| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/10/2007 | US20070104937 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
| 05/09/2007 | EP1782062A2 Epoxy enhanced polymer membrane to increase durability of biosensors |
| 05/09/2007 | EP1598398B1 Curable composition |
| 05/09/2007 | EP1278912B1 Hydroxy-phenoxyether polymers in papermaking |
| 05/09/2007 | CN1961261A Radiation-sensitive composition, laminate, process for producing the sane and electronic part |
| 05/09/2007 | CN1960997A Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/09/2007 | CN1959859A Polymer-ceramic dielectric composition, embedded capacitor and printed circuit board |
| 05/09/2007 | CN1958721A Ionic bond jointed phosphor ¿C nitrogen type flame retardant, and preparation method |
| 05/09/2007 | CN1958709A Cementation type polysulfide sealant |
| 05/09/2007 | CN1958706A Plastic package material of AC permanent magnet submersible motor, plastic package technique and application |
| 05/09/2007 | CN1958676A Modification type clay, composite material of novolac epoxy resin of containing the clay, and predation method |
| 05/09/2007 | CN1958666A Difficult combustible epoxy resin composition not containing halogen |
| 05/09/2007 | CN1958665A Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 05/09/2007 | CN1958664A 液状环氧树脂组合物 A liquid epoxy resin composition |
| 05/09/2007 | CN1958663A 液状环氧树脂组成物 A liquid epoxy resin composition |
| 05/09/2007 | CN1958639A Solidifying agent for aqueous epoxy resin, and preparation method |
| 05/09/2007 | CN1315145C Sealing structure of ends and sealing material therefor |
| 05/09/2007 | CN1314752C 环氧树脂组合物 The epoxy resin composition |
| 05/09/2007 | CN1314726C Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound, copper foil coated with resin and copper-coating layer-pressing |
| 05/08/2007 | US7213739 Underfill fluxing curative |
| 05/08/2007 | CA2203267C Visible-light curable epoxy system with enhanced depth of cure |
| 05/03/2007 | WO2007050611A1 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 05/03/2007 | WO2007049491A1 Resin composition, resin film, cover lay film, interlayer adhesive, metal clad laminate and multilayer printed circuit board |
| 05/03/2007 | WO2007049385A1 Thermosetting composition for organic el device sealing |
| 05/03/2007 | US20070100114 Accelerator systems for low-temperature curing |
| 05/03/2007 | US20070100092 High optical-performance resin compound |
| 05/03/2007 | US20070100074 Aqueous emulsion polymers comprising one or more first polymers of one or more non-ionic ethylenically unsaturated monomers and one or more second polymers of one or more epoxy group containing ethylenically unsaturated monomers; non-toxic, odor free storage stable coatings; toughness, hardness |
| 05/03/2007 | US20070100071 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 05/03/2007 | US20070098995 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device |
| 05/03/2007 | US20070097314 Process for the fabrication of optical microstructures |
| 05/03/2007 | DE19905800B4 Haft- und Strukturklebstoff und dessen Verwendung Adhesion and structural adhesive and its use |
| 05/03/2007 | DE112004002666T5 Gelatorstabilisierte kristalline Harze Gelatorstabilisierte crystalline resins |
| 05/02/2007 | EP1780587A1 Liquid crystal sealant and liquid crystal display cell utilizing the same |
| 05/02/2007 | EP1780239A1 Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| 05/02/2007 | EP1780231A1 Powder coatings or adhesives employing silanes or silane treated filters |
| 05/02/2007 | EP1678246B1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency |
| 05/02/2007 | EP1485252A4 Epoxy adhesive having improved impact resistance |
| 05/02/2007 | CN2896477Y Anti-interference capacitance resistance assembly |
| 05/02/2007 | CN1957013A Resin composition for encapsulating semiconductor and semiconductor device |
| 05/02/2007 | CN1957011A Radiation curable liquid resin composition for optical three-dimensional molding and optical molded article obtained by photocuring same |
| 05/02/2007 | CN1955219A Epoxy composite of semi-solidified sheet and its use |
| 05/02/2007 | CN1955147A Sulphur compound coated type slow-released fertilizer |
| 05/01/2007 | US7211303 Alignment film and LCD made of the same |
| 05/01/2007 | CA2333896C Composition for bulkhead of thin display panel |
| 04/26/2007 | WO2007047428A1 Coating compositions and methods |
| 04/26/2007 | WO2007047384A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 04/26/2007 | WO2007046405A1 Thermosetting resin composition and use thereof |
| 04/26/2007 | WO2007045575A1 Lubricant for enameled wires |
| 04/26/2007 | US20070093620 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 04/26/2007 | US20070093614 Epoxy resin composition |
| 04/26/2007 | US20070093583 Polytrimethylene terephthalate reinforced resin composition |
| 04/26/2007 | US20070092733 Concurrently curable hybrid adhesive composition |
| 04/26/2007 | CA2625136A1 Coating compositions and methods |
