| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 03/07/2007 | EP1760102A1 Cationically photopolymerizable composition and optoelectronic component using same |
| 03/07/2007 | EP0999436B1 Temperature sensor and electronic apparatus containing the same |
| 03/07/2007 | CN1926934A Tectorial ferrite forming product and method manufacturing the same |
| 03/07/2007 | CN1926214A Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 03/07/2007 | CN1926189A Modifier for polyester resin and process for producing molded article with the same |
| 03/07/2007 | CN1926188A Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| 03/07/2007 | CN1923887A Structure-type wave-absorption composite material containing magnetic glass fiber and preparation method thereof |
| 03/06/2007 | US7186945 Sprayable adhesive material for laser marking semiconductor wafers and dies |
| 03/06/2007 | US7186784 Solubility of phosphorus carboxylic acids for fireproofing polymers |
| 03/01/2007 | WO2007025036A1 Epoxy based reinforcing patches with encapsulated physical blowing agents |
| 03/01/2007 | WO2007025007A1 Epoxy compositions having improved impact resistance |
| 03/01/2007 | WO2007024571A2 Uv curable electrically conductive film containing a polysilane |
| 03/01/2007 | US20070049708 Coating-forming components of epoxy resin and amine curing agent wherein curing agent is reaction product of methaxylylenediamine or paraxylylenediamine, a polyfunctional compound having at least one acyl group or carboxylic acid |
| 03/01/2007 | US20070049705 Polycarbonate molding compositions having improved rheological properties |
| 03/01/2007 | US20070049701 High flow polyester composition, method of manufacture, and uses thereof |
| 03/01/2007 | DE102005040464A1 Polycarbonat-Formmassen mit verbesserten rheologischen Eigenschaften Polycarbonate molding compositions with improved rheological properties |
| 03/01/2007 | CA2620028A1 Epoxy compositions having improved impact resistance |
| 02/28/2007 | EP1758157A1 Resin paste for die bonding and its use |
| 02/28/2007 | EP1756241A2 Method for forming structures using an encapsulated adhesive material |
| 02/28/2007 | EP1756206A2 Self-adhesive prepreg |
| 02/28/2007 | EP1546275B1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 02/28/2007 | EP1414902B1 Epoxy resin |
| 02/28/2007 | CN1922268A Epoxy resin mortar composition and a method of coating the same on concrete surface |
| 02/28/2007 | CN1922252A Fire retardant compositions using siloxanes |
| 02/28/2007 | CN1919925A Paste of nanoscale powder and dispersant |
| 02/28/2007 | CN1919916A Composite material, preparation method thereof and application in fuel cell double polar plate |
| 02/28/2007 | CN1919909A Rubber composition for side wall |
| 02/28/2007 | CN1919900A Preparation method of anisotropic conductive rubber film |
| 02/28/2007 | CN1302070C Flame-retarded epoxy composition for packing semiconductor and semiconductor device |
| 02/28/2007 | CN1302053C Method for producing molding compound resin tablet and method for manufacturing white light emitting diode by using the production method |
| 02/27/2007 | US7183661 Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof |
| 02/27/2007 | US7183363 Thermally conductive casting compound |
| 02/27/2007 | US7182833 Which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated |
| 02/22/2007 | US20070043166 Epoxy resin composition for encapsulating semiconductor chip and semiconductor device |
| 02/22/2007 | US20070041926 Mixture, comprising a surfactant and a cosurfactant |
| 02/22/2007 | DE112005000840T5 Lichtstreuende Harz-Zusammensetzung Light diffusing resin composition |
| 02/22/2007 | DE102006032063A1 Formmasse Molding compound |
| 02/21/2007 | EP1754751A1 Aqueous dispersion, composition and coating agent for paper |
| 02/21/2007 | EP1754734A1 Curing agent for epoxy resins and epoxy resin compositions |
| 02/21/2007 | EP1753772A1 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 02/21/2007 | CN1918703A Resin compositions and methods of use thereof |
| 02/21/2007 | CN1918207A Encapsulation epoxy resin material and electronic component |
| 02/21/2007 | CN1916049A Epoxy resin curing agent of containing phosphor, prepartion method and applicaiton |
| 02/21/2007 | CN1301297C Polyester resin compositions for profile extrusion and profiles made therefrom |
| 02/21/2007 | CN1301296C Epoxy resin composition |
| 02/20/2007 | US7179853 Resin dispersion for cationic electrodeposition and cationic electrodeposition coating composition including the same |
| 02/20/2007 | US7179552 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 02/20/2007 | CA2184471C Coating composition, process for forming cured film and coated article |
| 02/15/2007 | WO2007018239A1 Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive |
| 02/15/2007 | WO2007017341A1 Fluxing encapsulants casting resins for dca applications, based on cationically curable epoxy resins |
