Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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01/03/1997 | CA2224658A1 Non-aqueous solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
01/03/1997 | CA2224636A1 Solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
01/02/1997 | EP0750654A1 Single-package, duroplastic hardenable coating compound |
01/01/1997 | CN1139138A Mending method of decorative brick board in buildings |
12/19/1996 | WO1996040807A1 Application of a polymer backing onto a glass substrate |
12/19/1996 | CA2222334A1 Application of a polymer backing onto a glass substrate |
12/18/1996 | EP0748831A2 Snap-cure epoxy adhesives |
12/17/1996 | US5585446 Polyepoxide-polyoxyalkylene monoamine(s) product with hardener |
12/17/1996 | US5584121 Epoxy resin blend adhesive |
12/11/1996 | EP0747458A1 Adhesive composition and composite of rubber with fiber |
12/11/1996 | EP0747434A2 Epoxy resin composition and adhesive based thereon |
12/11/1996 | EP0747414A2 The use of 2-cyaniminotetrahydro-1H-1,3,5-triazines compounds as curing agent in aqueous coating compositions |
12/11/1996 | EP0747413A2 Self-emulsifying aqueous epoxy resin dispersions |
12/11/1996 | EP0747371A1 Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives |
12/11/1996 | EP0747370A1 Polydiglycidylphenyl ethers of alkylene or alkylenoxy chains for use in microelectronics adhesives |
12/10/1996 | US5582772 Copper oxide-filled polymer die attach adhesive composition for semiconductor package |
12/10/1996 | US5582672 Method of preparing a coated abrasive article that incorporates an energy cured make coat |
12/09/1996 | CA2178554A1 Self-emulsifying aqueous epoxy resin dispersions |
12/04/1996 | CN1137041A Aliphatic epoxide-amine adducts with substantial sidechain branching, process for their preparation, and their use |
11/26/1996 | US5578657 CRT adhesive composition and CRT obtained by the use thereof |
11/26/1996 | US5578649 Process for producing epoxy adhesive auxiliary, and epoxy adhesive |
11/26/1996 | US5578369 Cycloaliphatic diepoxide, vinyl acetate-vinyl chloride-vinyl alcohol terpolymer, incoherent pulsed ultraviolet radiation |
11/26/1996 | CA2042840C Preparation and use of resins that are relatively non-inflammable and resistant to high temperatures |
11/19/1996 | US5576388 Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
11/19/1996 | US5576061 Aqueous, essentially VOC-free adhesive epoxy primer |
11/19/1996 | US5575956 Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives |
11/06/1996 | EP0741505A2 Multilayer printed wiring board and process for manufacturing the same |
11/06/1996 | EP0741158A2 Aliphatic epoxy/amine adducts bearing a high amount of side chains, process for their preparation and their application |
11/06/1996 | CN1134966A Hot melt adhesive composition for coating interlining material |
11/06/1996 | CN1134964A Hot-melt adhesive composition for coating of interlining material |
11/05/1996 | US5571365 Adhesive for printed circuit board |
11/03/1996 | CA2175532A1 Aliphatic epoxide-amine adducts with substantial side-chain branching, process for their preparation, and their use |
10/31/1996 | WO1996034040A1 Heat resistant adhesive used in sterilizable packaging |
10/30/1996 | EP0739915A2 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these |
10/30/1996 | EP0739395A1 Heat curable toughened epoxy resin compositions |
10/30/1996 | CN1134718A Topographical method |
10/29/1996 | US5569686 Polymeric adhesion promoter and latexes; and polymeric adhesion promoter, epoxy resins and latexes are used to improve adherence between various substrates |
10/26/1996 | CA2174987A1 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these |
10/24/1996 | WO1996033248A1 Amine cross-linkable hot-melt adhesive and adhesive film |
10/23/1996 | EP0738307A1 Novel composite structures |
10/23/1996 | CN1134167A Anticorrosion adhesive composition and method |
10/22/1996 | US5567782 Bonding with polyepoxide-polyoxyalkylenemonoamines product |
10/17/1996 | WO1996032454A1 Epoxy adhesives with dithiooxamide adhesion promoters |
10/17/1996 | WO1996032453A1 Melt-flowable materials and method of sealing surfaces |
10/17/1996 | CA2216420A1 Epoxy adhesives with dithiooxamide adhesion promoters |
10/17/1996 | CA2216285A1 Melt-flowable materials and method of sealing surfaces |
10/16/1996 | CN1133606A Binders based on fat chemical reaction products |
