Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
04/2004
04/28/2004CN1147619C Spattring filming device and spattering filming method
04/28/2004CN1147618C Thin-film deposition apparatus using cathodic arc discharge
04/28/2004CN1147617C Vacuum plasma gas-phase deposit process to form multielement and multilayer discrete structure coating
04/27/2004US6728037 Multilayer-coated reflective mirrors for X-ray optical systems, and methods for producing same
04/27/2004US6726993 Carbon coatings, method and apparatus for applying them, and articles bearing such coatings
04/27/2004US6726987 Coating of a mixed-oxide layer predominantly formed of Al2O3 and containing 0.1 to less-than 3% of TiO2 and 0.01-0.5% of B2O3 homogeneously distributed in Al2O3; especially a cutting insert
04/27/2004US6726816 Method for forming thin film, spheroid coated with thin film, light bulb using the spheroid and equipment for film formation
04/27/2004US6726814 Process for producing optical article
04/27/2004US6726813 Security device and method for producing it
04/27/2004US6726812 Ion beam sputtering apparatus, method for forming a transparent and electrically conductive film, and process for the production of a semiconductor device
04/27/2004US6725522 Method of assembling target and backing plates
04/27/2004CA2145570C Magnetron atomization source and method of use thereof
04/22/2004WO2004034450A1 A sputtering apparatus having enhanced adhesivity of particles and a manufacturing method thereof
04/22/2004WO2004034449A2 Transparent oxide semiconductor thin film transistors
04/22/2004WO2004033749A1 POLYCRYSTALLINE MgO VAPOR DEPOSITION MATERIAL
04/22/2004WO2004033748A2 Method to recover spent components of a sputter target
04/22/2004WO2004033743A2 Homogenous solid solution alloys for sputter-deposited thin films
04/22/2004WO2004033742A2 Pvd target and method of treating target
04/22/2004WO2004033364A2 Methods for forming coatings on mems devices
04/22/2004WO2004011691B1 Copper sputtering targets and methods of forming copper sputtering targets
04/22/2004WO2003057941A8 Production of a ceramic material for a heat-insulating layer and heat-insulating layer containing said material
04/22/2004US20040077249 Method and apparatus for carbon fiber fixed on a substrate
04/22/2004US20040077177 Dielectric materials
04/22/2004US20040077161 Method of depositing a material layer
04/22/2004US20040077158 Method of manufacturing semiconductor device through salicide process
04/22/2004US20040077153 Semiconductor substrate, SOI substrate and manufacturing method therefor
04/22/2004US20040076857 PVD coated cutting tool
04/22/2004US20040076856 Surface coating of a carbide or a nitride
04/22/2004US20040076835 Display apparatus and antireflection substance
04/22/2004US20040076819 Release films
04/22/2004US20040076765 To impart improved adhesion to metal, by surface treating the polyimide with a solution of potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and then with an acid; peel strength
04/22/2004US20040076761 Applying a water soluble paint in definite zones of a printed plastic film, metallization of the film and washing the film with water for removal of the water soluble paint and the metal on it; food packaging; avoids acrylic "lake attack"
04/22/2004US20040076750 Impregnating a non- sintered porous inorganic oxide matrix material with silane, siloxane and/or siloxazane compound, evaporating the compounds from the matrix material in a high vacuum at 200-600 degree C., depositing evaporated compounds
04/22/2004US20040076740 Light source of a light interference type optical thickness monitor (OTM) for film formation control is a variable wavelength light source, and formed by a laser light source which emits coherent light
04/22/2004US20040076393 Coating for optical fibers
04/22/2004US20040075910 Optical antireflection film and process for forming the same
04/22/2004US20040074771 Rectangular magnetron sputtering cathode with high target utilization
04/22/2004US20040074770 Rotary target
04/22/2004US20040074769 Thin film forming apparatus and thin film forming method
04/22/2004US20040074604 Neutral particle beam processing apparatus
04/22/2004US20040074603 Vacuum processing method
04/22/2004US20040074467 Sliding structure for automotive engine
04/22/2004US20040074445 Film deposition system and film deposition method using the same
04/22/2004US20040074443 Gutter broom; vacuum system for air flow; flexible skirt which pivots; removing dust
04/22/2004US20040074104 Vacuum processing apparatus and operating method therefor
04/22/2004US20040074103 Vacuum processing apparatus and operating method therefor
04/22/2004DE10296935T5 Barrierenverstärkungsprozess für Kupferdurchkontaktierungen(oder Zwischenverbindungen) Barriers amplification process for Kupferdurchkontaktierungen (or intermediates)
04/22/2004DE10296504T5 Ultradünner Metallfilm, ultradünner mehrschichtiger Metallfilm, und Verfahren zur Herstellung des ultradünnen Metallfilms oder ultradünnen, mehrschichtigen Metallfilms Ultra-thin metal film, ultra-thin metal multilayer film, and method of making the ultra-thin metal film or ultra-thin, multi-layered metal film
04/22/2004DE10196154T5 Eine verbesserte optische Blendschutzvorrichtung An improved optical glare protection device
04/21/2004EP1411540A2 Fluorine generation
04/21/2004EP1411375A1 Optical element having lanthanum fluoride film
04/21/2004EP1411146A2 Method of forming cobalt silicide film and method of manufacturing semiconductor device having cobalt silicide film
04/21/2004EP1411145A1 Sliding structure for automotive engine
04/21/2004EP1411031A1 Ceramic and method for preparation thereof, and dielectric capacitor, semiconductor and element
04/21/2004EP1411028A1 Ceramics film and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
04/21/2004EP1410901A1 Deposition film
04/21/2004EP1410702A1 Dielectric processing with included stabilization periods
04/21/2004EP1410442A1 Electronic component and method for producing an electronic component
04/21/2004EP1410433A2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
04/21/2004EP1409763A1 Method and device for depositing thin films
04/21/2004EP1409762A1 A process and apparatus for plasma activated deposition in a vacuum
04/21/2004EP1320636B1 Method and device for depositing especially, organic layers by organic vapor phase deposition
04/21/2004EP0966351A4 Zinc oxide stabilized zirconia
04/21/2004CN1491363A Display device and reflction preventing substrate
04/21/2004CN1491296A Method and device for producing optically effective system of layers
04/21/2004CN1491295A Cylindrical magnetron target and apparatus for affixing target to rotatable spindle assembly
04/21/2004CN1491294A Rejuvenation of refractory metal products
04/21/2004CN1491293A Spatter device and spatter film forming method
04/21/2004CN1490430A Electric arc jet plating method
04/21/2004CN1490269A Sterilizing glass and producing process thereof
04/21/2004CN1146674C Apparatus for preparing diamond-like film
04/21/2004CN1146476C Method for producing adhesive surface coatings
04/20/2004US6724581 High moment iron nitride based magnetic head layers resistant to hard axis annealing
04/20/2004US6724017 In a two-dimensional or three-dimensional lattice; coulomb blocking devices using quantum dots.
04/20/2004US6723998 Faraday system for ion implanters
04/20/2004US6723943 Manufacturing metallic strip for packaging having a coating made up of a metallic layer and a polymer film, and the strip obtained
04/20/2004US6723660 Thin-film forming apparatus and thin-film forming method
04/20/2004US6723475 Multilayer
04/20/2004US6723449 Structure and plating method of thin film magnetic head and magnetic storage apparatus
04/20/2004US6723391 Applying a first hard coating such as a metal nitride containing at least 2 metals, and then a second hard coating by plasma vacuum coating; altering percentage of second metal depending on hardness or adhesive strength desired of coating
04/20/2004US6723390 Laser deposition of elements onto medical devices
04/20/2004US6723281 Silver alloyed with palladium and at least one of aluminum, copper, tantalum, chromium, titanium and cobalt; stability; processability; lower electrical resistivity
04/20/2004US6723215 Sputtering apparatus for forming a metal film using a magnetic field
04/20/2004US6723214 Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system
04/20/2004US6723213 Titanium target assembly for sputtering and method for preparing the same
04/20/2004US6723211 Method of making coated articles with contact layer that is more oxidized further from IR reflecting layer
04/20/2004US6723210 Method for improving performance of sputtering target
04/20/2004US6723209 System and method for performing thin film deposition or chemical treatment using an energetic flux of neutral reactive molecular fragments, atoms or radicals
04/20/2004US6723187 Methods of fabricating articles and sputtering targets
04/20/2004US6723186 Method of manufacturing metallic film consisting of giant single crystal grains
04/20/2004US6723183 Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target
04/20/2004US6723177 Life extension of chromium coating and chromium alloys
04/20/2004US6723176 Mixing and sintering titanium and titanium dioxide powders in a vacuum, mixing with aluminum and silver, coating a titanium alloy and heating at 500-900 degrees c
04/20/2004US6722159 Photocatalytically-activated self-cleaning article and method of making same
04/20/2004CA2327092C Coated pcbn cutting tools
04/15/2004WO2004032590A1 Electromagnetic shielding material provided with shielding layer
04/15/2004WO2004032189A2 Manufacturing apparatus and method for large-scale production of thin-film solar cells
04/15/2004WO2004032184A2 Low temperature salicide forming materials and sputtering targets formed therefrom
04/15/2004WO2004032175A1 Device for the treatment of a web-type material in a plasma-assisted process
04/15/2004WO2004031436A1 Method of bonding sputtering target materials