the same manner |
| 12/17/2002 | US6494960 Method for removing an aluminide coating from a substrate |
| 12/17/2002 | US6494219 Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits |
| 12/12/2002 | WO2002099394A1 Methods and systems for monitoring process fluids |
| 12/12/2002 | WO2002098788A2 Applications of a strain-compensated heavily doped etch stop for silicon structure formation |
| 12/12/2002 | US20020185225 Substrate processing method and substrate processing apparatus |
| 12/10/2002 | US6492009 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 12/10/2002 | US6491766 Activated nickel screens and foils |
| 12/10/2002 | US6491757 Wafer support system |
| 12/10/2002 | US6491592 Multiple material golf club head |
| 12/05/2002 | WO2002098194A1 Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| 12/05/2002 | WO2002097163A1 Method for operating an aluminium pickling bath |
| 12/05/2002 | WO2002089192A8 Method of wet etching an inorganic antireflection layer |
| 12/05/2002 | US20020182434 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/05/2002 | US20020179570 Method of etching high aspect ratio openings |
| 12/05/2002 | US20020179563 Application of a strain-compensated heavily doped etch stop for silicon structure formation |
| 12/05/2002 | US20020179248 Integrated circuit fabrication dual plasma process with separate introduction of different gases into gas flow |
| 12/05/2002 | DE10216725A1 Producing a metal plate having an opening with an ultra-small cross-section used for a screen of an electron microscope comprises forming a recess in a region of the plate by etching the rear side of the plate |
| 12/05/2002 | DE10125933A1 Verfahren zum Betrieb eines Aluminium-Beizbades A method of operating an aluminum pickling bath |
| 12/04/2002 | EP1261752A1 Method and apparatus for repairing lithography masks using a charged particle beam system |
| 12/04/2002 | CN1383202A Conductor pattern formed by magnetic force |
| 12/04/2002 | CN1382831A Etching method and etching appts. |
| 11/28/2002 | WO2002095800A2 A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
| 11/28/2002 | US20020177320 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid |
| 11/28/2002 | US20020177310 Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor device |
| 11/28/2002 | US20020175139 Method for forming an electrical insulating layer on bit lines of the flash memory |
| 11/28/2002 | US20020175083 Process to remove ferric iron impurities from an acidic aqueous solution used in the electro-winning of copper |
| 11/28/2002 | US20020174951 Surface isolation device |
| 11/27/2002 | EP1260197A1 Flexible stent |
| 11/26/2002 | US6486073 Method for stripping a photo resist on an aluminum alloy |
| 11/26/2002 | US6485511 Expandable stents and method for making same |
| 11/26/2002 | US6484737 Process of and device for treating small parts with a liquid treatment medium |
| 11/21/2002 | WO2002092882A1 Method for making a mesh-and-plate surgical implant |
| 11/21/2002 | US20020173854 Method for making a mesh-and-plate surgical implant |
| 11/21/2002 | US20020170878 Etching resistance of protein-based photoresist layers |
| 11/21/2002 | US20020170632 Forming a chromate film on the surface |
| 11/21/2002 | CA2446960A1 Method for making a mesh-and-plate surgical implant |
| 11/19/2002 | US6482747 Plasma treatment method and plasma treatment apparatus |
| 11/19/2002 | US6482746 Computer readable medium for controlling a method of cleaning a process chamber |
| 11/19/2002 | US6481449 Ultrasonic metal finishing |
| 11/14/2002 | US20020168863 Exclusion and/or application of the processing fluid by applying while the workpiece and a reactor holding the workpiece are spinning |
| 11/14/2002 | US20020168825 Method for etching metal layer on a scale of nanometers |
| 11/14/2002 | US20020168223 Suppressing reduction of copper ions; using solution of ammonium persulfate and 1,4,8,11 tetraazundecane complexing agent |
| 11/14/2002 | US20020167009 Thin film transistor for liquid crystal display and method of manufacturing the same |
| 11/14/2002 | US20020166633 Device for etching the backside of wafer |
| 11/13/2002 | EP1255797A1 Method for roughening copper surfaces for bonding to substrates |
| 11/12/2002 | US6479390 Method of etching material film formed on semiconductor wafer using surface wave coupled plasma etching apparatus |
| 11/07/2002 | WO2002089193A1 Method of wet etching a silicon and nitrogen containing material |
| 11/07/2002 | WO2002089192A1 Method of wet etching an inorganic antireflection layer |
| 11/07/2002 | US20020164887 Etching method and etching apparatus, method for manufacturing semiconductor device, and semiconductor device |
| 11/07/2002 | US20020164878 Forming integrated circuits wafers; removal photoresist with light |
| 11/07/2002 | US20020163290 Color selection electrode, method of producing color selection electrode and cathode ray tube |
| 11/07/2002 | US20020162990 Composition and process for etching and desmutting aluminum and its alloys |