Patents for C23F 1 - Etching metallic material by chemical means (16,062)
12/2001
12/12/2001CN1326013A Device and method for reproducing etching solution containing metal compounds
12/12/2001CN1076121C Semiconductor chip surface treatment liquor and treatment method and device using the same
12/12/2001CN1076067C Low lead released pipes made from copper based alloy containing lead and method for manufacturing them
12/11/2001US6329300 Method for manufacturing conductive pattern layer by two-step wet etching process
12/11/2001US6329299 Compositions and methods for the selective etching of tantalum-containing films for wafer reclamation
12/11/2001US6329289 Method and apparatus for forming copper wiring
12/11/2001US6328902 Probe tip configuration and a method of fabrication thereof
12/06/2001US20010049131 Using baths to which are added a biogenic catalyst (in particular, an enzyme) which selectively acts (etching) upon a preselectable thin layer; less expensive and environmentally friendly; thermally controlled; photoresists
12/06/2001US20010047980 Etching in halogen-containing gaseous etchant, and optionally hydrogen gas, to form carbon layer on metal carbide
12/06/2001US20010047839 Uniform aperture diameter
12/05/2001EP1159467A1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
12/05/2001EP1055355B1 Process for the preliminary treatment of copper surfaces
12/05/2001EP0720514B1 Spray nozzle and method of manufacturing same
12/05/2001CN1324959A Supplement method for bath
12/05/2001CN1075841C Process for etching diamond film pattern with reactive ion beam
11/2001
11/29/2001WO2001089420A2 Methods and apparatus for manufacturing an intravascular stent
11/29/2001CA2780092A1 Methods and apparatus for manufacturing an intravascular stent
11/29/2001CA2780089A1 Methods and apparatus for manufacturing an intravascular stent
11/28/2001EP1158843A1 Process for improving adhesion of polymeric materials to metal surfaces.
11/28/2001EP0784542B1 Stamp for a lithographic process
11/28/2001CN1323641A Method for processing brassic of head of golf club
11/28/2001CN1323640A Method for chemially etching brassic of head of golf club
11/27/2001US6322955 Etching method
11/21/2001CN1323445A Method and system to control the concentration of dissolved gas in a liquid
11/20/2001US6319845 Method of purifying alkaline solution and method of etching semiconductor wafers
11/20/2001US6319386 Submerged array megasonic plating
11/15/2001WO2001086022A1 Process for preparation of thin metallic foils and organic thin-film-metal structures
11/13/2001US6315859 Apparatus and method for improving uniformity in batch processing of semiconductor wafers
11/08/2001US20010039116 Fabrication method for semiconductor device
11/08/2001US20010037993 Etching method and wiring board manufactured by the method
11/08/2001US20010037819 Liquid feed nozzle, wet treatment apparatus and wet treatment method
11/07/2001CN1320719A Carving liquid for metallic materials
11/06/2001US6313525 Hollow package and method for fabricating the same and solid-state image apparatus provided therewith
11/06/2001US6313039 Chemical mechanical polishing composition and process
11/01/2001US20010037147 Expandable stents and method for making same
11/01/2001US20010037146 Expandable stents and method for making same
11/01/2001US20010035574 Method for etching
10/2001
10/31/2001EP1150342A1 Etching solution, etched article and method for etched article
10/31/2001DE10018419A1 Production of a flexible or rigid switching carrier plate comprises providing a composite layer containing a conductor layer and an electrically conducting carrier on a conductor
10/30/2001US6309981 Edge bevel removal of copper from silicon wafers
10/30/2001US6309806 Method of providing microscopic features
10/30/2001US6309412 Expandable stents and method for making same
10/25/2001WO2001079589A1 Method in and apparatus for etching or plating of substrates
10/25/2001US20010034139 Etchant composition for molybdenum and method of using same
10/24/2001CN1319323A Method for producing etched circuit
10/24/2001CN1318651A Fe-Ni alloy for shadow mask, observational method of inpurities and discriminating method of aperature uniformity
10/23/2001US6306226 Etching surface of aaluminum-containing metal material; applying treating liquid selected from zirconium phosphate and titanium phosphate, to form protective layer; forming protective layer containing crosslinked hydrophilic resin
10/18/2001WO2001078129A1 Inhibition of titanium corrosion
10/18/2001WO2001077011A1 Metal bearing membranes
10/18/2001US20010031313 Method for removing reactive metal from a reactor
10/18/2001US20010029894 Reacting fibrous materials with chemical digesting solution in presence of organosilicon compounds selected from specified organopolysiloxane compounds or organosilane compounds to produce pulp
10/18/2001CA2403164A1 Metal bearing membranes
10/17/2001EP1145083A2 Hybrid surface modification process and article
10/17/2001CN1318015A Substrate treatment method
10/17/2001CN1317598A Surface treatment process for magnesium alloy and magnesium alloy member
10/16/2001CA2135978C Corrosion resistant stainless steel and method of making same
10/13/2001CA2343451A1 Method for processing a striking plate for a golf club head
10/11/2001WO2001075190A1 Surface treatment method for magnesium alloys and magnesium alloy members thus treated
10/11/2001US20010029080 Method of processing metal and method of manufacturing semiconductor device using the metal
10/11/2001US20010027830 Stretched mask for color picture tube and material for the mask
10/11/2001CA2405288A1 Surface treatment method for magnesium alloys and magnesium alloy members thus treated
10/10/2001CN1316549A Technology of selective lead removed for running water pipe fitting made of copper alloy and lead removal liquid
10/10/2001CN1316338A Method for making offset printing plate supporting body, affset printing plate supporting body and offset printing plate
10/09/2001US6299788 With hbr, he and he/o2 as reactive gas source; chamber pressure greater than 30 mtorr is held to achieve high selectivity to polysilicon over silicon oxide.
