Patents for C23F 1 - Etching metallic material by chemical means (16,062)
06/2002
06/25/2002US6409844 Treating with alkali metal, phosphate, borate compounds; bonding strength, corrosion resistance; coating
06/20/2002WO2002049086A1 Transfer type substrate treating device
06/20/2002WO2002048415A1 Aluminium alloy for lithographic sheet
06/20/2002US20020077259 Stabilized alkaline compositions for cleaning microlelectronic substrates
06/20/2002US20020076930 Etchant and method for fabricating a substrate for an electronic device using the same
06/19/2002CN1354400A Adornment
06/19/2002CN1354285A Electrochemical corrosion of high-tin solder ridge
06/19/2002CN1354280A Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy
06/18/2002US6407047 For pretreatment of aluminum prior to electroplating, to remove smut that results from the etching step of the aluminum pretreatment
06/18/2002US6406759 Remote exposure of workpieces using a recirculated plasma
06/18/2002US6406637 Thin film-planar structure and method for producing the same
06/13/2002WO2002046483A2 Silver stain removal from dna detection chips by cyanide etching or sonication
06/13/2002US20020072433 Internal off-set hosel for a golf club head
06/13/2002US20020070196 Method utilizing a magnetic assembly during etching thin shadow masks
06/13/2002US20020070194 Process for treating solid surface and substrate surface
06/12/2002EP1213369A2 Method and apparatus for etching ruthenium films
06/11/2002CA2007608C Composition and method for stripping tin or tin-lead alloy from copper surfaces
06/06/2002WO2002043924A2 An acid bath for removing contaminants from a metallic article
06/06/2002US20020068462 Forming a carbon layer on at least a part of the material layer to prevent the part of the material layer from being etched; and wet-etching the material layer using an alkali solution.
06/05/2002CN1352703A Methods for wet processing electronic components having copper containing surfaces
06/05/2002CN1352321A Solution for removing containmanted titanium alloy layers
06/04/2002US6399517 Etching method and etching apparatus
06/04/2002US6398974 Layers of aluminum and molybdenum; two step etching by varying the dilution of the etching solution to prevent hillock and junction spiking as well as control undercutting
06/04/2002US6398904 Wet etching system for manufacturing semiconductor devices
06/04/2002US6398666 Golf club striking plate with variable thickness
05/2002
05/29/2002EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins
05/29/2002EP1209251A2 Temperature control system for wafer
05/29/2002CN1351194A Corrodent for surface texture of silicon material in solar battery
05/28/2002US6395994 Etched tri-metal with integrated wire traces for wire bonding
05/28/2002US6395646 Machine for etching the edge of a wafer and method of etching the edge of a wafer
05/28/2002US6395458 Mixing benzotriazole with development solution
05/28/2002US6394114 Method for stripping copper in damascene interconnects
05/23/2002US20020062037 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor
05/23/2002US20020060307 With a mineral acid and a peroxide
05/23/2002US20020060202 Etching with a chemical liquid having a pH >/= 12 or and an oxidation-reduction potential of >/= 300 mVvsSHE
05/23/2002US20020060201 Ions of an ion beam with predetermined polarity are extracted from an ion source and accelerated, which is then reflected and neutralizedm
05/23/2002DE10056162A1 Process for anisotropically etching thin metal foils, e.g. silver foils, comprises repeatedly etching using an oxidizing plasma or reactive gas in a first step as etching component
05/22/2002EP1206694A1 Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition
05/22/2002EP1055015B1 Method for producing a micromechanical device
05/22/2002CN1085392C Method of manufacturing metal rotor for trimmer capacitor
05/21/2002US6391188 Processes and apparatus for recovery and removal of copper from fluids
05/21/2002US6391119 Cleaning metal oxide films with acid etching and immersion
05/21/2002US6390933 High cofficient of restitution golf club head
05/16/2002WO2002038828A1 Method of surface treatment for stainless steel product for fuel cell
05/16/2002US20020058423 Wet etching system for manufacturing semiconductor devices and wet etching method using the same
05/16/2002US20020056829 Ruthenium and ruthenium dioxide removal method and material
05/16/2002US20020056702 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
05/16/2002US20020056701 Etching, shaping, or patterning layer or films with ceric ammonium nitrate in fabrication of semiconductor systems
05/16/2002US20020056699 Method for eliminating surface roughness in metal lines
05/16/2002US20020056697 Ruthenium and ruthenium dioxide removal method and material
05/16/2002DE10053198A1 Verfahren zum lokalen Ätzen A method of etching local
