Patents for C23F 1 - Etching metallic material by chemical means (16,062)
08/2002
08/27/2002US6440011 Method for processing a striking plate for a golf club head
08/27/2002US6439155 Remote plasma generator with sliding short tuner
08/22/2002WO2002065539A1 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
08/22/2002WO2002065532A1 Work treating method and treating device
08/22/2002WO2002065528A2 Use of ammonia for etching organic low-k dielectrics
08/22/2002US20020115580 Method for stripping copper in damascene interconnects
08/22/2002US20020115284 Method of cleaning a dual damascene structure
08/22/2002US20020115221 High throughput screening method, array assembly and system
08/22/2002US20020113038 Replacing a polysilicon, amorphous silicon or tantalum silicide layer in metallization
08/22/2002US20020112819 Remote plasma generator with sliding short tuner
08/21/2002EP1232296A2 Manufacturing method and apparatus
08/21/2002EP0958405B1 Metal surface treatment solutions and process
08/21/2002CN2506655Y Chemical liquid recovery regenerator for rotary etching machine
08/20/2002US6436723 Ozone water containing an oxidation agent having an oxidation-reduction potential of 2v or more is supplied onto a metal compound film such as srruo film or the like, and the metal compound film is etched by oxidation-reduction reaction
08/20/2002US6436300 Etching metal using mixture of hydrogen peroxide and 1,2-cyclohexylenedinitrilotateaacetic acid
08/20/2002US6435982 Golf club head with a face composed of a forged material
08/20/2002US6435978 Internal off-set hosel for a golf club head
08/20/2002US6435977 Set of woods with face thickness variation based on loft angle
08/20/2002US6435944 Chemical mechanical polishing (cmp); peroxycarboxylic acid or urea peroxyacid which dissociates into oxidizer and complexing agent; abrasive slurry; minimizing overetching; prevents dishing
08/20/2002US6435203 Apparatus and method for regenerating etchant solution containing metal compound
08/20/2002US6434823 Method for repairing a coated article
08/15/2002WO2002063670A2 Method for removing copper from a wafer edge
08/15/2002US20020108929 Use of ammonia for etching organic low-k dielectrics
08/15/2002US20020108868 External counter electrode
08/14/2002EP1231609A1 Process for dissolution and decontamination
08/14/2002EP1231296A2 Composition and process for etching and desmutting aluminum and its alloys
08/14/2002EP1229970A1 A golf club head with a face composed of a forged material
08/14/2002CN1363725A Selective chemical corrosion method to Si in Si/Ge structure
08/13/2002US6432836 Cleaning method for semiconductor substrate and cleaning solution
08/13/2002US6432219 Titanium aluminum nitride layer with phosphate solution and peroxide for separation of steels
08/13/2002US6432210 Method for treating brass
08/13/2002US6432133 Expandable stents and method for making same
08/08/2002US20020106905 Method for removing copper from a wafer edge
08/08/2002US20020106458 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer
08/07/2002EP1229147A1 Method for producing undercut recesses in a surface, a surgical implant made thereby and a method for fixing an implant to bone
08/06/2002US6429142 In-situ photoresist removal by an attachable chamber with light source
08/06/2002US6428909 Aluminum alloy member and production method thereof
08/06/2002US6428719 Etching process to selectively remove copper plating seed layer
08/06/2002US6428602 Method for recovering platinum from platinum-containing coatings on gas turbine engine components
08/01/2002WO2002059962A2 Viscous protective overlayers for planarization of integrated circuits
08/01/2002WO2002059953A1 Conductor treating single-wafer type treating device and method for semi-conductor treating
08/01/2002WO2002059393A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
08/01/2002US20020102851 Etching method and etching apparatus
08/01/2002CA2435623A1 Viscous protective overlayers for planarization of integrated circuits
08/01/2002CA2432012A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
08/01/2002CA2431591A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
07/2002
07/31/2002CN1361310A Iron trichloride etching liquid controlling method during etching Fe-Ni alloy plate shadow mask
07/30/2002US6426020 Mixture of alkanolamine, copper, halide compound, acid and water
07/30/2002US6426012 Wet chemical etch process for patterning MRAM magnetic layers
07/25/2002WO2002057704A1 Foil bridge initiator and method of production of same by photolithography
07/25/2002US20020097139 Method of making an air bag
07/25/2002US20020097138 Method for making a resistor using resistive foil
07/25/2002US20020097137 Fast heat rise resistor using resistive foil
07/25/2002US20020096770 Viscous protective overlayers for planarization of integrated circuits
07/25/2002US20020096496 Patterning of GaN crystal films with ion beams and subsequent wet etching
07/25/2002US20020096227 Liner for use in processing chamber
07/24/2002EP0859873B1 Process for removing tin
07/24/2002CN1360088A Etching-fluorination plus reaction ion etching process for preparing 70-nm polysilicon grid
07/23/2002US6423644 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
07/23/2002US6423636 Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
07/23/2002CA2092747C Hot-dip coated roofing material
07/18/2002US20020094884 Multiple material golf head
07/18/2002US20020092583 Exposing the nickel-titanium alloy stent in a surface region to a oxidation treatment which causes formation of titanium oxide and reduction of nickel content of the alloy in that region
07/17/2002EP1222901A2 Medical devices and methods for their manufacture
07/17/2002EP1062379B1 Surface-treated article of magnesium or magnesium alloys, method of surface preparation and method of coating
07/17/2002EP0963459B1 Wafer support apparatus
07/17/2002CN1087870C Improved polishing slurries and method for their use
07/16/2002US6420178 High throughput screening method, array assembly and system
07/16/2002US6419986 Supplying getter; removal; fixing
07/16/2002US6419756 Process and equipment for pickling a metal strip
07/16/2002US6419754 Wet stripping; continuous analyzing eluent; colorimetric analysis
07/16/2002CA2367790A1 Medical devices, particularly stents and methods for their manufacture
07/11/2002WO2002054155A1 Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer
07/11/2002US20020091438 Stent design
07/11/2002US20020088774 Variable time etching system according to the accumulated number of devices being processed and a method for etching in the same manner
07/10/2002CN1358406A Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
07/10/2002CN1087360C Device for surface treatment of strips with liquids
07/04/2002WO2002051741A2 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
07/04/2002US20020086535 Method for local etching
07/04/2002US20020084441 Method for roughening copper surfaces for bonding to substrates
07/04/2002US20020083650 Polishing of semiconductor substrates
07/04/2002DE10162576A1 Ätzmittel und Ätzverfahren für Flüssigkristallanzeigevorrichtungen Etchant and etching processes for liquid crystal display devices
07/04/2002DE10064494A1 Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement, wobei das Halbleiterbauelement insbesondere eine bewegliche Masse aufweist A process for producing a semiconductor device as well as a product produced by the process semiconductor device, wherein the semiconductor component comprises in particular a movable mass
07/03/2002EP1219728A1 Process for stripping a turbine blade
07/03/2002EP1218566A2 Method for producing a conductor pattern on a dielectric substrate
07/02/2002US6413878 Method of manufacturing electronic components
07/02/2002US6413436 Selective treatment of the surface of a microelectronic workpiece
07/02/2002US6412438 Downstream sapphire elbow joint for remote plasma generator
06/2002
06/29/2002CA2329888A1 Metal composite articles and method of manufacture
06/27/2002WO2002050884A1 Cleaning and etching methods and their apparatuses
06/27/2002WO2002050883A1 Cleaning method and etching method
06/27/2002US20020081847 Etchant is hydrogen peroxide (H2O2), and a mixed solution including at least one of an organic acid, an inorganic acid, and a neutral salt; for liquid crystal display devices having copper lines
06/27/2002US20020081843 Semicoductor device and method of manufacturing of the same
06/27/2002US20020079290 Water, an alkaline reagent, isopropanol and an aqueous alkaline ethylene glycol solution
06/27/2002US20020079289 Etching apparatus of glass substrate
06/27/2002US20020079133 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
06/27/2002CA2366179A1 Method for removing a coating from a turbine blade
06/25/2002US6410442 Metallization of semiconductor high-speed integrated circuits by chemical-mechanical polishing; an etching solution comprising a copper(alloy) etchant, water and a surfactant
06/25/2002US6409930 Lamination of circuit sub-elements while assuring registration
06/25/2002US6409876 Apparatus for etching a workpiece