| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/17/2008 | EP0787161B2 Low voc laminating formulations |
| 12/17/2008 | CN101326213A Epoxy resin composition for encapsulation and electronic component device |
| 12/16/2008 | US7466893 Curable resin composition for light guide formation, curable dry film for light guide formation, cured resin and light guide |
| 12/16/2008 | US7465477 Coating with amine curing agent, epoxide-containing toughener, expoxy resin and rubber toughener |
| 12/11/2008 | WO2008150568A2 Hybrid coatings prepared from glycidyl carbamate resins |
| 12/11/2008 | WO2008149837A1 Flame-retardant adhesive resin composition and adhesive film formed from the same |
| 12/11/2008 | US20080306223 Curing Agent for Epoxy Resins and Epoxy Resin Compositions |
| 12/11/2008 | US20080305038 Transport of Nano-and Macromolecular Structures Into Cytoplasm and Nucleus of Cells |
| 12/11/2008 | US20080302558 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board |
| 12/10/2008 | EP1999178A2 Process for the preparation of powder coatings on heat-sensitive substrates |
| 12/10/2008 | EP1999177A1 Radiation-or thermally-curable barrier sealants |
| 12/10/2008 | EP0954553B2 Latent catalysts for epoxy curing systems |
| 12/10/2008 | CN101321800A Phenolic resin, process for production thereof, epoxy resin, and use thereof |
| 12/10/2008 | CN101321799A Liquid resin composition for electronic element and electronic element device |
| 12/10/2008 | CN101321790A Phenol resin composition, cured product thereof, resin composition for copper clad laminate, copper clad laminate and novel phenol resin |
| 12/10/2008 | CN101319042A Low-viscosity cardanol solidifying agent of epoxy resin and preparation method thereof |
| 12/10/2008 | CN101319041A Polyalkyleneamine adducts as curing agents for thick layer water-based epoxy systems |
| 12/10/2008 | CN100441608C Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 12/10/2008 | CN100441607C Method for preparing latent hardener |
| 12/09/2008 | US7462680 Polyester polyols for protective coatings for plastics |
| 12/09/2008 | CA2317524C Conductive organic coatings |
| 12/04/2008 | WO2008147641A1 Isocyanate-epoxy formulations for improved cure control |
| 12/04/2008 | WO2008146847A1 Gate insulating film forming agent for thin-film transistor |
| 12/03/2008 | EP1997843A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 12/03/2008 | EP1997835A1 Polymer and epoxy resin compositions |
| 12/03/2008 | EP1996642A2 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| 12/03/2008 | EP1996641A1 Use of a substituted guanidine compound as a hardener for epoxy resins |
| 12/03/2008 | CN100439446C Surface improver for reinforced composite compositions |
| 12/03/2008 | CN100439428C Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 12/03/2008 | CN100439358C Thioxanthone derivatives, and their use as cationic photoinitiators |
| 12/03/2008 | CN100439312C Polycarboxylic acid mixture |
| 12/02/2008 | US7459504 Reaction product of polyamine and acyclic carbonate |
| 12/02/2008 | US7459151 Phosphate-binding polymers for oral administration |
| 12/02/2008 | CA2356832C Radiation curable water based cationic inks and coatings |
| 12/02/2008 | CA2230604C Compositions containing 1,3,5-triazine carbamates and epoxy compounds |
| 11/27/2008 | WO2008144252A1 Flame retardant composition |
| 11/27/2008 | WO2008143314A1 Liquid epoxy resin, epoxy resin composition, and cured product |
| 11/27/2008 | WO2008143309A1 Novel flame-retardant epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product thereof |
| 11/27/2008 | WO2008143247A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 11/27/2008 | WO2008143085A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained by using the same |
| 11/27/2008 | WO2008143044A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 11/27/2008 | WO2008143003A1 Transparent composite sheet |
| 11/27/2008 | WO2008142931A1 Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition |
| 11/27/2008 | US20080293913 Process to produce polyols |
| 11/27/2008 | US20080293870 Curing Agents for Epoxy Resins |
| 11/27/2008 | US20080289969 Method for making amine-modified epoxy resin and cationic electrodeposition coating composition |
| 11/27/2008 | CA2687286A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 11/26/2008 | EP1995810A1 Fuel cell separator resin composition and fuel cell separator |
| 11/26/2008 | EP1995271A1 Epoxy resin curable composition for prepreg |
| 11/26/2008 | EP1995266A1 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those |
| 11/26/2008 | EP1995264A1 Curable composition for optical material and optical waveguide |
| 11/26/2008 | CN101313007A Cured composition |
| 11/26/2008 | CN101313006A Liquid resin composition for electronic parts and electronic parts device |
| 11/26/2008 | CN101313005A Epoxy resin composition |
