| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/26/2009 | WO2009025190A1 Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same |
| 02/26/2009 | US20090054603 Low-cure powder coatings and methods for using the same |
| 02/26/2009 | US20090054587 Epoxy resin, epoxy resin composition, and prepreg and laminated plate using the epoxy resin composition |
| 02/26/2009 | US20090053431 Waterfast dye fixative compositions for ink jet recording sheets |
| 02/26/2009 | US20090051053 Epoxy resin composition and semiconductor apparatus |
| 02/25/2009 | EP2028244A1 Water-borne paints based on epoxy resins |
| 02/25/2009 | EP2028207A1 Resin composition for composite material parts |
| 02/25/2009 | EP2027176A1 Resin dispersion |
| 02/25/2009 | EP2027175A1 Powder coating composition for pipe coating |
| 02/25/2009 | EP1835333B1 Liquid crystal sealing material and liquid crystal display cells made by using the same |
| 02/25/2009 | EP1123944B1 Partial condensate of glycidyl ether group-containing alkoxysilane, silane-modified resin, compositions thereof, and preparation methods thereof |
| 02/25/2009 | CN101375211A Photosensitive resin composition |
| 02/25/2009 | CN101374880A Epoxy formulations for use in lithography techniques |
| 02/25/2009 | CN101374879A Curable composition |
| 02/25/2009 | CN100464398C Underfill and mold compounds including siloxane-based aromatic diamines |
| 02/25/2009 | CN100463905C Method for producing maleic anhydride of hydriding terpene |
| 02/24/2009 | US7495060 Improved subliming and decomposing properties; thermal stability; prolonged pot-life; polymerization catalysts |
| 02/24/2009 | US7494716 Epoxy resin modified with phosphate, phosphonate compound |
| 02/24/2009 | CA2313326C Curable resin compositions |
| 02/19/2009 | WO2009023690A1 Electrodeposition coatings for use over aluminum substrates |
| 02/19/2009 | US20090048422 Resin composition for composite material parts |
| 02/19/2009 | US20090048420 Process for the preparation of polyols |
| 02/19/2009 | CA2696158A1 Electrodeposition coatings for use over aluminum substrates |
| 02/18/2009 | EP2025696A1 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 02/18/2009 | EP2025695A1 Epoxy resin composition and cured epoxy resin |
| 02/18/2009 | EP1478678B8 Prepolymers for native epoxide resins and method for producing said prepolymers |
| 02/18/2009 | CN101370847A Thermosetting resin composition |
| 02/18/2009 | CN101370846A Curing agents for epoxy-functional compounds |
| 02/18/2009 | CN101370845A Aromatic ether polymer, method for producing same and polymer composition |
| 02/18/2009 | CN101370837A Active energy ray-curable resin composition and use thereof |
| 02/18/2009 | CN101370797A Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
| 02/18/2009 | CN101369098A Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 02/18/2009 | CN101367910A Solidifying agent of epoxy resin for reinforcing and sealing, and method of preparing the same |
| 02/18/2009 | CN101367909A Synthesis process for bisphenol acid type epoxy resin with medium molecular mass |
| 02/18/2009 | CN101367908A Preparation method for hydrogenated bisphenol A epoxy resin |
| 02/18/2009 | CN100463115C Adhesive bonding sheet, semiconductor device using same, and method for manufacturing the semiconductor device |
| 02/18/2009 | CN100462401C Epoxy resin molding material for sealing and semiconductor device |
| 02/18/2009 | CN100462385C Ultraviolet-curing composition |
| 02/18/2009 | CN100462384C Preparation method of vacuum pressurized impregnating epoxy resin |
| 02/18/2009 | CN100462383C Synthesizing process of epoxy resin containing adamantane structure on molecular main chain |
| 02/17/2009 | US7491789 Molding materials, adhesives, adhesive films or anisotropic conductive films; high adhesion in liquid crystal displays, in semiconductor mounting materials, and to gold surfaces; improved crack and peel resistances; bis-(substituted-hydroxyphenylalkylthioalkyl)disulfides |
| 02/17/2009 | US7491774 reacting a phenol compound and epihalohydrin, then purifying and pulverizing to obtain particles exhibiting excellent fluidity during molding because of its low melt viscosity and allows easy handling because it hardly causes blocking during storage and transportation and also relates to a package |
| 02/17/2009 | US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin |
| 02/12/2009 | WO2009020089A1 Aromatic sulfonium salt compound |
| 02/12/2009 | WO2009019979A1 Photocurable composition |
| 02/12/2009 | WO2009019906A1 Latent hardener |
| 02/12/2009 | WO2009019296A1 High solids epoxy coating composition |
| 02/12/2009 | WO2009002502A3 Heated water spray processor |
| 02/12/2009 | CA2695816A1 High solids epoxy coating composition |
| 02/11/2009 | EP2021394A1 Low shrinkage epoxy-cationic curable compositions |
| 02/11/2009 | CN101362848A Filler resin composition for adjusting high backing plate by filling and preparation method |
| 02/11/2009 | CN101362819A Triazines cross-linking compounds, preparation method and application thereof |
| 02/11/2009 | CN100460439C Epoxide polymerization catalyst preparation method |
| 02/10/2009 | US7488785 A curable liquid blends comprising amines, latent curing agent which does not react until temperatures above 70 degrees C., a photopolymerizable compound and a photoinitiator; use as impregnating resins, forming fibre-reinforced composite materials |
| 02/10/2009 | US7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 02/10/2009 | CA2182633C Ultra-low viscosity epoxy sealer/healer |
| 02/05/2009 | WO2009017690A2 Curable epoxy resin-based adhesive compositions |
| 02/05/2009 | WO2009017253A1 Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device |
| 02/05/2009 | WO2009017252A1 Liquid crystal aligning agent, liquid crystal alignment film, method for producing the same, and liquid crystal display device |
| 02/05/2009 | WO2009017064A1 Alkali-developable photosensitive resin composition and β-diketone compound |
| 02/05/2009 | WO2009016162A1 Water-borne paints based on epoxy resins |
| 02/05/2009 | US20090035688 Toner, and toner production process |
| 02/05/2009 | US20090035567 Tacky-Adhesive and Tacky-Adhesive Sheet |
| 02/05/2009 | CA2694096A1 Water-borne paints based on epoxy resins |
| 02/04/2009 | EP2020656A1 Optical disk and ultraviolet-curable composition for optical disk |
| 02/04/2009 | EP2019975A1 Radiation curable resin composition and rapid three dimensional imaging process using the same |
| 02/04/2009 | EP1603962B1 Improvements in or relating to thermosetting resin compositions |
| 02/04/2009 | CN101357996A Multi-microporous epoxy thermosetting resin, preparation method and application thereof |
| 02/04/2009 | CN100457823C Epoxy resin composition, condensate thereof |
| 02/04/2009 | CN100457809C Thermo setting resin composition and its setting coating film |
| 02/04/2009 | CN100457672C Insulation product, such as a thermal insulation product, and production method thereof |
| 02/03/2009 | US7485362 Nanoporous laminates |
| 02/03/2009 | US7485242 Reactive fine particles |
| 02/03/2009 | CA2344718C High strength epoxy adhesive and uses thereof |
| 01/29/2009 | WO2009014852A2 Process for epoxidizing crude polyenes |
| 01/29/2009 | WO2009014840A1 Modified epoxy resins comprising the reaction product of rosin and a linking molecule and aqueous dispersons and coatings comprising such resins |
| 01/29/2009 | WO2009014270A1 Resin composition |
| 01/29/2009 | WO2009014133A1 Composition for holographic recording medium |
| 01/29/2009 | WO2009013955A1 Epoxy resin composition |
| 01/29/2009 | WO2008150568A3 Hybrid coatings prepared from glycidyl carbamate resins |
| 01/29/2009 | US20090030158 Resin composition |
| 01/29/2009 | US20090030103 Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate |
| 01/29/2009 | US20090029058 Water-dilutable polymer comprising the reaction product of a polyether,diisocyanate, anhydride, and epoxy resin; amine-curable dispersion includingan bisphenol-epichlorohydrin resin; adhesives; coatings; seals; fillets;concrete; metals; corrosion resistance; protective coatings |
| 01/28/2009 | EP1783154B1 Cationically polymerizable composition, active energy ray-curable inkjet ink, and method for producing cationically polymerizable composition |
| 01/28/2009 | CN101356219A Flame retardant compositions with a phosphorated compound |
| 01/28/2009 | CN101353555A Flame-retardant rosin epoxide resin and preparation thereof |
| 01/28/2009 | CN101353415A Rosin epoxide resin and preparation thereof |
| 01/28/2009 | CN101353331A Fluorine-containing epoxide resin reactive diluent and preparation thereof |
| 01/27/2009 | US7482396 Pre-crosslinking a COMPOUNDING EPOXIDATION PRODUCT OF CARBOXYLIC ACID ESTER USING CROSSLINKING AGENT; MOLDING, CURING; FREE RADICAL POLYMERIZATION; storage stability; plates is non-tacky, flexible, high bend restoring force; Linoleum floor coverings |
| 01/22/2009 | WO2009011335A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 01/22/2009 | WO2009011304A1 Heat curable resin compositon |
| 01/22/2009 | WO2009011257A1 Shrink label with hologram layer and labeled vessel |
| 01/22/2009 | US20090023840 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 01/22/2009 | US20090020904 Silicone-free cutting oil and use thereof |
| 01/22/2009 | US20090020040 Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile |
| 01/21/2009 | EP2017296A1 Epoxy resin composition for fiber-reinforced composite material |
| 01/21/2009 | EP2017295A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device |
| 01/21/2009 | EP1546227A4 Polyether polyamine agents and mixtures therefor |
| 01/21/2009 | EP0888565B1 Reflective polariser, liquid crystal display device comprising it and material composition therefor |
| 01/21/2009 | CN101349675A Apparatus and method for monitoring epoxy resin base gel preparation course by ultrasonic wave |