| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/05/2008 | CN100430427C Electronic material composition, electronic product and method of using electronic material composition |
| 11/05/2008 | CN100430426C Thermoplastic elastomer composition and molded article |
| 11/05/2008 | CN100430400C Cyclic-aliphatic epoxy compound containing pheneylethylene cinnamyl or maleimide functional group |
| 11/04/2008 | US7446137 Thermosetting resin and thiocyanato-containing organohydrocarbonoxysilane |
| 11/04/2008 | US7445334 Lenses |
| 11/04/2008 | CA2328819C Iodonium salts as latent acid donors |
| 10/30/2008 | WO2008130484A1 Composite material with blend of thermoplastic particles |
| 10/30/2008 | WO2008130028A1 Epoxy composition |
| 10/30/2008 | WO2008129986A1 Colored resin composition, color filter, liquid crystal display device, and organic el display |
| 10/30/2008 | US20080269428 Epoxy resin curing agents: imidazole ring-containing product of reacting a polyalkylenepolyamine and a fatty monocarboxylic acid additionally reacted with a monofunctional, aromatic epoxide; mouldings and sheetlike structures; adhesives and sealants; |
| 10/30/2008 | US20080269427 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 10/30/2008 | US20080269420 Shape Memory Epoxy Copolymer |
| 10/30/2008 | US20080269394 Thermally Disappearing Resin Particle |
| 10/30/2008 | US20080268255 Adhesive composition and a method of using the same |
| 10/30/2008 | CA2682549A1 Composite material with blend of thermoplastic particles |
| 10/29/2008 | EP1985617A1 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 10/29/2008 | EP1985616A1 Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
| 10/29/2008 | EP1984678A2 Air humidifier and evaporation mat contained therein |
| 10/29/2008 | EP1984106A1 Universal wetting agents and dispersants based on isocyanate monoadducts |
| 10/29/2008 | EP1907486B1 Film-forming compositions derived from acyclic carbonates and polyamines |
| 10/29/2008 | EP1840166B1 Curable composition |
| 10/29/2008 | CN101293951A Method for preparing polymer type michler's ketone photoinitiator |
| 10/29/2008 | CN100429257C Composite resin particles |
| 10/28/2008 | US7442729 Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt |
| 10/28/2008 | US7442434 Epoxy resin composition |
| 10/28/2008 | CA2183695C Improved polyether-containing double metal cyanide catalysts |
| 10/23/2008 | WO2008127744A2 Film-forming material containing phosphorous and methods of producing coating compositions containing phosphorous |
| 10/23/2008 | WO2008127556A1 Pre-impregnated composite materials with improved performance |
| 10/23/2008 | WO2008126825A1 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
| 10/23/2008 | WO2008126818A1 Photosensitive resin composition |
| 10/23/2008 | WO2008126680A1 Photosensitive resin composition, process for producing resist pattern, layered product, and device |
| 10/23/2008 | WO2008126499A1 Material for forming polymer optical waveguide, polymer optical waveguide and method of producing polymer optical waveguide |
| 10/23/2008 | WO2008126411A1 Epoxy resin composition, prepreg, laminate, multilayer printed wiring board, semiconductor device, insulating resin sheet, and method for manufacturing multilayer printed wiring board |
| 10/23/2008 | WO2007120759A3 Silicone modified polyurea |
| 10/23/2008 | US20080262188 Shape memory epoxy polymers |
| 10/23/2008 | US20080262135 Reaction product of phosphine and protonated haloaryl compound and use as epoxy curing accelerator |
| 10/23/2008 | US20080257507 Cationic non-crosslinked product from epichlorohydrin with a condensation polymerization product of diethylenetriamine and adipic acid acidified with a mineral acid; paper making |
| 10/23/2008 | US20080257485 Reversible dry adhesives |
| 10/23/2008 | CA2682943A1 Pre-impregnated composite materials with improved performance |
| 10/22/2008 | EP1983014A2 Parquet joint kit system and method for manufacturing a parquet joint kit system |
| 10/22/2008 | EP1983013A1 Epoxy resins with improved elasticity |
| 10/22/2008 | EP1709119B1 Gelator-stabilized crystalline resins |
| 10/22/2008 | CN101292004A Coating compositions and methods |
| 10/22/2008 | CN101291990A Thermosetting resin composition and use thereof |
| 10/22/2008 | CN101291973A 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material |
| 10/22/2008 | CN101291972A Epoxy resin, curable resin composition, and cured product thereof |
| 10/22/2008 | CN101291971A Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom |
| 10/22/2008 | CN100428027C Radiation sensitive resin composition for forming partition, its forming method and liquid crystal display device |
| 10/22/2008 | CN100427981C Curable resin composition for light guide formation, curable dry film for light guide formation, cured resin and light guide |
| 10/22/2008 | CN100427476C Polyepoxy compounds having an amide linkage |
| 10/21/2008 | US7439285 to enable printing of high performance thermosetting compound by ink-jet onto printed circuit boards, without scarifying the requirements from the cured layer; comprises solid latent curing agent characterized by a maximal particle size of less than 2 microns and an epoxy-based resin |
| 10/21/2008 | US7438958 Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same |
