| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 04/11/2007 | CN1944513A Melt flowable polyethylene/thermosetting resin composite material |
| 04/11/2007 | CN1944441A Sesqui-siloxane containing benzoxazinyl group and its composition and preparing method |
| 04/11/2007 | CN1944429A 2-oxazolinyl-benzo oxazinyl compound and its composition and preparing method |
| 04/11/2007 | CN1944026A Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 04/11/2007 | CN1309787C Energy-ray curing resin composition |
| 04/11/2007 | CN1309786C Thermosetting resin composition and laminates and circuit board substrates made by same |
| 04/11/2007 | CN1309784C Resin composition and rheostat |
| 04/11/2007 | CN1309783C Epoxy resin compositing, its solidification product, new-type epoxy resin, phenol compound, and its preparation method |
| 04/11/2007 | CN1309770C High volume fraction carbon nanotube array - resin base composite materials and method for preparing same |
| 04/11/2007 | CN1309761C Adhesive resin and film adhesives made by using the same |
| 04/10/2007 | US7202304 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 04/05/2007 | WO2007038753A2 Compositions effective to suppress void formation |
| 04/05/2007 | WO2007038674A1 Braid-reinforced composites and processes for their preparation |
| 04/05/2007 | US20070078236 Reactive thermosetting system with long storage life |
| 04/05/2007 | US20070078235 Glycidyl (meth)acrylate powder coating compositions containing caproloactone-derived side chains |
| 04/05/2007 | US20070077432 Finely particulate composite containing carbon compound encapsulated therein |
| 04/05/2007 | US20070077425 Sizing composition for an insulating product based on mineral wool, and resulting products |
| 04/05/2007 | DE102005046642A1 Corrosion protection of metal parts e.g. in petroleum or gas processing uses a coating containing glycidyl compounds, an amine hardener, an adhesive aid and a non-reactive plasticizer |
| 04/05/2007 | DE102005046641A1 Anti-corrosion protection for external metal surfaces, involves using a curable mixture of glycidyl compounds, amine hardeners, coupling agent and inert plasticizer |
| 04/04/2007 | EP1770108A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 04/04/2007 | EP1769032A1 Amine compositions |
| 04/04/2007 | EP1697985B1 Combinations of resin compositions and methods of use thereof |
| 04/04/2007 | EP1670860B1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 04/04/2007 | CN1942521A Light-diffusing resin composition |
| 04/04/2007 | CN1942518A Compositions for producing universal pigment preparations |
| 04/04/2007 | CN1942515A Low heat release and low smoke reinforcing fiber/epoxy composites |
| 04/04/2007 | CN1941219A Quasi-solid nano-composite gel electrolyte, its production and use |
| 03/29/2007 | WO2005100020A3 Primer-less abrasion coating for organic glass articles |
| 03/29/2007 | US20070073008 Compositions effective to suppress void formation |
| 03/29/2007 | US20070072981 Two component curable compositions |
| 03/29/2007 | US20070072971 Fiber dispersant-containing systems |
| 03/29/2007 | DE102006037185A1 Treating nano-synthetic material, preferably in production of composite material comprising nano-fiber material and matrix, comprises adjusting physical and/or chemical properties of composite material |
| 03/29/2007 | DE102005060348A1 Epoxy resin system, useful in encapsulation or assembly of optoelectronic element, comprises epoxy containing first component comprising epoxy resin and a second component comprising an acid anhydride and acid ester of carboxylic acid |
| 03/28/2007 | EP1766637A1 Structured resin systems with high thermal conductivity fillers |
| 03/28/2007 | EP1765946A1 Radiation curable low gloss powder coating compositions |
| 03/28/2007 | EP1765945A1 Metal packaging coating containing 1,3,5-triazine carbamate crosslinker |
| 03/28/2007 | EP1765929A2 High thermal conductivity materials with grafted surface functional groups |
| 03/28/2007 | EP1765518A2 Method of producing an epoxy composition |
| 03/28/2007 | CN1938380A Thermosetting resin composition and multilayered printed wiring board comprising the same |
| 03/28/2007 | CN1938377A Composition curable by both free-radical photocuring and cationic photocuring |
| 03/28/2007 | CN1938356A Hardenable composition |
| 03/28/2007 | CN1935896A Epoxy vesin complex and its use |
| 03/28/2007 | CN1935895A Modified furfurylidene acetone system epoxy resin grouting material and its preparing method |
| 03/28/2007 | CN1307258C Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
| 03/27/2007 | US7196141 Polymer and epoxy resin compositions |
| 03/27/2007 | US7196124 Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
| 03/27/2007 | US7196123 Polyester block copolymer composition and process for the preparation thereof |
| 03/27/2007 | US7195731 Method for preparing and processing a sample for intensive analysis |
| 03/22/2007 | WO2007032424A1 Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| 03/22/2007 | WO2007032221A1 Process for producing epoxy resin molding material for encapsulation, epoxy resin molding material for encapsulation, and electronic part or device |
| 03/22/2007 | WO2007032217A1 Composite material and optical component using the same |
| 03/22/2007 | US20070066721 Heat-curable compositions comprising low-temperature impact strength modifiers |
