Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
03/1999
03/24/1999EP0902969A1 Radial multiple chamber microelectronics processing apparatus and process of making and using the apparatus
03/24/1999EP0902843A1 Method for making a thin film of solid material, and uses thereof
03/24/1999EP0902728A1 Catalyst compositions of nanoparticulate metal on a refractory support
03/24/1999EP0786017B1 Protective layer for protecting parts against corrosion, oxidation and excessive thermal stresses, as well as process for producing the same
03/24/1999CN1212026A Sputtering target and its preparing method
03/24/1999CN1211819A System and method for neturalizing ion beam using water vapor
03/24/1999CN1211637A Article having coating thereon
03/24/1999CN1211555A Y-Ba-Cu-O high-temp. superconductor double-face epitaxial film
03/23/1999US5886864 Substrate support member for uniform heating of a substrate
03/23/1999US5886473 Surface wave plasma processing apparatus
03/23/1999US5885939 Sputtering a vertically oriented single crystal thin film of yttrium-barium-copper oxide onto horizontally oriented yttrium-barium-copper oxide initially vapor deposited onto single crystal substrate
03/23/1999US5885672 Coated barrier film and packaging utilizing the same and method
03/23/1999US5885666 Conversion of hexagonal-like BN to cubic-like BN by ion implantation
03/23/1999US5885665 VO2 precipitates for self-protected optical surfaces
03/23/1999US5885497 Method of making a metallized plastic article
03/23/1999US5885425 Angled sputtering using a collimation grid having angled vanes which limit the distribution of trajectories of particles in at least one coordinate direction around a central axis oriented at an angle of less than 90 degrees to said surface
03/23/1999US5885357 Process and device for coating a substrate surface with vaporized inorganic material
03/23/1999US5885316 Nozzle tip for glass injection cartridge
03/18/1999WO1999013491A1 Vacuum sputtering apparatus
03/18/1999WO1999013488A1 Method and apparatus for controlling a workpiece in a vacuum chamber
03/18/1999WO1999013468A1 Method for regulating a coating process
03/18/1999WO1999013128A1 A method of depositing an electrocatalyst and electrodes formed by such method
03/18/1999WO1999013127A1 Thin films of amorphous and crystalline microstructures based on ultrafast pulsed laser deposition
03/18/1999WO1998059087A3 Method for bias sputtering
03/18/1999DE19830206A1 Crystalline aluminum oxide is deposited on a substrate
03/18/1999DE19740793A1 Method for coating surfaces by means of an installation with sputter cathodes
03/18/1999DE19739833A1 Foil transport apparatus
03/17/1999EP0902104A2 A metallic article having a thermal barrier coating and a method of application thereof
03/17/1999EP0902102A1 Ta sputtering targets, method of manufacturing the same, and assemblies
03/17/1999EP0901992A2 Method of soldering optical materials to metallic frames and framed units
03/17/1999EP0901532A1 Vacuum coating system
03/17/1999EP0901415A1 Droplet deposition apparatus
03/17/1999CN1211287A Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
03/17/1999CN1210905A Coated article
03/17/1999CN1210900A Low stress cubic boron ntride film and its preparing apparatus and preparing method
03/17/1999CN1210899A Silicon dioxide deposition by plasma activated evaporation process
03/16/1999US5883398 Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering
03/16/1999US5882946 Strontium titanate, titanium oxide
03/16/1999US5882826 The laminated film is obtained by continuously forming a sicn film on one of or each of sides of a sic film.
03/16/1999US5882778 Hard coating of excellent wear resistance and hard coating coated member thereof
03/16/1999US5882738 Apparatus and method to improve electromigration performance by use of amorphous barrier layer
03/16/1999US5882493 Heat treated and sintered sputtering target
03/16/1999US5882488 Resputtering to achieve better step coverage
03/16/1999US5882415 Electron-beam continuous process vaporization installation for thermally high stressed substrata
03/16/1999US5882413 Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
03/16/1999US5882412 Vertical two chamber reaction furnace
03/16/1999US5882403 System for providing a controlled deposition on wafers
03/16/1999US5882400 Method of producing a layer structure and the use of the method
03/16/1999US5882399 Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic interconnect
03/16/1999US5882171 Transport and transfer apparatus
03/16/1999US5881668 System for providing a controlled deposition on wafers
03/16/1999CA2151063C C-axis perovskite thin films grown on silicon dioxide
03/11/1999WO1999011837A1 Device for applying layers of hard material by dusting
03/11/1999WO1998054377A3 Stress tuned tantalum and tantalum nitride films
03/11/1999DE19738815A1 Cathode plate target segment fixing method
03/10/1999EP0901148A2 Biased and serrated extension tube for ion implanter electron shower
03/10/1999EP0900858A1 Ceramic flash evaporator
03/10/1999EP0900287A1 Substrate with a superhard coating containing boron and nitrogen and method of making the same
03/10/1999EP0900132A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets
03/10/1999CN2310077Y Gridless ion source for large area auxiliary film plating
03/09/1999US5880069 Forming nonsuperconducting film on magnesia substrate, then forming superconducting film
03/09/1999US5879840 Film-forming method for X-ray mask
03/09/1999US5879827 Catalyst for membrane electrode assembly and method of making
03/09/1999US5879823 Coated cutting tool
03/09/1999US5879819 Sliding parts and process for producing same
03/09/1999US5879811 Oxide thin film having quartz crystal structure
03/09/1999US5879760 Protecting against environmental degradation at higher temperatures
03/09/1999US5879741 Apparatus for forming film over flexible substrate by chemical vapor deposition including means for curving substrate during deposition to cancel internal stresses and reduce warpage
03/09/1999US5879532 Electroplating metal or metal alloy layer on surface of article, pulse blow drying, vapor depositing refractory metal or refractory metal alloy layer and layer of compound of refractory metal or alloy
03/09/1999US5879524 Composite backing plate for a sputtering target
03/09/1999US5879523 Ceramic coated metallic insulator particularly useful in a plasma sputter reactor
03/09/1999US5879519 Uniform and consistent deposition
03/09/1999US5879467 Cycling vacuum system between two pressures, pumping down to lower pressure
03/09/1999US5879460 System for providing a controlled deposition on wafers
03/09/1999US5879415 Detecting by an oxygen densitometer to control an inert gas flow rate and an oxygen flow rate
03/09/1999US5879134 In situ getter pump system and method
03/09/1999US5879121 Substrate transporting apparatus
03/04/1999WO1999010921A1 Method of forming a barrier layer in a contact structure
03/04/1999WO1999010913A1 An apparatus and method for allowing a stable power transmission into a plasma processing chamber
03/04/1999WO1999010548A1 High purity cobalt sputter target and process of manufacturing the same
03/04/1999DE19748483C1 High temperature superconductor material structure for a current limiting device
03/04/1999DE19737275A1 Cutter insert has an ion implanted surface zone
03/03/1999EP0899772A2 Cathodic arc vapor deposition apparatus
03/03/1999EP0899357A2 Vapor deposition production coating system
03/03/1999EP0899356A1 Method and apparatus for coating the inside of a metal tube
03/03/1999EP0730513B1 An abrasive material for precision surface treatment and a method for the manufacturing thereof
03/03/1999EP0500928B1 Endocurietherapy
03/03/1999CN1209847A Sputtering target and antiferromagnetic film and magneto-resistance effect element formed by using same
03/03/1999CN1209624A Light information recording medium and mfg. method therefor
03/03/1999CN1042352C Ornament
03/02/1999US5878074 Evaporator crucible and improved method for performing electron-beam evaporation
03/02/1999US5877087 Low temperature integrated metallization process and apparatus
03/02/1999US5877086 Metal planarization using a CVD wetting film
03/02/1999US5876861 Stress reduced sputtered nickel layer
03/02/1999US5876860 Thermal barrier coating ceramic structure
03/02/1999US5876850 Coating for carbon-carbon composites and method for producing same
03/02/1999US5876848 Thin film magnetic structure having ferromagnetic and antiferromagnetic layers
03/02/1999US5876790 Vacuum evaporation method for producing textured C60 films
03/02/1999US5876576 Apparatus for sputtering magnetic target materials
03/02/1999US5876574 Magnet design for a sputtering chamber