| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/07/2008 | US7431990 Epoxyphenylphenolic resin, phenolic resin, inorganic filler, curing accelerator, silane coupling agent, and compound containing naphthalene ring in which at least two adjacent carbon atoms are coupled to hydroxyl groups; flowability, moldability, crack resistance during soldering, flame retardance |
| 10/07/2008 | US7431799 Epichlorohydrin-based polymers containing primary amino groups used as additives in papermaking |
| 10/02/2008 | WO2008118634A2 Amine-arresting additives for materials used in photolithographic processes |
| 10/02/2008 | WO2008117839A1 Novel polyvalent hydroxy compound, method for producing the same, epoxy resin using the compound, and epoxy resin composition and cured product thereof |
| 10/02/2008 | WO2008117619A1 Photosensitive insulating resin composition |
| 10/02/2008 | WO2008117522A1 Semiconductor sealing resin composition and semiconductor device using the resin composition |
| 10/02/2008 | US20080242058 Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device |
| 10/02/2008 | US20080241995 Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet |
| 10/02/2008 | US20080237897 Semiconductor die molded from a bis(epoxyalkyl) derivative of an aromatic initiator, e.g., 1,4-cyclohexylene bis(p-glycidyloxy)benzoate of or 4,4'-bis(4-(glycidyloxy)butoxyphenyl)stilbene; melting point of less than 140 degrees C.; are liquid crystalline at greater than 150 degrees C. |
| 10/02/2008 | US20080237617 Adhesive Sheet for Light-Emitting Diode Device and Light-Emitting Diode Device |
| 10/01/2008 | EP1973959A1 Curing agents for epoxy-functional compounds |
| 10/01/2008 | EP1907436B1 Epoxy resin composition |
| 10/01/2008 | CN101277994A Rubber-modified polyamide resin, epoxy resin composition, and cured object obtained therefrom |
| 10/01/2008 | CN101277992A Epoxy resin composition and semiconductor device |
| 10/01/2008 | CN101277991A Resin composition for optical three-dimensional molded object |
| 10/01/2008 | CN100422235C Electric insulated resin pulp used for chip carrying and packaging |
| 10/01/2008 | CN100422234C Autodepositing anionic epoxy resin water dispersion |
| 09/30/2008 | US7429622 Radiation curable ink containing at least two photo-polymerization compounds, one of which is an oxetane compound having a specific formula, and the other is an epoxy compound, having an oxirane ring in the molecule; low viscosity and high sensitivity |
| 09/30/2008 | CA2380387C Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 09/25/2008 | WO2008114858A1 Resin composition for forming insulating layer of printed wiring board |
| 09/25/2008 | WO2008114766A1 Novel polyvalent hydroxy compound, method for producing the compound, epoxy resin and epoxy resin composition each using the compound, and cured product of the composition |
| 09/25/2008 | US20080234409 Sealant Epoxy-Resin Molding Material, and Electronic Component Device |
| 09/25/2008 | US20080233823 storage stability; fabrics, unidirectional tapes |
| 09/25/2008 | US20080233386 molding containing epoxy resins, hardening agent consisting of phenolated compound, and layered silicate, excels in dielectric characteristics and dimensional stability at high temperature |
| 09/24/2008 | EP1972648A1 Aromatic ether polymer, method for producing same and polymer composition |
| 09/24/2008 | EP1971627A1 Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same |
| 09/24/2008 | EP1702938B1 Curable silicone composition and its use as adhesive |
| 09/24/2008 | CN101273089A Resin composition for sealing optical semiconductor element and optical semiconductor device obtained by using the same |
| 09/24/2008 | CN101273076A Process for producing latent catalyst and epoxy resin composition |
| 09/24/2008 | CN100421012C Directional film and liquid crystal display device using the same directional film |
| 09/23/2008 | US7427652 allows for reduced amounts of phosphonate as compared to a composition not containing the filler; optional polybenzoxazine resin, and an optional co-curing agent |
| 09/18/2008 | WO2008112636A1 Chain extenders |
| 09/18/2008 | WO2008111640A1 Oxethane resin composition |
| 09/18/2008 | WO2008111283A1 Photocurable resin composition |
| 09/18/2008 | WO2008110479A1 Aqueous epoxy resin compositions |
| 09/18/2008 | US20080227950 Latent Epoxy Hardeners Based on Amines Blocked by Acyl-Ethyleneurea, Epoxy Composition Containing the Same and Method of Preparation Thereof |
| 09/18/2008 | US20080226245 Curable Resin Composition for Light Guide Formation, Curable Dry Film for Light Guide Formation, Cured Resin and Light Guide |
| 09/18/2008 | CA2679711A1 High functionality amine compounds and uses therefor |
| 09/17/2008 | EP1970389A1 Phenol resin composition, cured product thereof, resin composition for copper clad laminate, copper clad laminate and novel phenol resin |
| 09/17/2008 | EP1802677B1 Epoxy resins with improved elasticity |
| 09/17/2008 | EP1375591B1 Method for producing a fiber reinforced product with an epoxy-based matrix |
| 09/17/2008 | EP1144190B2 Manufacture of void-free laminates and use thereof |
| 09/17/2008 | CN101268559A Light-emitting device, method for manufacturing same, molded body and sealing member |
| 09/17/2008 | CN101268418A Photosensitive resin composition and cured object obtained therefrom |
| 09/17/2008 | CN101265321A Method for preparing branching type water-based epoxy curing agent |
| 09/17/2008 | CN101265320A Method for preparing low content of organic chlorine epoxy resin |
| 09/17/2008 | CN100419478C Optical waveguide and production method thereof |
| 09/17/2008 | CN100419036C Water-resistant adhesive composition for wood |