| 11/25/2008 | US7456249 Ring-opening polymerization of cyclic ethers, in particular for preparing polytetrahydrofuran or polytetrahydrofuran derivatives over catalyst comprising a clay material which comprises at least 20% by weight of silica and a further oxide of aluminum, iron, and elements of groups III A to VIIA |
| 11/25/2008 | US7456247 Difunctional phenol (e.g. bisphenol A) coupled with a divinyl ethers of a (poly)oxyalkylene glycol optionally capped by epihalohydrin; moisture resistance and water resistance |
| 11/25/2008 | US7456230 Cationically photocurable epoxy resin compositions |
| 11/20/2008 | WO2008140906A1 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof |
| 11/20/2008 | WO2008140008A1 Process for producing tetraglycidylamino compound |
| 11/20/2008 | WO2008139924A1 Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
| 11/20/2008 | WO2008139679A1 Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles |
| 11/20/2008 | WO2003061577A8 Polyalkylene glycol with moiety for conjugating biologically active compound |
| 11/20/2008 | US20080287644 Hardener for epoxy resins, method for hardening an epoxy resin and use of the hardener |
| 11/20/2008 | US20080287566 Epoxy based oil free root canal sealer |
| 11/20/2008 | US20080286578 Prepreg of reinforcing fibers; a diglycidyl ether, an m-triglycidylamine, and a p-tetraglycidylamine; high melting and low melting thermoplastic particles; a thermoplastic toughening agent; and a curing agent; high strength, damage tolerance and interlaminar fracture toughness; aerospace applications |
| 11/19/2008 | EP1992971A1 Optical waveguide made of a polyfunctional oxetane compound having a dicyclopentadiene ring |
| 11/19/2008 | EP1992655A1 Process for producing phenolic resin and process for producing epoxy resin |
| 11/19/2008 | EP1992653A1 Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material |
| 11/19/2008 | EP1991618A1 Thermosetting resin composition and uses thereof |
| 11/19/2008 | EP1765905B1 Flexible, impact resistant primer |
| 11/19/2008 | EP1153941B1 Polymer and epoxy resin compositions |
| 11/19/2008 | CN101309992A Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 11/19/2008 | CN101307183A Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 11/19/2008 | CN101307170A Fire retardant phosphorus-containing epoxy powder composition |
| 11/19/2008 | CN101307132A Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same |
| 11/19/2008 | CN101307131A Synthetic method for water-solubility hydantoin epoxy resins |
| 11/19/2008 | CN100434449C Glyoxal-phenolic condensates with enhanced fluorescence |
| 11/13/2008 | WO2008136484A1 Magnet and method for producing the same |
| 11/13/2008 | WO2008136454A1 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof |
| 11/13/2008 | WO2008136096A1 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate |
| 11/13/2008 | WO2008135246A1 Synthetic resins based on epoxides |
| 11/13/2008 | WO2008071363B1 Hybrid cationic curable coatings |
| 11/13/2008 | US20080280127 Comprising a heat-curable epoxy-containing material, a thermoplastic component and a curing agent for the epoxy-containing material; ethylene-glycidyl (meth)acrylate copolymer; less likely to prematurely cure inside the pellet; enhanced storage stability; easily and uniformly mixed; kneading |
| 11/12/2008 | EP1990379A2 Dipping varnish system |
| 11/12/2008 | CN101305047A Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
| 11/12/2008 | CN101302375A Preparation of high glaze printing ink having vegetable oil and functional resin copolymer |
| 11/12/2008 | CN100432143C Thermoset resin compsns. and its mfg. method |
| 11/12/2008 | CN100432130C Epoxy resin compositions containing phosphorus and its uses |
| 11/12/2008 | CN100432081C Novel hydroxyaryl phosphine oxides,diglycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
| 11/12/2008 | CN100432063C Epoxy compound, preparation method thereof, and use thereof |
| 11/11/2008 | US7449526 Thermoset resin composition of a hydroxy-terminated oligomeric phosphonate of diphenyl methyl-phosphonate and resorcinol and another flame retardant; circuit boards |
| 11/11/2008 | US7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 11/06/2008 | WO2008133228A1 Silicon-containing compound, curable composition and cured product |
| 11/06/2008 | WO2008133054A1 Resin composition, and prepreg |
| 11/06/2008 | US20080274201 Coating microcapsule with a photoinitiator, placingin an aqueous macromer solution, exposing to light radiation, polymerization; forming a microcapsule containing at least one cell; macromers are polymerized using a photoinitiator dye; suspension or interfacial polymerization |
| 11/06/2008 | CA2683073A1 Resin composition, and prepreg |
| 11/05/2008 | EP1988130A2 Two-part waterborne epoxy coating composition and method |
| 11/05/2008 | EP1988112A1 Process for producing low-molecular polyphenylene ether |
| 11/05/2008 | EP1306369B1 Novel sulfur compounds and intermolecular compounds containing the same as the component compound |
| 11/05/2008 | CN101300284A Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board |