| 04/25/2007 | EP1620484B1 Method for production of prepolymers made from polysulphides and polyepoxides |
| 04/25/2007 | EP1323761B1 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/25/2007 | CN1954411A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 04/25/2007 | CN1954024A Self-adhesive prepreg |
| 04/25/2007 | CN1954010A 液态环氧树脂组合物 Liquid epoxy resin composition |
| 04/25/2007 | CN1952012A Thermosetting epoxy asphalt material, preparation method and its dedicated compatibilizer |
| 04/25/2007 | CN1312970C Electric wave absorber and manufacturing method of the same |
| 04/25/2007 | CN1312247C Heat-resistant and impact-resistant acrylic/epoxy adhesive |
| 04/25/2007 | CN1312219C Thermosetting resin composition, epoxy resin moulding material and semiconductor device |
| 04/25/2007 | CN1312210C Resin compsn. and adhering thin film made by same |
| 04/24/2007 | US7208228 a curable epoxy resin, a curing agent and a reactive liquid rubber; prepregs of reinforced fibers for thin walled tubes or rods for sporting equipment; Fishing rods, arrows, golf shafts or hockey sticks; high compressive modulus and strength, improved toughness, better handling |
| 04/24/2007 | US7208104 Mixture solution for preparing a conductive polymer to produce solid electrolytic capacitors and its method |
| 04/24/2007 | CA2428900C Olefin polymerization catalyst composition and preparation thereof |
| 04/19/2007 | WO2007044312A1 Poly(arylene ether) composition, method, and article |
| 04/19/2007 | US20070088138 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 04/19/2007 | US20070088136 a toughening agent and a flame retarding agent; high heat-resistance and excellent adhesion; adhesive agent in flexible printed circuit board; does not emit toxic gases so environmentally friendly |
| 04/19/2007 | US20070088102 Coating compositions and methods |
| 04/19/2007 | US20070087202 Composite material |
| 04/19/2007 | US20070087201 Self-bonding coating composition |
| 04/19/2007 | DE102006048637A1 Liquid crystalline resin composition for blow molding is obtained by melt-kneading of melt-processable aromatic polyester and polyester amide; styrene based copolymer; and fibrous filler, powdery/granular filler and plate-like filler |
| 04/19/2007 | DE102006013724B3 Polymer mass, useful to prepare molded article, films, fibers or shaped parts, comprises a polymer e.g. polyolefin and additive from phosphorus oxy compound |
| 04/19/2007 | DE102005048954A1 Herstellung und Verwendung von Polycarbonaten mit speziellen gereinigten, oligomeren Epoxydharzen Preparation and use of polycarbonates with specific purified, oligomeric epoxy resins |
| 04/18/2007 | EP1775639A1 Emulsion comprising an epoxy resin, a sulfonated polyester and a nonionic surfactant. |
| 04/18/2007 | EP1775321A1 Flame-retardant epoxy resin composition |
| 04/18/2007 | EP1456321B1 Multi-phase structural adhesives |
| 04/18/2007 | CN1950935A Resin paste for wafer bonding |
| 04/18/2007 | CN1950469A Radiation curable low gloss powder coating compositions |
| 04/18/2007 | CN1950453A Polycarboxy-functionalized prepolymers |
| 04/18/2007 | CN1950447A Resin composition for sealing and semiconductor device sealed with resin |
| 04/18/2007 | CN1950419A Cationically photopolymerizable composition |
| 04/18/2007 | CN1948392A Epoxy resin composition |
| 04/18/2007 | CN1948391A Emulsion comprising an epoxy resin |
| 04/18/2007 | CN1311035C Coating composition for protecting dazzling effect |
| 04/18/2007 | CN1310988C Resin composition and optical elements |
| 04/17/2007 | US7205353 for coating ferrous or non-ferrous metal substrates without chemical pre-treatment; rapid curing, chromate free, corrosion resistant |
| 04/17/2007 | CA2113788C Method and resin composition for molding an optical connector ferrule |
| 04/12/2007 | WO2007040107A1 Resin composition for optical semiconductor device encapsulation and optical semiconductor device produced by using same |
| 04/12/2007 | WO2005062801A3 Epoxy adhesive composition method of preparing using |
| 04/12/2007 | US20070083017 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 04/12/2007 | US20070082203 100% non-volatile, one-part liquid underfill encapsulant; integrated circuit wafers; converted to liquefiable, tack-free solid by radiation; outstanding shelf life; photocurable ethylenically vinyl or acrylic monomers having at least 6 carbon atoms; polyfunctional epoxy resin; photoinitiator |
| 04/11/2007 | EP1772498A2 Ink composition, and imageforming method and recorded material using the same |
| 04/11/2007 | CN1946795A Dual-stage wafer applied underfills |
| 04/11/2007 | CN1946780A Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment |
| 04/11/2007 | CN1946528A Heat-curable molding material pellet having multilayer structure |
| 04/11/2007 | CN1944552A Coloring agent for electrochemical aluminum paint and its preparing method |
| 04/11/2007 | CN1944528A Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing same |
| 04/11/2007 | CN1944527A Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing same |