| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/13/2007 | CN1978525A Epoxy/layersilicate hano composite material, and its preparing method |
| 06/13/2007 | CN1321153C Conductive elastomer composition, conductive member using conductive elastomer composition, image-forming apparatus having conductive member |
| 06/13/2007 | CN1321148C Fiber reinforcement composite material used for car shrouding parts and back holding door produced therefrom |
| 06/13/2007 | CN1321144C Low-cure powder coatings and methods for using the same |
| 06/12/2007 | US7230055 for use as an adhesive or as an underfill encapsulant; have sufficiently high curing temperatures to be suitable for use when lead free interconnect material is used |
| 06/12/2007 | US7230052 Epoxy resin composition and fiber reinforced composite material using epoxy resin composition |
| 06/12/2007 | US7229529 Low odor binders curable at room temperature |
| 06/12/2007 | CA2170067C Solventless resin composition having minimal reactivity at room temperature |
| 06/07/2007 | WO2007064801A1 Curable compositions |
| 06/07/2007 | WO2007064366A1 Expandable sealant for fasteners |
| 06/07/2007 | WO2007063580A1 Halogen-free epoxy resin composition, cover lay film, bonding sheet, prepreg, laminated sheet for printed wiring board |
| 06/07/2007 | US20070129510 Golf ball layer compositions formed from oxirane functional endcapped polymers |
| 06/07/2007 | US20070129509 Curable compositions |
| 06/07/2007 | US20070129466 Resin composition for sealing medical instruments and medical instrument for endoscope |
| 06/07/2007 | CA2631137A1 Expandable sealant for fasteners |
| 06/06/2007 | EP1792961A1 Low-cure powder coatings, related coating method and coated substrates |
| 06/06/2007 | EP1792935A1 Thermosetting resin composition and method of producing the same |
| 06/06/2007 | EP1216266B1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities |
| 06/06/2007 | CN1976961A Thermally curable resin composition with extended storage stability and good adhesive property |
| 06/06/2007 | CN1974658A Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
| 06/06/2007 | CN1974657A Process of modifying epoxy resin with schiff base type liquid crystal epoxy resin |
| 06/06/2007 | CN1974641A Method of decomposing thermoset epoxy resin and its composite material |
| 06/06/2007 | CN1320642C Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls |
| 06/06/2007 | CN1320020C Epoxy resin complex with long chemical storage stability and temperature thixotropy |
| 06/06/2007 | CN1320019C Epoxy resin composition for sealing optical semiconductor |
| 06/05/2007 | US7226981 Curing agent composition for epoxy resin |
| 06/05/2007 | US7226976 Low temperature curing; storage stability; comprises: a radically polymerized polymer of a monomer having at least one polymerizable double bond, which polymer has at least one tertiary amino group; anda polymer having at least one hydroxyl group and at least one urethane and/or urea bond |
| 06/05/2007 | US7226956 Melting a high density polyethylene, an alkenyl aromatic polymer and a linear low density polyethylene, adding a nucleating agent ;dissolving an effective amount of blowing agent; transferring the mixture to an expansion zone; andpermitting the mixture to expand |
| 05/31/2007 | WO2007061080A1 Curable composition |
| 05/31/2007 | WO2007061037A1 Liquid resin composition for electronic component and electronic component device |
| 05/31/2007 | WO2007060778A1 n-PROPYL BROMIDE COMPOSITION |
| 05/31/2007 | US20070123684 Epoxy compound, preparation method thereof, and use thereof |
| 05/31/2007 | US20070123649 Chlorine free and reduced chlorine content polymer and resin compositions for adhesion to plastics |
| 05/31/2007 | US20070122731 Binder resin for the toner, method for producing the same, and toner for electrophotography using the resin |
| 05/31/2007 | US20070122628 Expandable sealant for fasteners |
| 05/31/2007 | US20070120290 Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method |
| 05/31/2007 | US20070119745 Curable; for fixing fibres, scrims, fabrics or composites, for reinforcing buildings, for example walls or ceilings or floors; or for fixing building components, such as panels or blocks made of stone, glass or plastics; after curing, large tolerance range for temperatures; high bond stress value |
| 05/31/2007 | DE102006055919A1 Isoliermaterial Insulation |
| 05/30/2007 | EP1303568B1 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 05/30/2007 | CN1972998A Epoxy resin molding material for encapsulation and electronic device |
| 05/30/2007 | CN1970627A Cyanate resin/ carbon fiber composite material and its preparing process |
| 05/30/2007 | CN1970623A 液状环氧树脂组成物 A liquid epoxy resin composition |
| 05/30/2007 | CN1970622A Epoxide resin and coal ash synthetic material and its preparation process |
| 05/30/2007 | CN1970154A Filling of cone crusher and its preparation method |
| 05/30/2007 | CN1318790C High-pressure glass fibre reinforced plastic pipe and producing technology thereof |
| 05/30/2007 | CN1318528C Varnish containing polyamide resin and use thereof |
| 05/30/2007 | CN1318490C Solidifying promoter, epoxy resin composition and semiconductor device |
| 05/30/2007 | CN1318474C Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| 05/30/2007 | CN1318466C Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 05/29/2007 | US7223821 silyl group-denatured urethane prepolymer having an isocyanate group and an alkoxysilyl group in one molecule with curing agent |
| 05/29/2007 | US7223820 Amine hardener for epoxy resins |
| 05/24/2007 | WO2007058261A1 Sealing epoxy resin forming material and electronic component device |
| 05/24/2007 | WO2007057311A1 Flame retardant prepregs and laminates for printed circuit boards |
| 05/24/2007 | WO2007002711A3 Composition, treated backing, and abrasive articles containing the same |
| 05/24/2007 | WO2006127023A3 Epoxy enhanced polymer membrane to increase durability of biosensors |
| 05/24/2007 | US20070117938 Polyether epoxides of glycidyl esters and polyols (having a functionality of at least 2) reacted with hydroxy- and acid-containing acrylic polymers and cured by a diisocyanate; high solids coating compositions having low VOC's in addition to being of high molecular weight and tack-free; films |
| 05/24/2007 | US20070116962 Flip-chip type semiconductor is encapsulated by a cured product of a liquid epoxy resin composition comprising a liquid epoxy resin, an amine type curing agent, sulfur-containing phenol compound, an inorganic filler; easy to handle and allows simplification of semiconductor device production process |
| 05/24/2007 | US20070116961 Anisotropic conductive adhesive compositions |
| 05/24/2007 | US20070116960 Aviation coating compositions and the use thereof |
| 05/24/2007 | US20070116938 Polymer composite formed article, printed wiring board using the formed article, and methods of producing them |
| 05/23/2007 | EP1786872A1 Powder coating compositions |
| 05/23/2007 | EP1786849A1 Polyaminoamide-monoepoxy adducts |
| 05/23/2007 | EP1697460A4 Method and system for making high performance epoxies, and high performance epoxies obtained therewith |
| 05/23/2007 | EP1539833B1 Reactive and gel-free compositions for making hybrid composites |
| 05/23/2007 | CN1966583A Glass fiber/wheatstraw fiber jet product and preparation method thereof |
| 05/23/2007 | CN1966573A Halogen-free resin composition and its uses in adhesive sheet and copper-cladded plate |
| 05/23/2007 | CN1966572A Resin composition and its uses in adhesive sheet and copper-cladded plate |
| 05/23/2007 | CN1966571A Preparation method of epoxy resin base micron to nano grade pore gelatin |
| 05/23/2007 | CN1317519C Photocurable form-in-place gasket for electronic applications |
| 05/23/2007 | CN1317353C Liquid crystal display sealing material using plastic substrate |
| 05/23/2007 | CN1317329C Resin composition, prepreg and laminate using the composition |
| 05/22/2007 | US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles |
| 05/22/2007 | US7220490 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 05/22/2007 | US7220484 comprising a nano-reinforcing material, a polymer matrix, and an epoxy-functionalized graft polymer compatible with the polymer matrix; barrier films, barrier foams, or other molded or extruded thermoplastic articles |
| 05/17/2007 | US20070112145 Storage stability; polyoxyalkylene glycol containing active silicon groups and alkyl acrylate copolymer; bonding strength |
| 05/17/2007 | US20070112144 Method for decreasing gloss in molded article |
| 05/17/2007 | US20070112101 Dispersant for dispersing nanoparticles in an epoxy resin, method for dispersing nanoparticles using the same, and nanoparticle-containing thin film comprising the same |
| 05/17/2007 | US20070112100 Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 05/17/2007 | US20070111010 Flame retardant prepregs and laminates for printed circuit boards |
| 05/17/2007 | US20070110656 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
| 05/16/2007 | EP1524301B1 Transparent composite composition |
| 05/16/2007 | CN1962802A Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 05/16/2007 | CN1962757A Epoxy mould material for ceramic forming and its preparation method |
| 05/16/2007 | CN1962756A Nano attapulgite clay composition for modified engineered plastic |
| 05/16/2007 | CN1962755A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 05/16/2007 | CN1962754A Thermosetting resin composition and method of producing the same |
| 05/16/2007 | CN1962753A Phosphorous epoxy resin composition |
| 05/16/2007 | CN1962752A Epoxy plastic packaging material and its preparation method |
| 05/16/2007 | CN1962570A Improved sulfur envelope type slow release fertilizer |
| 05/16/2007 | CN1315950C Transparent composite composition |
| 05/16/2007 | CN1315905C Epoxy resin composition and semiconductor device |
| 05/15/2007 | US7217771 Epoxy resin |
| 05/15/2007 | US7216592 Blends unsaturated acyclic hydrocarbons, thermosetting resin, flameproofing and curing agents used to form interpenetrating polymer network or films for vessels; materials handling |
| 05/10/2007 | US20070106036 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 05/10/2007 | US20070106001 Molding compounds for use in induction heating applications and heating elements molded from these compounds |
| 05/10/2007 | US20070105983 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 05/10/2007 | US20070104966 Metal-cured polyethylene-metal laminate |
| 05/10/2007 | US20070104960 Liquid epoxy resin composition |
| 05/10/2007 | US20070104959 Liquid epoxy resin composition |
| 05/10/2007 | US20070104958 Epoxy based reinforcing patches with encapsulated physical blowing agents |