| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 05/27/2009 | EP1447843B1 Adhesive-backed tape for TAB and semiconductor device |
| 05/27/2009 | EP1359172B1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/27/2009 | CN100491437C Epoxide adducts and their salts as dispersants |
| 05/27/2009 | CN100491436C Curing agent for epoxy resins and epoxy resin compositions |
| 05/27/2009 | CN100491435C Method of preparing hydrogenated terpinene maleic anhydride glycidyl ester type epoxy resin |
| 05/26/2009 | US7538166 Such as 1-(3-methyl-4-oxiranylmethoxyphenyl)-4-(4-oxiranylmethoxyphenyl)-1-cyclohexene; monomer synthesis; polymers cured with such as 4,4'-diaminodiphenylmethane; prepregs; low melting point raw materials exhibiting liquid crystallinity |
| 05/26/2009 | US7538150 Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
| 05/26/2009 | US7538104 Photoactivable nitrogen bases |
| 05/26/2009 | US7537452 e.g. diaryliodonium hexafluorophosphate an iodonium salt, an alpha-diketone visible light sensitizer ( camphoroquinon), alkoxy substituted anthracene electron donor; photopolymerizable epoxy resins for dental prosthetics and restoratives with improved cure speeds and depths and discoloration inhibition |
| 05/26/2009 | CA2365480C Epoxy resin compositions having a long shelf life |
| 05/26/2009 | CA2356241C Self-dispersible hardenable epoxide resins |
| 05/22/2009 | WO2009064707A1 Process for preparing advanced epoxi resins |
| 05/22/2009 | WO2009063787A1 Liquid crystal sealing agent and liquid crystal display cell using the same |
| 05/22/2009 | WO2009063743A1 Ultraviolet-curable composition for optical disk and optical disk |
| 05/22/2009 | WO2009063043A1 Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
| 05/22/2009 | WO2008127744A3 Film-forming material containing phosphorous and methods of producing coating compositions containing phosphorous |
| 05/21/2009 | US20090131631 Involves reacting renewable polyhydroxyl compound such as glycerol and/or an ester thereof, with a chlorinating agent and an organic acid to give a mixture containing the chlorohydrin and esters of the chlorohydrin |
| 05/21/2009 | US20090131607 Epoxy Resin, Epoxy Resin Composition, Photosensitive Resin Composition and Cured Object Obtained Therefrom |
| 05/21/2009 | US20090131600 Surface improver for reinforced composite compositions |
| 05/21/2009 | US20090131547 Containing a bicyclohexyl-3,3'-diepoxide, a thermal cationic or photocationic polymerization initiator or an acid anhydride; and, optionally, an additional epoxy resin; high bending strength, high Tg, and low permittivity; casting composition for electrical insulation |
| 05/20/2009 | EP2061096A2 Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| 05/20/2009 | EP2060609A1 Multilayer decoration covering including a bi-component paint and a protective resin |
| 05/20/2009 | EP2060593A1 Application of a sealant coating for producing a steam barrier layer |
| 05/20/2009 | EP2060592A1 Non-aromatic ureae containing thermosetting epoxy resin composition for use as a catalyst |
| 05/20/2009 | EP1885764B1 Two-component epoxy adhesive composition |
| 05/20/2009 | CN101434687A Preparation method of room curing epoxy hardener |
| 05/19/2009 | US7534820 photocurable polyisobutene or polyoxypropylene glycol endcapped with epoxy group-containing silicon compound or copolymerized with polysiloxanes; excellent curability by irradiation of a light energy source within a short time, no need moisture and heating; adhesive, sealant; storage stability |
| 05/19/2009 | CA2285420C Ternary photoinitiator system for curing of epoxy resins |
| 05/14/2009 | WO2009061371A2 Copolymers of epoxy compounds and amino silanes |
| 05/14/2009 | WO2009061360A1 Personal care composition comprising a reaction product of epoxy compound and amino silane |
| 05/14/2009 | WO2009060987A1 Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition |
| 05/14/2009 | WO2009060908A1 Photocurable resin composition, cured product pattern, and printed wiring board |
| 05/14/2009 | WO2009060897A1 Epoxy resin, method for producing the same, epoxy resin composition and cured product |
| 05/14/2009 | WO2009060862A1 Epoxy group-containing organosiloxane compound, curable composition for transfer material, and fine pattern forming method using the composition |
| 05/14/2009 | WO2009060708A1 Novel resin composition, composite material containing the same and use of the composite material |
| 05/14/2009 | WO2009060576A1 Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same |
| 05/13/2009 | EP1806376B1 Heat-resistant composite material |
| 05/13/2009 | CN101433134A Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 05/13/2009 | CN101432331A Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de |
| 05/13/2009 | CN101432330A Resin composition, prepreg, laminate, and wiring board |
| 05/13/2009 | CN101432329A One-part UV and abrasion resistant pigmented surfacing film composition for prepregs |
| 05/13/2009 | CN101430506A Photo-curing resin composition, design of cured composition and printed circuit board |
| 05/13/2009 | CN101429273A Process for producing wind electricity grade of bisphenol F epoxy resin |
| 05/07/2009 | WO2009058352A1 One component thermoset latex composition |
| 05/07/2009 | WO2009057737A1 Active energy ray-curable composition and method for producing the same |
| 05/07/2009 | WO2009057600A1 Salt compound, cationic polymerization initiator and cationically polymerizable composition |
| 05/07/2009 | WO2009057458A1 Composition for forming resist underlayer film and method of forming resist pattern from the same |