| 10/21/2008 | US7438782 Extruding epoxy/elastomer adduct, core/shell polymer impact modifier, blowing agent, thermoplastic polyethers, curing agent; and filler; activating to bond to the first and second surfaces; sealing, baffling, adhering or reinforcing automotive vehicle. |
| 10/21/2008 | CA2335050C Polycationic polymers, their production and use |
| 10/16/2008 | WO2008124797A1 Curatives for epoxy compositions |
| 10/16/2008 | WO2008123490A1 Adamantane derivative, resin composition using the same, and resin cured product |
| 10/16/2008 | WO2008123474A1 Novel thermoplastic polyhydroxy polyether resin and resin composition containing the same |
| 10/16/2008 | WO2008123383A1 Novel epoxy resin, epoxy resin composition containing the same, and cured product of the epoxy resin composition |
| 10/16/2008 | WO2008123238A1 Resin composition |
| 10/16/2008 | WO2008123237A1 Epoxy resin composition |
| 10/16/2008 | WO2008123087A1 Anisotropic conductive paste |
| 10/16/2008 | WO2007126637A3 Process for the preparation of powder coatings on heat-sensitive substrates |
| 10/16/2008 | US20080255315 Epoxy resin cured with phenol-formaldehyde resin |
| 10/16/2008 | US20080255306 Laminates; printed circuits; epoxy resin containing both bisphenol a and tetrabromobisphenol a |
| 10/16/2008 | US20080255271 Polyalkylene polyether polyol modified polyepoxide resin, and a mixture of N-3-aminopropyl ethylenediamine, N,N'-bis(3-aminopropyl) ethylenediamine, and N,N,N'-tris(3-aminopropyl) ethylenediamine; tile grout |
| 10/16/2008 | US20080254300 High heat resistance; low thermal expansion; noncracking ; fireproofing; blend of cyanate resin, epoxy resin, phenoxy resin with imidazole compound and filler; halogen-free |
| 10/16/2008 | US20080251757 Latent Hardener For Epoxy Resin and Epoxy Resin Composition |
| 10/16/2008 | DE102005051611B4 Wärmehärtende Harzzusammensetzung, und Verfahren zur Herstellung eines Prepreg,einer metallbeschichteten, laminierten Platte und einer Platine mit gedruckter Schaltung unter Verwendung derselben A thermosetting resin composition, and process for producing a prepreg, a metal-coated laminated plate and a printed circuit board using the same |
| 10/15/2008 | EP1980580A1 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
| 10/15/2008 | EP1980542A2 Polyalkyleneamine adducts as curing agents for thick layer water-based epoxy systems |
| 10/15/2008 | EP1979392A1 Non-aqueous, liquid coating compositions |
| 10/15/2008 | CN100425650C Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 10/14/2008 | US7435767 Manufacturing sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener |
| 10/14/2008 | US7435451 Applying a topcoat onto the primer coating, prepared from an amine curing agent, toughening agents, fire retardant, a glass fiber thixotrope, a pigment, and an abrasive aggregate; non-skid surface for boat decks etc. |
| 10/09/2008 | WO2008119624A1 Curable epoxy resin composition |
| 10/09/2008 | WO2008075279A3 Biodegradable polymeric derivatives |
| 10/09/2008 | US20080249270 Method for manufacturing monosulfonium salt, cationic polymerization initiator, curable composition, and cured product |
| 10/09/2008 | US20080249220 Encapsulated semiconductor; diodes; crosslinked polymer; photostability; radiation and heat resistance |
| 10/09/2008 | US20080249207 Antislip floor coating; mixture of polycrystalline polymeric material in aqueous solution; cured, hard coating |
| 10/09/2008 | CA2682617A1 Curable epoxy resin composition |
| 10/08/2008 | EP1978058A1 Low odor binders curable at room temperature |
| 10/08/2008 | EP1978050A1 Curing agent for low temperature cure applications |
| 10/08/2008 | EP1978049A1 Curable Epoxy Resin Composition |
| 10/08/2008 | EP1978048A1 Hardener for epoxy resins, method for hardening an epoxy resin and utilisation of the hardener |
| 10/08/2008 | EP1976901A2 Use of polysulfide-containing two-component adhesives for the production of windows |
| 10/08/2008 | EP1976900A1 Epoxy formulations for use in lithography techniques |
| 10/08/2008 | EP1976899A1 Curable composition |
| 10/08/2008 | EP1922135A4 Hindered cyclic polyamines and their salts for acid gas scrubbing process |
| 10/08/2008 | EP1270636B1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
| 10/08/2008 | CN101283018A Method for chemical anchoring |
| 10/08/2008 | CN101283017A High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 10/08/2008 | CN101283016A Thermosetting epoxy resin composition and semiconductor device |
| 10/08/2008 | CN101283009A Phenol polymer, production method thereof and use thereof |
| 10/08/2008 | CN101280056A Method for preparing C21dicarboxylic acid polyamide epoxy hardener from methyl eleostearate |
| 10/08/2008 | CN100424571C Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/08/2008 | CN100424110C Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 10/07/2008 | US7432603 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 10/07/2008 | US7432335 Reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the reaction product with a compound exhibiting good affinity for both; storage stability, additive for sealing resins, paints |
| 10/07/2008 | US7432334 Silicone-modified single-component casting compound |
| 10/07/2008 | US7432333 Powder coating of amino-urea or urethane catalyst and epoxy/hydroxy and/or siloxane resin |