| 03/22/2007 | US20070066699 photocurable polyisobutene or polyoxypropylene glycol endcapped with epoxy group-containing silicon compound or copolymerized with polysiloxanes; excellent curability by irradiation of a light energy source within a short time, no need moisture and heating; as adhesive, sealant; storage stability |
| 03/22/2007 | US20070065669 Curable alkanolamine-containing epoxy powder coating composition |
| 03/22/2007 | DE102006016400A1 Base material for making printed circuit boards, produced by pressing layers of glass fabric vacuum-impregnated with solvent-free epoxy resin, has defined properties |
| 03/21/2007 | EP1763559A1 Highly concentrated, aqueous oligoester and polyester formulations |
| 03/21/2007 | EP1668086B1 Low-cure powder coatings and methods for using the same |
| 03/21/2007 | EP0981661B1 Nonaqueous sizing for glass and carbon fibers |
| 03/21/2007 | CN1934190A Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 03/21/2007 | CN1934157A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 03/21/2007 | CN1934156A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 03/21/2007 | CN1305960C Optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| 03/20/2007 | US7193016 Curable adhesives; improved performance; packaging |
| 03/20/2007 | US7192997 Encapsulant composition and electronic package utilizing same |
| 03/20/2007 | US7192638 coating composition with which a layer mainly comprising a fluororesin and having a thickness comparable to that attainable by the two-coat technique can be formed by one-coat technique |
| 03/15/2007 | WO2007029657A1 Resin composition and hybrid integrated circuit board making use of the same |
| 03/15/2007 | WO2007029504A1 Epoxy resin composition and die bonding material comprising the composition |
| 03/15/2007 | WO2006107638A3 Non-degradable low swelling, water soluble radiopaque hydrogels |
| 03/15/2007 | US20070060720 Epoxy resin composition |
| 03/15/2007 | US20070060719 Polyamide and/or polyester matrix thermoplastic compositions and articles shaped therefrom |
| 03/15/2007 | US20070060675 Inkjet printhead having conductive epoxy resin |
| 03/15/2007 | US20070060673 Resin compositions, prepregs and laminates |
| 03/15/2007 | DE112005000364T5 Leitfähiger Klebstoff Conductive adhesive |
| 03/15/2007 | CA2621131A1 Resin composition and hybrid integrated circuit board making use of the same |
| 03/14/2007 | EP1762581A1 Curable resin composition, lining material and tube-shaped lining material |
| 03/14/2007 | EP1761603A1 Crystalline resin sandwich films |
| 03/14/2007 | EP1761581A1 Curing agents for epoxy resins |
| 03/14/2007 | EP1470175B1 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 03/14/2007 | CN1930226A Modifier for resin and resin composition using the same and formed article |
| 03/14/2007 | CN1930219A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same |
| 03/14/2007 | CN1930206A Epoxy adhesive composition |
| 03/14/2007 | CN1927984A Iron concentrate powder dustproof agent and preparation method thereof |
| 03/14/2007 | CN1927937A Nona modified fiber reinforcement high-performance polymer concrete well cover |
| 03/14/2007 | CN1927444A Ureaformaldehyde resin bilaminar membrane coating epoxy resin microcapsule and preparing method thereof |
| 03/14/2007 | CN1927443A Ureaformaldehyde resin coating epoxy microcapsule for material self-repair and preparing method thereof |
| 03/14/2007 | CN1304505C Powder coating compositions |
| 03/14/2007 | CN1304460C Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts |
| 03/13/2007 | US7189770 Using amine , ketone, ketimine and water curing agents for polyurethanes |
| 03/13/2007 | US7189444 Cladding resin composition |
| 03/13/2007 | US7189307 Fibrous sheet such as paper towel with topically applied crosslinked binder of an epoxy-functional polymer such as an epichlorohydrin-methyldiallylamine copolymer and a carboxylated ethylene-vinyl acetate copolymer; improved strength; formaldehyde-free curing |
| 03/13/2007 | CA2347426C Bismuth oxide catalyst for cathodic electrocoating compositions |
| 03/13/2007 | CA2211628C Liquid, radiation-curable composition, especially for stereolithography |
| 03/08/2007 | US20070055039 Latent curing agent and composition |
| 03/08/2007 | US20070055008 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 03/08/2007 | US20070054976 coated abrasive particles comprising a curable thicker layer of UV-polymerizable epoxyacrylate and lightweight aluminum trihydrate filler with particle size from 1 to 10 micrometers; transparent to ultraviolet light |
| 03/08/2007 | US20070054218 Radiation curable resin composition for making colored three dimensional objects |
| 03/08/2007 | US20070054128 Multi-component epoxy-amine primer systems comprising a polythioether |
| 03/08/2007 | DE112004002845T5 Kautschuk mit endständigem Maleinimid und härtbare Zusammensetzungen, hergestellt unter Verwendung des Kautschuks mit endständigem Maleinimid Rubber having a terminal maleimide and curable compositions prepared using the rubber having a terminal maleimide |
| 03/08/2007 | DE102005042097A1 Flame-resistant epoxy resin is structured by a condensation at the oxiran rings to form phosphor-carbon compounds |
| 03/07/2007 | EP1760133A1 Adhesive agent composition and adhesive film for electronic component |