| 09/17/2008 | CN100418996C Composition, treated backing, and coated abrasive articles containing the same |
| 09/17/2008 | CN100418995C Modified epoxy resin, process for production thereof, photosensitive resin compositions and photosensitive elements |
| 09/16/2008 | US7425598 Adhesive of epoxy resin and curing agent with xylylene diamine structure |
| 09/16/2008 | US7425347 Composition for forming anti-reflective coating for use in lithography |
| 09/12/2008 | WO2008108485A1 Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
| 09/12/2008 | WO2008108359A1 Solder resist, dry film thereof, cured product and printed wiring board |
| 09/12/2008 | WO2008108315A1 Resin composition for heat-resistant substrate, prepreg, and heat-resistant substrate |
| 09/12/2008 | WO2008108313A1 Resin composition for composite laminate and composite laminate |
| 09/12/2008 | WO2008071363A3 Hybrid cationic curable coatings |
| 09/12/2008 | WO2007149501A3 Process for preparing dendritic polymers using microwave assisted synthesis |
| 09/10/2008 | EP1967540A1 Curable composition |
| 09/10/2008 | EP1967539A1 Curable composition in combination with thermal radical curing/thermal latent curable epoxy |
| 09/10/2008 | EP1966306A1 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 09/10/2008 | EP1966269A1 A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom |
| 09/10/2008 | EP1966268A1 A curable epoxy resin composition and laminates made therefrom |
| 09/10/2008 | EP1966267A1 Solid thermally expansible material |
| 09/10/2008 | EP1745105A4 Polyetheralkanolamine dispersants |
| 09/10/2008 | EP1745104A4 Comb-like polyetheralkanolamines in inks |
| 09/10/2008 | CN101260185A Low-temperature incubation type epoxide resin curing agent and preparing method thereof |
| 09/10/2008 | CN101260184A Technique for synthesizing vinyl ester resin and application thereof in power plant smoke desulfurization by wet method |
| 09/10/2008 | CN101260183A Non-ionic self-emulsification solid epoxy resin and preparation method for emulsion thereof |
| 09/10/2008 | CN100417657C Basic silane coupting ageut0organic carboxylic acid salt composition, process for preparing said composition and epoxy resin compositions containing same |
| 09/09/2008 | US7423097 Glycidyloxy groups-containing polybutadiene, mono-oxetane compound and cationic photoinitiator |
| 09/09/2008 | US7423093 E.g., Resydrol" alkyd resin and a binder obtained by polymerizing one or more unsaturated monomers in the presence of a polyurethane resin to form a graft polymer; basecoat-clearcoat systems for automotive paints; prevents change in shade of paints on storage and/or shearing exposure |
| 09/09/2008 | US7423083 Encapsulated semiconductor, diodes; crosslinked resin |
| 09/09/2008 | CA2278257C Aliphatic hydrocarbon group-containing resin composition for cationic electrocoating and cationic electrocoating composition |
| 09/04/2008 | WO2008105563A1 Flame-retardant adhesive resin composition and flexible printed board material using the same |
| 09/04/2008 | WO2008105200A1 Flame retardant adhesive composition, flexible copper-clad laminates and cover lay films |
| 09/04/2008 | US20080214840 Reworkable thermosetting resin composition |
| 09/04/2008 | US20080214779 Alkoxylated amine monomers; poly (5) oxyethylene isotridecyloxypropylamine or poly (2) oxyethylene isotridecyloxypropylamine reacted with diphenylmethane 4,4'-diisocyanate; polyureaurethane copolymers; water vapor permeable, water resistant film; for altering hydrophilic lipophilic balance of polymeric |
| 09/04/2008 | US20080213490 Hot melt impregnation of low viscosity resin and thixotropic agent throughout without intermediate partial cure; flexibility |
| 09/03/2008 | EP1964869A1 Thermosetting resin composition |
| 09/03/2008 | EP1963444A1 Fluorinated surfactants |
| 09/03/2008 | CN101258178A Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them |
| 09/03/2008 | CN101257973A Cure catalyst, composition, electronic device and associated method |
| 09/03/2008 | CN101255225A Method for preparing high alpha-order dihydroxy diphenol A type epoxy resins |
| 08/28/2008 | WO2008102853A1 Epoxy resin composition, prepreg, laminates and printed wiring boards |
| 08/28/2008 | WO2008102431A1 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition |
| 08/28/2008 | US20080207780 Hydroxy polyesters and uses as biodegradable demulsifiers |
| 08/28/2008 | US20080206502 Flexible barrier membranes employing poly (hydroxy amino ethers) |
| 08/28/2008 | US20080206478 Ink Jet Ink |
| 08/28/2008 | DE10297737B4 Neues Schwefel enthaltendes phenolisches Harz, Verfahren zur Herstellung desselben, Phenolderivate mit Disulfidstruktur, Verfahren zur Herstellung desselben und Epoxyharz-Zusammensetzung und Kleber New sulfur-containing phenolic resin, process for producing the same, the same phenol derivatives having disulfide structure, methods of making and epoxy resin composition and adhesive |
| 08/27/2008 | EP1838750B1 Coating system |
| 08/27/2008 | CN101253454A Photosensitive composition for volume hologram recording |
| 08/27/2008 | CN101250373A Coating composition |
| 08/27/2008 | CN100413925C Curable silicone composition and its cured product |
| 08/26/2008 | US7417111 Liquid crystalline epoxy resins |
| 08/21/2008 | WO2008077932A3 Hydroxy ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 08/21/2008 | WO2008077932A2 Hydroxy ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 08/21/2008 | US20080200617 Halogen-Free Flameproof Epoxy Resin Formulations |
| 08/21/2008 | US20080200580 Base Multiplying Agents and Base-Reactive Curable Compositions |
| 08/21/2008 | US20080200084 Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |