Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
02/2004
02/25/2004EP1390552A1 Nickel-titanium sputter target alloy
02/25/2004EP1390314A1 Heat treatable coated articles with anti-migration barrier layer between dielectric and solar control layers, and methods of making same
02/25/2004EP1390157A1 Method and apparatus for temperature controlled vapor deposition on a substrate
02/25/2004EP1284757B1 System comprising a carrier substrate and a ti/p or. ai/p coating
02/25/2004CN1478292A Mobile plating system and method
02/25/2004CN1478214A Improving stability of ion beam generated alignment layers by surface modification
02/25/2004CN1478154A Method for cold process deposition of antiglare layer
02/25/2004CN1477676A Method for making display equipment
02/25/2004CN1477230A Hign temp-resistant article and its mfg. method
02/25/2004CN1477228A Central multiple arc source type ion plating method
02/25/2004CN1477227A Equipment for preparing multi-layer metal coated composite film and its production process
02/25/2004CN1476948A Multicomponent composite coated cutting tool and its preparation method
02/25/2004CN1139671C Method of depositing electrocatalyst and electrodes formed by such method
02/24/2004US6697194 Antireflection coating for ultraviolet light at large angles of incidence
02/24/2004US6696171 Method of ion implantation using oxygen and a metallic surface layer formed therefrom
02/24/2004US6696107 Passivation; displacing particles; high density magnetic recording media; data storage
02/24/2004US6696096 Apparatus for and method of vacuum vapor deposition and organic electroluminescent device
02/24/2004US6695954 If a film consisting of only the sputtered material is to be formed on a substrate, then the gas within the chamber is nonreactive, on the other hand, a nitride or oxide film formed by chemical reaction of target and reactive gas
02/24/2004US6694792 Substrate treatment process
02/24/2004CA2162998C Metallized film and decorative articles made therewith
02/19/2004WO2004015748A1 Method and device for alternating deposition of two materials by cathodic sputtering
02/19/2004WO2004015496A2 Using scanning probe microscope topographic data to repair photomask defect using charged particle beams
02/19/2004WO2004015169A2 Method for coating the surface of metallic material, device for carrying out said method
02/19/2004WO2004015163A2 Method for the production of a ceramic fiber with a metal coating
02/19/2004WO2004015162A1 METHOD FOR PREPARING ALUMNA COATING FILM HAVING α-TYPE CRYSTAL STRUCTURE AS PRIMARY STRUCTURE
02/19/2004WO2004015161A1 Method and array for processing carrier materials by means of heavy ion radiation and subsequent etching
02/19/2004WO2003087426A3 Coating installation
02/19/2004WO2003048406A3 Coating method and coating
02/19/2004WO2003041138A3 Sintered polycrystalline gallium nitride
02/19/2004WO2003030224A3 Barrier formation using novel sputter-deposition method
02/19/2004WO2002076631A3 Composite layer and method for producing said composite layer
02/19/2004US20040033702 Deposition of thin films by laser ablation
02/19/2004US20040033701 Lanthanide doped tiox dielectric films
02/19/2004US20040033681 Lanthanide doped TiOx dielectric films by plasma oxidation
02/19/2004US20040033679 Patterning of nanostructures
02/19/2004US20040033424 Forming semiconductor devices, microelectronic devices, microelectromechanical devices, microfluidic devices, and photonic devices
02/19/2004US20040033369 Flexible electrically conductive film
02/19/2004US20040031680 One or more shields for use in a sputter reactor
02/19/2004US20040031546 High-purity ferromagnetic sputter targets and methods of manufacture
02/19/2004US20040031442 Evaporation method, evaporation device and method of fabricating light emitting device
02/19/2004DE10235818A1 Production of a ceramic fiber having a metal coating-reinforcing fiber comprises transferring the metal coating on the ceramic fiber into a polygonal outer mold to form a composite of reinforcing fibers
02/19/2004DE10234861A1 Process and device for alternate deposition of two different materials by cathodic atomization for electronic multilayers and micromechanics uses two part target and alternate excitation
02/19/2004CA2495457A1 Method for coating the surface of metallic material, device for carrying out said method
02/18/2004EP0853345B1 METHOD FOR FORMING CdTe FILM
02/18/2004CN1476737A Patterning method and device, film forming method and device and electro-optic device and its mfg. method
02/18/2004CN1476533A Method for quantifying texture homogeneity of polycrystalline material
02/18/2004CN1476420A Silicon monoxide sintered product and method for production thereof
02/18/2004CN1476279A Method, system and apparatus for mfg. organic electroluminescence device and its display apparatus
02/18/2004CN1476278A Shadow mask and plane display apparatus made of said shadow mask and its manufacturing method
02/18/2004CN1476041A Shady cover used for manufacturing plane display device
02/18/2004CN1475767A Heat exchanger surface treatment device capable of proceeding continuous treatment
02/18/2004CN1475597A Carbon film coved part and its mfg. method
02/18/2004CN1475596A Alloy material for use as reflection film of reflection type plane display and sputtering target material
02/18/2004CN1139105C Laser annealing method for semiconductor layer
02/18/2004CN1138979C Plasma probe diagnosing device for glow discharge surface treatment
02/18/2004CN1138871C Aluminium or aluminium alloy sputtering target
02/18/2004CN1138870C Sb-doped strontium titanate film and its preparing process
02/18/2004CN1138863C Steel sheet for heat shrink band and method for producing the same
02/17/2004US6693747 Optical element having antireflection film
02/17/2004US6693030 Reactive preclean prior to metallization for sub-quarter micron application
02/17/2004US6692850 Controlled stress optical coatings for membranes
02/17/2004US6692843 Multilayer
02/17/2004US6692833 By chemical vapor deposition on a non-conductive substrate using as precursor a metal halide and/or organometallic compound and a reducing agent; allows another metal conducting layer to be deposited by electrolysis
02/17/2004US6692809 Optical recording medium
02/17/2004US6692624 Vacuum coating apparatus
02/17/2004US6692623 Vacuum arc vapor deposition apparatus and vacuum arc vapor deposition method
02/17/2004US6692622 Plasma processing apparatus with an electrically conductive wall
02/17/2004US6692619 High-saturation magnetization; magnetron co-sputtering of two or more kinds of materials; uniform thickness; magnetic recording media
02/17/2004US6692618 Magnetron sputter source with multipart target
02/17/2004US6692617 Sustained self-sputtering reactor having an increased density plasma
02/17/2004US6692576 Wafer support system
02/17/2004US6692568 Sputtering a group iii metal in a nitrogen or ammonia environment and depositing it on a growth surface
02/12/2004WO2004013375A1 Installation for the vacuum treatment of substrates
02/12/2004WO2004013374A2 Device and method for coating substrates
02/12/2004WO2004013373A2 Apparatus and method to control bias during sputtering
02/12/2004WO2004013372A1 Sputtering target, sintered body, conductive film formed by using them, organic el device, and substrate used for the organic el device
02/12/2004WO2004013371A2 Method and apparatus for plasma implantation without deposition of a layer of byproduct
02/12/2004WO2003086958A3 Method for producing a product having a structured surface
02/12/2004WO2003046245A3 Process for making angstrom scale and high aspect functional platelets
02/12/2004US20040029039 Optical light emitting diodes; generation of heat by vaporization; electroluminescence display
02/12/2004US20040028957 Process control; vaporization of various sulfide compounds
02/12/2004US20040028954 Substrate overcoated with smooth oxide composite
02/12/2004US20040028938 Method of making a protective coating forming a thermal barrier with a bonding underlayer on a superalloy substrate, and a part obtained thereby
02/12/2004US20040028912 Ag base alloy thin film and sputtering target for forming Ag base alloy thin film
02/12/2004US20040028838 Using microwave frequency; barium strontium titanate as buffer during annealing
02/12/2004US20040028813 Method for producing a continuous coating at the surface of a component
02/12/2004US20040028811 Bismuth titanium silicon oxide, bismuth titanium silicon oxide thin film, and method for forming the thin film
02/12/2004US20040027700 Method of forming optical thin film
02/12/2004US20040027048 Magnesium barium thioaluminate and related phosphor materials
02/12/2004US20040026419 Plastic overcoated with metal; vacuum, vapor deposition
02/12/2004US20040026412 Method and device for plasma treatment of moving metal substrates
02/12/2004US20040026368 Monitoring substrate processing by detecting reflectively diffracted light
02/12/2004US20040026360 Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
02/12/2004US20040026242 Such as attachment of octadecyl thiol to titanium
02/12/2004US20040026240 Sputtering apparatus and sputter film deposition method
02/12/2004US20040026236 Nanolayered coated cutting tool and method for making the same
02/12/2004US20040026235 System and apparatus for control of sputter deposition process
02/12/2004US20040026234 Method and device for continuous cold plasma deposition of metal coatings
02/12/2004US20040025986 Controlled-grain-precious metal sputter targets
02/12/2004DE10235057A1 Vapor deposition of acicular x-ray phosphor layer, used e.g. as phosphor or storage phosphor in medicine or non-destructive testing of materials involves simultaneous vaporization of divalent europium oxyhalide and alkali halide