| 02/15/2007 | US20070036982 protective coatings comprises a cured epoxy resin and a crosslinked polyolefin for coating on pipe, vessel, conduit, rod, tube; free of an adhesive; housing and transporting industrial chemical fluids; corrosion resistance |
| 02/15/2007 | US20070036981 Molding compositions containing quaternary organophosphonium salts |
| 02/15/2007 | US20070036971 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 02/15/2007 | US20070034515 Radiation- or thermally-curable oxetane barrier sealants |
| 02/15/2007 | DE102005037892A1 Cold-Box Bindemittel unter Verwendung von Oxetanen Cold box binder using oxetanes |
| 02/14/2007 | EP1752494A1 Photo-radical-curable resin composition containing epoxy resin |
| 02/14/2007 | EP1751238A1 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 02/14/2007 | EP1751222A2 Low heat release and low smoke reinforcing fiber/epoxy composites |
| 02/14/2007 | EP1581573A4 Water-based epoxy grout |
| 02/14/2007 | CN1914246A Thermosetting resin composition and use thereof |
| 02/14/2007 | CN1300185C Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| 02/14/2007 | CN1300152C Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
| 02/14/2007 | CN1299573C Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof |
| 02/08/2007 | WO2007015591A1 Epoxy resin composition for packaging semiconductor device |
| 02/08/2007 | US20070032576 Composite materials and methods of making the same |
| 02/08/2007 | US20070031676 Resin-coated metal sheet and resin composition |
| 02/08/2007 | US20070031675 Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same |
| 02/07/2007 | EP1750031A2 Method for manufacturing wet-type friction member |
| 02/07/2007 | EP1749845A1 Composite materials and methods of making the same |
| 02/07/2007 | EP1497373B1 Thermoset composition, method, and article |
| 02/07/2007 | CN1910235A Reactive thermosetting system with long storage life |
| 02/07/2007 | CN1910234A Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 02/07/2007 | CN1908108A Encapsulating material and method for making same |
| 02/07/2007 | CN1908105A Aqueous compositions for use as adhesive and composite structure |
| 02/07/2007 | CN1908065A 环氧树脂组合物以及半导体装置 Epoxy resin composition and a semiconductor device |
| 02/07/2007 | CN1908064A Organic fluorescence resin for multipurpose LED |
| 02/07/2007 | CN1908063A High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
| 02/07/2007 | CN1908045A Metal salts of organic acids as conductivity promoters |
| 02/07/2007 | CN1298772C Method of preparing conductive polypyrrole film on epoxy resin surface |
| 02/01/2007 | WO2007013761A1 Pre-sealed steel sheet with improved anti- corrosion and weldability and preparing method thereof |
| 02/01/2007 | WO2007013234A1 Insulating material, wiring board and semiconductor device |
| 02/01/2007 | US20070027274 An optionally halogenated bisphenol A or bisphenol F epoxy resin, a resorcinol epoxy resin or a tetrakis(hydroxyphenyl)ethane epoxy resin; dicyandiamide as a latent hardener for the epoxy resin, and assymetrical N,N-dimethylurea as an accelerator; powder coatings, electrical laminates, and adhesives |
| 02/01/2007 | US20070027273 Epoxy resin composition and semiconductor device |
| 02/01/2007 | US20070027233 Process for producing modified epoxy resin |
| 02/01/2007 | US20070026572 Dicing/die bonding sheet |
| 02/01/2007 | DE102005035905A1 Nitrilkautschuk Blends zur Fixierung von Metallteilen auf Kunststoffen Nitrile rubber blends for fixing of metal parts to plastics |
| 01/31/2007 | EP1240262B1 Powder coating compositions |
| 01/31/2007 | CN1906234A Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 01/31/2007 | CN1906226A Curing silicone composition and cured product thereof |
| 01/31/2007 | CN1904641A Moldable and curing reflector material with high reflectivity |
| 01/31/2007 | CN1903941A Emulsified asphalt modified by epoxy resin |
| 01/31/2007 | CN1903919A Polymer electrolyte for a fuel cell, a method of producing the same, and a fuel cell system comprising the same |
| 01/31/2007 | CN1298033C Anisotropic conductive adhesive, assembling method, and electrooptical device module |
| 01/31/2007 | CN1297587C Crosslinked polyamide |
| 01/31/2007 | CN1297583C Sealing material for liquid crystal and liquid crystal display cell using same |
| 01/30/2007 | US7170038 Suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article |
| 01/30/2007 | US7169862 Reaction product of an epoxy resin and dimer fatty acids further reacted with a polyisocyanate, an amino functional siloxane or polysiloxane curing agent; primers with improved corrosion resistance and adhesion to aluminum substrates |
| 01/30/2007 | US7169833 shell-core polymer containing (meth)acrylate ; aromatic amine curing agent; glass transition temperature; controlling particle size; sealant for flip chips |
| 01/30/2007 | US7169474 Epoxy resin composition and semiconductor device |
| 01/30/2007 | US7169462 strong, easy to use, trowelable, flexible, passes negative hydrostatic test; epoxy component also preferably includes an epoxy flexibilizer and a reactive diluent for epoxy chain termination, glycidyl ether |