05/14/2002US6387599 Mixing benzotriazole with development solution
05/14/2002US6387468 Ornamental steel and manufacturing method therefor
05/10/2002WO2002036856A1 Method for removing lead from plated cylindrical article made of lead-containing copper alloy and metal fitting for hydrant, and method for preventing leaching of lead from article made of lead-containing copper alloy and metal fitting for hydrant
05/09/2002US20020055447 Etching liquid composition
05/09/2002US20020055263 Etching in a chamber with high frequency generated plasma of a fluorocarbon (C4F6) gas and an oxygen (O2) gas, and the ratio C4F6/O2 is specified; etch selectivity of the oxide film
05/09/2002US20020055262 Method and composition for selectively etching against cobalt silicide
05/09/2002US20020053402 System for reducing wafer contamination
05/08/2002CN1348165A Etching liquid for indium oxide tin film
05/08/2002CN1348020A Method of eliminating nickel and heavy metal ion from waste ferric chloride liquid after etching or pickling
05/07/2002US6384523 Color selection electrode, method of producing color selection electrode and cathode ray tube
05/07/2002US6383272 Process for improving the adhesion of polymeric materials to metal surfaces
05/07/2002US6381828 Chemical etching of a striking plate for a golf club head
05/02/2002US20020052247 Set of woods with face thickness variation based on loft angle
05/02/2002US20020052116 Free Floating double side polishing of substrates
05/02/2002US20020052072 Surface treatment method of semiconductor substrate
05/02/2002US20020050489 Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
05/01/2002CN1346864A 蚀刻液组合物 Etchant compositions
04/2002
04/30/2002US6379778 Method of checking the accuracy of the result of a multistep etching process
04/30/2002US6379569 Masking with hot melt ink
04/30/2002US6379476 Stainless steels for producing polymers with low electrical resistance
04/30/2002US6379406 Water polish mixture, abrasive particles of metal oxide for ions
04/25/2002WO2002033033A1 Stabilized alkaline compositions for cleaning microelectronic substrates
04/25/2002US20020048953 Selectively etching unwanted metal deposits on a surface of a wafer; etching solution comprising citric acid and an oxidizing agent, espeically hydrogen peroxide.
04/25/2002US20020048950 Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes
04/25/2002US20020048685 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
04/25/2002US20020048677 Hydrogen peroxide, inorganic acid, corrosion inhibitor, ammonium ion, and water; adhesion between copper circuit trace, and an epoxy insulator
04/25/2002US20020047144 Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides
04/25/2002US20020046783 Free standing shape memory alloy thin film and method of fabrication
04/25/2002DE10051052A1 Alkaline etching solution used in the production of silicon wafers and semiconductor diodes contains a carboxylic acid
04/25/2002CA2425613A1 Stabilized alkaline compositions for cleaning microelectronic substrates
04/24/2002EP1198620A1 Methods for wet processing electronic components having copper containing surfaces
04/24/2002EP1198344A1 Method for producing microcomponents
04/23/2002US6376104 Immersion gold alloy in acid solution and etching pattern; thern sodium cyanide solution
04/23/2002US6374871 Liner for use in processing chamber
04/18/2002US20020045351 Method of manufacturing a substrate for an electronic device by using etchant and electronic device having the substrate
04/18/2002US20020043308 Water supply plumbing component made of brass containing lead and surface of which directly come in contact with portable water is exposed to etchant for selective etching which remove labial lead or lead salt layer from the surface
04/18/2002US20020043271 Method for treating brass
04/18/2002DE10049579A1 Production of a decorative surface comprises processing a metallic base material forming a submicroscopic thin oxide layer by etching, and deforming and heat treating to cause a specific recrystallization behavior
04/17/2002EP1197573A2 Method for repairing a coated article
04/17/2002EP1196788A1 Merged-mask micro-machining process
04/17/2002CN1345252A Golf club head with face composed of forged material
04/16/2002US6372081 Process to prevent copper contamination of semiconductor fabs
04/16/2002US6372055 Method for replenishing baths
04/16/2002US6371868 Internal off-set hosel for a golf club head
04/11/2002WO2002005317A3 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
04/11/2002US20020042198 Method in etching of a substrate
04/11/2002US20020040884 Probe tip configuration and a method of fabrication thereof
04/10/2002CA2357866A1 Method for repairing a coated article
04/09/2002US6368234 Golf club striking plate having elliptical regions of thickness