10/15/1996 | US5565507 Adhesive composition |
10/10/1996 | WO1996031574A1 Adhesive, adhesive film and adhesive-backed metal foil |
10/02/1996 | EP0735070A1 Curing agents for elastic epoxy resin compositions |
10/02/1996 | CA2173182A1 Hardeners for elastic epoxy resin systems |
09/25/1996 | EP0733691A2 Adhesive composition for coating interlinings |
09/25/1996 | EP0733690A2 Hot melt adhesive composition |
09/25/1996 | EP0733689A1 Chloroprene rubber adhesive composition |
09/25/1996 | EP0721473A4 Curable adhesive compositions containing polyamide resins |
09/23/1996 | CA2172223A1 Hot-melt adhesive composition for the coating of interlining material |
09/23/1996 | CA2172198A1 Hot-melt adhesive composition for the coating of interlining material |
09/18/1996 | EP0591307B1 Reactive hot-melt adhesive |
09/10/1996 | US5554672 Epoxy resin primer for lining of wet concrete surfaces |
09/04/1996 | EP0730188A2 Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
09/03/1996 | USH1597 Epoxidized diene elastomers for exterior block crosslinking |
08/28/1996 | EP0728165A1 Topographical method |
08/22/1996 | WO1996021704A3 Method and composition for bonding components to glass |
08/21/1996 | EP0726928A1 Anticorrosion adhesive composition and method |
08/21/1996 | EP0726925A1 Electrically conductive adhesives |
08/20/1996 | US5548026 Two-part adhesive |
08/20/1996 | US5547823 Photocatalyst composite and process for producing the same |
08/20/1996 | CA1338542C Specimen mounting adhesive composition |
08/07/1996 | EP0724613A1 Binders based on fat chemical reaction products |
08/07/1996 | CN1128283A Adhesive composition for ruber fibre, synthetic fibre for reinforcement of ruber and products of ruber reinforced with fibres |
07/31/1996 | CN1128040A Electrically conductive adhesive compositions |
07/18/1996 | WO1996021704A2 Method and composition for bonding components to glass |
07/18/1996 | WO1996016218A3 Binder composition useful for producing non-woven fabrics and process for producing moulded parts made of non-woven fabrics |
07/18/1996 | WO1996012752A3 Curable epoxy resin accelerated by boric acid and its analogs |
07/18/1996 | CA2210189A1 Method and composition for bonding components to glass |
07/17/1996 | EP0721473A1 Curable adhesive compositions containing polyamide resins |
07/17/1996 | CN1127005A Compatible blends of epoxy resins and epoxidized polydienes |
07/17/1996 | CN1126963A Surface treating articles and methods of making same |
07/17/1996 | CN1126740A Einkomponentige, duroplastisch haertende beschichtungsmasse |
07/02/1996 | US5531020 Method of making subsurface electronic circuits |
06/26/1996 | CN1125460A Stabilized curable adhesives |
06/26/1996 | CN1125456A Stabilized cationically-curable compositions |
06/20/1996 | WO1996011241A3 Curable binders for pressure sensitive adhesives and sealants |
06/12/1996 | EP0715640A1 Adhesive composition |
06/12/1996 | EP0633917B1 Silicone release compositions |
06/12/1996 | EP0556290B1 Enclosing a substrate with a heat-recoverable article |
06/11/1996 | US5525685 Epoxy resin compositions |
06/11/1996 | US5525433 Epoxy adhesives and copper foils and copper clad laminates using same |
06/05/1996 | CN1124030A Thermally cross-linkable heat-sealing adhesive |
06/04/1996 | US5523137 Adhesive paper for tape automated bonding |
05/30/1996 | WO1996016218A2 Binder composition useful for producing non-woven fabrics and process for producing moulded parts made of non-woven fabrics |
05/30/1996 | DE4441765A1 Bindemittelzusammensetzung zur Herstellung von Faservliesen und Verfahren zur Herstellung von Faservlies-Formteilen Binder composition for the production of nonwoven fabrics and methods for producing fibrous non-woven moldings |
05/30/1996 | CA2205965A1 Binder composition for producing fibrous webs and a process for producing fibrous web mouldings |
05/29/1996 | EP0713445A1 Chlorine-free multilayered film medical device assemblies |
05/28/1996 | US5521227 Adhesives |
05/23/1996 | WO1996015204A1 Epoxy adhesive formulation |
05/22/1996 | EP0526463B1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions |
05/22/1996 | CN1031833C Resin binder for refractory materials |
05/17/1996 | WO1996014349A1 Stable, low cure-temperature semi-structural pressure sensitive adhesive |
05/15/1996 | CN1122355A Electrostatic flocking adhesives solidifying under normal temperature |