10/09/2001US6299722 First gas supply means for supplying an o2 gas; second gas supply means for supplying a halogen-containing gas; switching means for switching supply by the first gas supply means to a gas supply by the second gas supply means
10/04/2001US20010027030 Method for cleaning a process chamber
09/2001
09/27/2001WO2001070457A1 Grind polish cluster and double side polishing of substrates
09/27/2001WO2001020059A3 Method for producing a conductor pattern on a dielectric substrate
09/27/2001US20010024736 Aluminum alloy member and production method thereof
09/27/2001US20010024679 Microelectronics
09/27/2001US20010023829 Method for anisotropic etching of structures in conducting materials
09/27/2001US20010023701 Remover for a ruthenium containing metal and use thereof
09/26/2001EP1136593A1 A method for renewing diffusion coatings on superalloy substrates
09/26/2001EP1136592A2 Method and apparatus for removal of unwanted electroplating deposits
09/25/2001US6294099 Method of processing circular patterning
09/25/2001US6294072 Apparatus for stripping metal oxide scale from metal surface
09/25/2001US6294071 Dissolving copper, by electrically coupling copper metal to cathode material; exposing copper metal to electrolytic solution of water, nitrogen compound and carbon dioxide; exposing cathgode to electrolyte solution of water and oxygen
09/25/2001US6293457 Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization
09/20/2001WO2001068930A2 Removal of 'copper kiss' from pickling high copper alloys
09/20/2001US20010022215 Apparatus and method for improving uniformity in batch processing of semiconductor wafers
09/19/2001EP1134306A1 Selective deleading process and bath for plumbing components made of a copper alloy
09/19/2001EP1003615A4 Method for passivation of a metallization layer
09/18/2001US6290865 Spin-rinse-drying process for electroplated semiconductor wafers
09/18/2001US6290779 Processing substrate in chamber by depositingmetallic film by chemical vapor deposition using metal halide; introducing cleaning gas and oxidizer; heating and pressurization to produce volatile reaction product which is discharged
09/18/2001US6290405 Substrate processing apparatus
09/13/2001WO2001067496A1 Method for opening key patterns on semiconductor
09/13/2001US20010020517 Dry etching method and apparatus for use in the LCD device
09/13/2001CA2300492A1 Removal of "copper kiss" from pickling high copper alloys
09/12/2001CN1312391A Method of recovering metal from metal-containing sludge
09/06/2001US20010019127 Etching method, thin film transistor matrix substrate, and its manufacture
09/06/2001DE10010316A1 Apparatus for dissolving zinc in basic aqueous solution, useful in industrial galvanization, includes iron oxide electrically connected to zinc, without external current
09/05/2001EP1130636A2 Remover for a ruthenium containing metal and use thereof
09/05/2001CN1311514A Variable capacitor and method for mfg. metallic rotator of same
09/05/2001CN1311351A Etching agent for ruthenium contg. metal, and its application method
09/05/2001CN1311350A Electric conductive film etching agent and etching method
09/04/2001US6284721 Mixture of acid, nitrate and fluoride
09/04/2001US6284309 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
09/04/2001US6284146 Etching gas mixture for transition metal thin film and method for etching transition metal thin film using the same
09/04/2001US6284053 Selective deleading process and bath for plumbing components made of a copper alloy
08/2001
08/30/2001US20010018319 Process for treating the interior of a hollow component