| 05/07/2009 | DE102008050025A1 Object i.e. gecko feet pad, moving product for use by layer thermo-reversible dry adhesive, has thermo-reversible dry adhesive including shape memory polymer layer and dry adhesive layer underlying shape memory polymer layer |
| 05/06/2009 | EP2055728A1 Resin composition prepreg and laminate using the same |
| 05/06/2009 | EP2054460A2 A halogen-free phosphorous epoxy resin composition |
| 05/06/2009 | CN101427312A Ultraviolet-curable composition for optical disk and optical disk |
| 05/06/2009 | CN101426830A Epoxy resin composition for fiber-reinforced composite material |
| 05/06/2009 | CN101426827A Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same |
| 05/06/2009 | CN101423534A Phosphorus-containing trifunctional liquid alicyclic epoxy resins and preparation method thereof |
| 05/06/2009 | CN101423533A Phosphorus-containing bifunctional liquid alicyclic epoxy resins and preparation method thereof |
| 05/05/2009 | US7528200 Epoxy hardener systems based on aminobis(methylene-ethyleneurea) |
| 05/05/2009 | US7528189 Metal-acrylate curing agents |
| 05/05/2009 | US7528183 water based curing agent is formed by combining an active amine-hydrogen containing amine-functional dispersion with an active amine-hydrogen containing amine-functional curing agent in solution or emulsion form; primer, sealer, paint, filler, coating, covering, trowelling or self leveling composition |
| 04/30/2009 | WO2009055666A1 Epoxy resin composition containing isocyanurates for use in electrical laminates |
| 04/30/2009 | WO2009026261A3 Isoselective polymerization of epoxides |
| 04/30/2009 | WO2005097883A3 Method of producing a crosslinked coating in the manufacture of integrated circuits |
| 04/29/2009 | EP2051951A1 Marble chip, method for preparing the same and artificial marble using the same |
| 04/29/2009 | CN101421672A Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same |
| 04/29/2009 | CN101418070A Epoxy resin combination, composite material and preparation method thereof |
| 04/29/2009 | CN100482711C Epoxy resin or compound with phosphonate as molecular skeleton and synthesizing process thereof |
| 04/28/2009 | US7524918 Sulfur-containing composition for golf equipment and method of using same |
| 04/28/2009 | CA2309699C Water compatible curing agents for epoxy resins |
| 04/28/2009 | CA2219514C Epoxides from dicyclopentadiene - unsaturated oil copolymers |
| 04/23/2009 | WO2009051209A1 Resin composition |
| 04/23/2009 | WO2009051186A1 Polyester composition for production of thermally cured film |
| 04/23/2009 | WO2009050801A1 Monolith separation medium for chromatographic use and method of producing the same |
| 04/23/2009 | WO2008127923A3 Heat-resistant structural epoxy resins |
| 04/22/2009 | EP2049594A1 Method of preparing resin composition for artificial marble chip having high specific gravity and high index of refraction |
| 04/22/2009 | CN101415743A Process for the preparation of powder coatings on heat-sensitive substrates |
| 04/22/2009 | CN101413216A Cellulose fiber modifier |
| 04/22/2009 | CN100480352C Epoxy resin composition, solid device packed by the same and method |
| 04/22/2009 | CN100480297C Solidifying agent for aqueous epoxy resin, and preparation method thereof |
| 04/22/2009 | CN100480296C Preparation of flocculating agent containing fluorine cation |
| 04/21/2009 | US7521494 Epoxy resin, SMA copolymer and bis-maleimidetriazine resin |
| 04/21/2009 | US7521100 Sealant of an epoxy resin from a bisphenol S-type polyvalent aromatic group with a glycidyl group, a thermo-curing agent, and a filler; excellent coatability, bondability to a substrate, long service life, pot life, high adhesive strength |
| 04/16/2009 | WO2009048117A1 Epoxy compound composition |
| 04/16/2009 | WO2009047885A1 Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition |
| 04/16/2009 | WO2009017690A3 Curable epoxy resin-based adhesive compositions |
| 04/16/2009 | US20090099330 improved transparency, optical characteristics such as durable light resistance, heat-resistance, and mechanical properties |
| 04/16/2009 | US20090094758 Polyamine from epichlorohydrin and two of benzylamine, piperazine, methylbis(3-aminopropyl)amine, methylbis(2-aminoethyl)amine, N-(2-aminoethylpiperazine), 4,7-dimethyltriethylenetetraamine, and ylaminopropylamine; controlled adsorption in leather; colorfastness |
| 04/16/2009 | DE112007001047T5 Harzzusammensetzung, Prepreg, Laminat und Leiterplatte Resin composition, prepreg laminate and PCB |
| 04/15/2009 | EP2048175A1 Insulating polymer material composition |
| 04/15/2009 | EP2048173A1 Insulating polymer material composition |
| 04/15/2009 | EP2046859A1 Sheet molding compounds (smc), thick molding compounds (tmc), and bulk molding compounds (bmc) comprising thermosetting resins based on renewable resources |
| 04/15/2009 | EP1928396A4 Epoxy based oil free root canal sealer |
| 04/15/2009 | EP1722376A4 Electroactive polymer and material based thereon |
| 04/15/2009 | CN101410433A Radiation or heat solidifiable anti-seepage sealant |
| 04/15/2009 | CN101410432A Curable composition for optical material and optical waveguide |
| 04/15/2009 | CN100479105C Adhesive sheet semiconductor device manufacturing method using the adhesive sheet |
| 04/15/2009 | CN100478378C Hardenable cyanate compositions |
| 04/14/2009 | CA2458342C Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same |
| 04/09/2009 | WO2009045817A1 Epoxy resin formulations |
| 04/09/2009 | WO2009044711A1 Hollow-fiber element for organic-vapor separation |
| 04/09/2009 | US20090093599 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| 04/09/2009 | US20090093562 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |