Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
04/2009
04/09/2009CA2700415A1 Hollow-fiber element for organic-vapor separation
04/08/2009EP2044137A1 Composition that can be polymerized and/or crosslinked when irradiated by cationic and/or radical route
04/08/2009EP2043865A1 Ink jet cartridge comprising a layer made by a curable resin composition
04/08/2009CN101405342A Epoxy resin composition, fiber-reinforced composite material and method for producing the same
04/08/2009CN101405321A Hot curable epoxy-amine anti-seepage fluid sealant
04/08/2009CN101402720A Process for producing cold curing watersoluble solidifying agent of epoxy resin
04/08/2009CN100475803C Heterocycle-bearing onium salts
04/07/2009US7514507 Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin
04/07/2009CA2304305C Thermally stable polyetheramines
04/02/2009WO2009041711A1 Curable resin composition for molded bodies, molded body, and production method thereof
04/02/2009WO2009041708A1 Liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display device
04/02/2009WO2009041681A1 Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer
04/02/2009WO2009041472A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
04/02/2009WO2009041389A1 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
04/02/2009WO2009041333A1 Curable liquid epoxy resin composition and cured product thereof
04/02/2009WO2009041137A1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
04/02/2009US20090088523 Room Temperature Curable Silicon Group-Containing Polymer Composition
04/01/2009EP2043168A2 Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
04/01/2009EP2042536A1 Hydroxyl polyester resins for dye ink sublimation
04/01/2009EP1324135B1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition
04/01/2009CN101400719A Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those
04/01/2009CN101400716A Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
04/01/2009CN101400715A Liquid epoxy resin composition and adhesive using same
04/01/2009CN101400706A Photocurable/thermosetting resin composition, cured product and printed wiring board
04/01/2009CN101397402A Thermosetting resin composite and cured resin
04/01/2009CN101397364A Method for preparing air drying epoxy vinyl ester resin
04/01/2009CN101397363A Water ultraviolet light curing epoxy acrylic ester grafted polyurethane and preparation method thereof
04/01/2009CN100474109C Cation photopolymerization evocator and composition with cation photopolymerization
04/01/2009CN100473690C Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods
03/2009
03/31/2009US7511113 Oligomeric hydroxy arylether phthalonitiles and synthesis thereof
03/26/2009WO2009038166A1 Epoxy resin composition
03/26/2009WO2009038097A1 Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof
03/26/2009WO2009037862A1 Inclusion complex containing epoxy resin composition for semiconductor encapsulation
03/26/2009WO2009037820A1 Curable resin composition and cured product
03/26/2009WO2009036921A1 Hydroxyl polyester resins for dye ink sublimation
03/26/2009WO2008064115A8 Epoxy resins comprising a cycloaliphatic diamine curing agent
03/25/2009EP2039692A1 Alicyclic diepoxy compound, epoxy resin composition, and cured product
03/25/2009EP2038104A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation
03/25/2009EP1902105B1 Powder paint composition
03/25/2009EP1572776B1 Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds
03/25/2009CN101395223A Thermosetting resin composition and uses thereof
03/25/2009CN101392089A Surface improver for reinforced composite compositions
03/24/2009US7507785 Hyperbranched homo- or copolyglycidol with at least one co-initiating tertiary amine functional group as an end group; polydispersity Mw/Mn smaller than 3; radiation curable varnishes, lacquers and ink jet inks
03/24/2009US7507778 Epoxy composition containing two curing agents having different reactivities; exhibits high storage stability and is useful as protective coating or adhesive.
03/19/2009WO2009035860A1 Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
03/19/2009US20090076200 Letter with continuation application
03/19/2009US20090076180 Epoxy resin composition using latent curing agent and curable by photo and heat in combination
03/19/2009US20090074374 Curable Composition for Optical Material and Optical Waveguide
03/19/2009CA2696785A1 Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
03/18/2009EP2036935A1 Light hardening thermoplastic epoxy resin adhesive
03/18/2009EP2036911A1 Process for production of aminated phosphoric acid ester compound, flame-retardant resin, and flame-retardant resin composition
03/18/2009CN101389907A Air humidifier and evaporation mat contained therein
03/18/2009CN101389691A Process for producing low-molecular polyphenylene ether
03/18/2009CN101389684A Curable epoxy resin composition
03/18/2009CN101389683A Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material
03/18/2009CN101389682A Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same
03/18/2009CN101386673A Oil modified epoxy resins and precoating coiled material coatings containing above resins
03/18/2009CN100469812C Preparing method for epoxy resin active diluent of low organic chlorine content
03/18/2009CN100469811C Method for producing epoxy using bisphenol A and epoxychloropropane
03/17/2009US7504471 Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive
03/17/2009US7504438 Demulsifiers, their preparation and use in oil bearing formations
03/17/2009CA2363267C Aqueous coating compositions with phosphonic acid based compounds
03/12/2009WO2009031536A1 Insulating sheet and multilayer structure
03/12/2009WO2009031146A1 High refractive index, low viscosity room temperature two-part epoxy resins
03/12/2009WO2008150568A9 Hybrid coatings prepared from glycidyl carbamate resins
03/12/2009US20090069527 Air drying polymer
03/12/2009US20090069513 Epoxy resin, method for producing same and use thereof
03/12/2009US20090069490 semiconductor encapsulation materials; fireproofing; dielectrics
03/11/2009EP2033982A1 Resin composition for stereolithography
03/11/2009EP1896519A4 Resin compositions with high thermoplastic loading
03/11/2009EP1566395B1 Flame-retardant epoxy resin composition and cured object obtained therefrom
03/11/2009CN101384959A Radiation curable resin composition and rapid three dimensional imaging process using the same
03/11/2009CN101384642A Process for producing phenolic resin and process for producing epoxy resin
03/11/2009CN101384638A Epoxy resin composition for sealing of semiconductor and semiconductor device
03/11/2009CN101384574A Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition
03/11/2009CN100467512C Technique for synthesizing resin of epoxy vinyl ester with low exothermal peak
03/10/2009US7501461 Composition of epoxy resin, aliphatic amine curing agent and halogenated amine
03/10/2009US7501087 Injection molding thermosetting resin composition into reinforcing fiber substrate
03/05/2009WO2009028493A1 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
03/05/2009WO2009028479A1 Reactive carboxylate compound, curable resin composition using the same, and use of the same
03/05/2009WO2009028271A1 Photocurable and thermosetting composition, cured product thereof, and curing method
03/05/2009WO2009028224A1 Microencapsulated latent hardener
03/05/2009WO2009028170A1 Thermosetting resin composition and cured product thereof
03/05/2009US20090062430 Epoxy Resin Composition for Sealing and Electronic Component Device
03/04/2009EP2031666A2 Process for producing optical semiconductor device
03/04/2009EP2031006A1 Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can§
03/04/2009EP2029656A1 Coating system
03/04/2009EP2029655A1 Coating system
03/04/2009EP2029654A2 Oligomeric halogenated chain extenders for preparing epoxy resins
03/04/2009EP2029653A1 Novel epoxy compounds and process for their production
03/04/2009CN101379118A Epoxy resin curable composition for prepreg
03/04/2009CN101379109A Paint composition, in particular anti-corrosive paint for rare earth permanent magnets
03/04/2009CN101379108A Microcapsule based harderner for epoxy resin, masterbatch-based hardenercomposition for epoxy resin, one-part epoxy resin composition, and processed good
03/04/2009CN101379107A Resin composition for semiconductor encapsulation and semiconductor device
03/04/2009CN100465212C An active energy ray-curable organopolysiloxane resin composition, an optical transmission component and a manufacturing method thereof
03/04/2009CN100465206C A preparation method of glycidic amine type polyfunctional epoxy resin
03/04/2009CN100465194C Polyacrylic hydrazide and a crosslinking or curing agent for resin
03/03/2009US7498389 Curable; for fixing fibres, scrims, fabrics or composites, for reinforcing buildings, for example walls or ceilings or floors; or for fixing building components, such as panels or blocks made of stone, glass or plastics; after curing, large tolerance range for temperatures; high bond stress value
03/03/2009US7498085 Encapsulating light emitting semiconductor
02/2009
02/26/2009WO2009026261A2 Isoselective polymerization of epoxides
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