Patents for C23F 1 - Etching metallic material by chemical means (16,062)
04/2002
04/04/2002US20020038790 Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
04/04/2002DE10139743A1 Ätzvorrichtung Etching
04/04/2002DE10136078A1 Zusammensetzung zum Mikroätzen von Kupfer oder Kupferlegierung, Verfahren zum Mikroätzen und Verfahren zum Herstellen einer Schaltungsplatte Microetching composition for copper or copper alloy, and method for microetching method of manufacturing a circuit board
04/03/2002EP1192050A1 Substrate treatment method
04/02/2002US6365057 Circuit manufacturing using etched tri-metal media
03/2002
03/28/2002WO2002024977A1 A method for wet etching
03/28/2002DE10066028A1 Kupfersubstrat mit aufgerauhten Oberflächen Copper substrate with roughened surfaces
03/27/2002EP1190763A1 High throughput screening method
03/27/2002EP1051888B1 Process and solution for the preliminary treatment of copper surfaces
03/27/2002CN1342218A Copper recovery process
03/26/2002US6360686 Plasma reactor with a deposition shield
03/21/2002WO2002023588A2 Capacitively coupled plasma reactor
03/21/2002US20020035050 For pretreatment of aluminum prior to electroplating, to remove smut that results from the etching step of the aluminum pretreatment
03/21/2002US20020033380 Ornamental steel plate and manufacturing method therefor
03/20/2002EP1188173A1 Method utilizing a magnetic assembly during etching thin shadow masks
03/20/2002CN1081246C Multiple elements chemical etching agent for nickel-titanium alloy film
03/14/2002WO2001068930A3 Removal of 'copper kiss' from pickling high copper alloys
03/14/2002WO2001024228A3 Temporary bridge for micro machined structures
03/14/2002US20020031915 Method for forming a silicide layer
03/14/2002DE10043148A1 Process for increasing the corrosion resistance of a workpiece made of titanium or titanium alloy contaminated with metallic iron comprises treating the workpiece with a pickling solution of concentrated nitric acid in concentrated ethanol
03/13/2002EP1187225A2 Etching liquid composition
03/12/2002US6355116 Method for renewing diffusion coatings on superalloy substrates
03/12/2002US6354962 Golf club head with a face composed of a forged material
03/12/2002US6354902 Method of producing color selection electrode and cathode ray tube
03/07/2002US20020028715 Golf club head with a face composed of a forged material
03/07/2002US20020028582 Accuracy control of etching using plasma
03/07/2002US20020026985 Etching device
03/06/2002EP1184656A1 Method for structural development of monocrystalline superalloys
03/05/2002US6352676 Destroying fluorine and/or chlorine trifluoride by reaction with iron, nickel, copper, calcium, magnesium, manganese, cobalt and/or tin metal particles; fluorination, salt formation
03/05/2002US6352647 Mask, and method and apparatus for making it
03/05/2002US6352050 Remote plasma mixer
02/2002
02/28/2002US20020025378 Exposing the primary carbides embedded in a steel matrix by at least one of uncovering and cutting, forming recess in the surface for one of detaching or removing the exposed primary carabides, depositing a hard material coating on the surface
02/28/2002DE10039558A1 Device for spray treatment of printed circuit boards uses conveyor devices to convey printed circuit boards on a horizontally aligned printed circuit board level and a nozzle device for spraying the top side of printed circuit boards.
02/26/2002CA2248497C Composition and method for stripping solder and tin from printed circuit boards
02/21/2002US20020020833 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives
02/20/2002CN1336449A Etching agent for copper or copper alloy, micro-etching method with same, and method for mfg. printed circuit plate
02/20/2002CN1336243A Inside off-set sleeve used for head of gold club
02/20/2002CN1079300C Surface treatment method
02/19/2002US6348159 Method and apparatus for etching coated substrates
02/14/2002WO2002012592A1 Surface treatments to improve corrosion resistance of austenitic stainless steels
02/14/2002WO2002012590A1 Beryllium-aluminium composite with microporous surface for impregnating, painting or bonding
02/14/2002WO2002011930A1 Heat-exchanging device
02/14/2002US20020017503 Methods and apparatus for manufacturing an intravascular stent
02/13/2002EP1179973A2 Composition for circuit board manufacture
02/07/2002WO2002010480A2 Etching composition and use thereof with feedback control of hf in beol clean
02/07/2002US20020016064 Method of manufactuing a semiconductor device
02/07/2002US20020014403 Method of fabricating reflective mask, and methods and apparatus of detecting wet etching end point and inspecting side etching amount
02/06/2002EP1177112A1 Remote plasma generator
02/05/2002US6344106 Apparatus, and corresponding method, for chemically etching substrates
01/2002
01/31/2002WO2002008491A1 Palladium removing solution and method for removing palladium
01/31/2002US20020011463 Isotropic dry cleaning process for noble metal integrated circuit structures
01/31/2002US20020011310 Downstream sapphire elbow joint for remote plasma generator
01/31/2002US20020011214 Remote plasma mixer
01/31/2002DE10034022A1 Acidic treatment liquid for treating and forming copper surfaces on printed circuit boards comprises hydrogen peroxide, five-membered heterocyclic compound(s), and microstructure modifying agent(s)
01/30/2002CN1078629C Liquid for corroding copper and copper alloy
01/29/2002US6343183 Wafer support system
01/24/2002US20020008079 Dry etching method for iridium electrode
01/24/2002US20020008041 Chemical milling
01/24/2002US20020007912 Coolant for plasma generator
01/23/2002EP0954385A4 Fluid delivery apparatus and method
01/23/2002CN1078265C Method for producing nickel and iron compound by using waste corrosive liquid containing nickel and iron chloride series
01/22/2002US6340769 Structures with iridium reagents and heterocyclic lewis bases
01/17/2002WO2002005317A2 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
01/17/2002WO2002004707A1 Surface treating agent for metal member
01/17/2002WO2002004706A1 Acidic treatment liquid and method of treating copper surfaces
01/17/2002CA2407532A1 Acidic treatment liquid and method of treating copper surfaces
01/10/2002WO2001032958A3 Multilayer metal composite structures for semiconductor circuitry and method of manufacture
01/10/2002US20020003830 Calorimeter and manufacturing method thereof
01/10/2002US20020003127 Method of manufacturing wireless suspension blank
01/03/2002WO2002000306A1 Golf club striking plate with variable thickness
01/03/2002WO2001032957A3 Manufacturing method and apparatus
01/03/2002US20020001967 Etching method and etching apparatus
01/02/2002EP1168899A1 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
01/02/2002EP1168424A1 Etching solution, etched article and method for etched article
01/02/2002EP1166816A2 A photolithographic process for the formation of a one-piece needle
01/02/2002EP1165983A1 A friction member and a method for its surface treatment
01/02/2002EP1165861A1 Copper recovery process
01/02/2002EP0954620A4 Vapor deposition components and corresponding methods
01/02/2002CN1329183A Electrode with high-adhesiveness surface catalytic layer
01/01/2002US6335290 Etching method, thin film transistor matrix substrate, and its manufacture
12/2001
12/29/2001CA2351797A1 A photolithographic process for the formation of a one-piece needle
12/27/2001US20010055995 Multiple material golf club head
12/27/2001US20010054390 Wafer support system
12/26/2001CN1328697A Etching solution, etched article and method for etched article
12/26/2001CN1328696A Etching solution, etched article and mehtod for etched article
12/26/2001CN1328175A Chemical etching liquid system for preparing gallium antimonide semiconductor device
12/25/2001US6333275 Etchant mixing system for edge bevel removal of copper from silicon wafers
12/25/2001US6332988 Terminal metal on semiconductor wafers with solder bump layers
12/20/2001WO2001041151A3 Nuclear fuel dissolution
12/20/2001US20010052510 Contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source.
12/20/2001US20010052468 Electrode characterized by highly adhering superficial catalytic layer
12/19/2001CN1327086A Silicon etching liquid and its preparing method
12/19/2001CN1327077A Fe-Ni alloy cathode cover semi-product with good etching perforation property and its preparing method
12/18/2001US6331490 Process for etching thin-film layers of a workpiece used to form microelectric circuits or components
12/13/2001WO2001094033A1 Process for improving the adhesion of polymeric materials to metal surfaces
12/13/2001WO2001032359A3 Ultrasonic metal finishing involving cavitational erosion
12/13/2001US20010051278 Thermoplastic resin-coated aluminum alloy plate and method and apparatus for manufacturing the same
12/13/2001CA2407280A1 Process for improving the adhesion of polymeric materials to metal surfaces
12/12/2001EP1162288A1 Electrode characterized by highly adhering superficial catalytic layer
12/12/2001EP1162286A1 A method for removing a coating from a substrate