| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/16/2009 | WO2009088087A1 Epoxidation catalyst, process for production of epoxidation catalyst, process for production of epoxy compounds, curable resin compositions, and products of curing of the compositions |
| 07/16/2009 | WO2009088059A1 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 07/16/2009 | WO2009087717A1 Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition |
| 07/16/2009 | US20090181165 Curable adhesive compositions, Process, and applications |
| 07/15/2009 | EP1805150A4 Heterocyclical chromophore architectures |
| 07/15/2009 | EP1448663B1 Process for the alkoxylation of organic compounds |
| 07/15/2009 | CN100514613C Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 07/15/2009 | CN100513453C Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
| 07/14/2009 | US7560518 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
| 07/14/2009 | US7560219 Arylsulfonium salts of 1-halothioxanthones and 2-decyl-1-tetradecyl bromide as an intermediate for their preparation; UV curable adhesives, sealants, coating compositions, such as printing inks and varnishes, and encapsulants |
| 07/14/2009 | US7560143 paints; radiation curable binders; low temperature; adducts of polyethylene glycol-modified epoxy resins and epoxy resins with olefinically unsaturated acid |
| 07/14/2009 | CA2487705C Low-cure powder coatings and methods for using the same |
| 07/14/2009 | CA2217834C Curable resin compositions |
| 07/09/2009 | WO2009084718A1 Curable composition |
| 07/09/2009 | WO2009084229A1 Latent curing agents, epoxy resin compositions conating the same, sealing materials, and organic el displays |
| 07/09/2009 | WO2009084096A1 Liquid epoxy resin composition for chip-on film and semiconductor device |
| 07/09/2009 | US20090176944 Aldimines Comprising Reactive Groups Containing Active Hydrogen, and Use Thereof |
| 07/09/2009 | US20090176932 Halogen containing epoxy compositions and their preparation |
| 07/09/2009 | US20090176931 Water based curing agent formed by combining an active amine-hydrogen containing amine-functional dispersion with an active amine-hydrogen containing amine-functional curing agent in solution or emulsion form; primer, sealer, paint, filler, coating, covering, trowelling or self leveling composition |
| 07/09/2009 | US20090176903 Foamable compositions based on epoxy resins and polyesters |
| 07/08/2009 | EP2077288A1 Transparent composite sheet |
| 07/08/2009 | CN101479311A Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |
| 07/08/2009 | CN101479310A Amine imide compound to be activated by irradiation of active energy ray, composition using the same, and method for curing the same |
| 07/08/2009 | CN101475682A Preparation of silicon-containing hyperbranched epoxy resin |
| 07/08/2009 | CN100511489C Composition for polymer solid electrolyte, polymer solid electrolyte, polymer, polymer solid electrolyte battery and copolymer thereof |
| 07/08/2009 | CN100509951C Thermoset resin composition and multi-layer printed circuit board using the resin composition |
| 07/08/2009 | CN100509908C Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/08/2009 | CN100509907C Process for synthesizing low-styrene-content high-temperature-resistance epoxy vinyl ester resin |
| 07/08/2009 | CN100509675C Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns |
| 07/07/2009 | US7556002 Adhesively bonded engine and transmission parts |
| 07/02/2009 | WO2009081874A1 Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device |
| 07/02/2009 | WO2009081610A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 07/02/2009 | WO2009081601A1 Thermosetting resin composition and prepreg and laminate both made with the same |
| 07/02/2009 | WO2009080209A1 Phenalkamine and salted amine blends as curing agents for epoxy resins |
| 07/01/2009 | CN101472970A Powder coating composition for pipe coating |
| 07/01/2009 | CN100506929C Aqueous self-bonding coating for electrical steel |
| 07/01/2009 | CN100506877C Curable resin composition, overcoats, and process for formation thereof |
| 07/01/2009 | CN100506810C Epoxy compound and epoxy resin cured product obtained by curing the epoxy compound |
| 07/01/2009 | CN100506570C Method of making models |
| 06/30/2009 | CA2468930C Methyl acrylate-diamine based polyamide resins and processes for producing the same |
| 06/30/2009 | CA2410036C Composition based on renewable raw materials |
| 06/25/2009 | WO2009079428A1 Vibration dampening compositions |
| 06/25/2009 | WO2009079082A1 Anion exchange polymers, methods for making and materials prepared therefrom |
| 06/25/2009 | WO2009078301A1 Photosemiconductor package sealing resin material |
| 06/25/2009 | WO2009077470A1 Method for producing hydroxy-functional polymers, the isocyanate-group-terminated polyaddition products which can be obtained therefrom, and the use thereof |
| 06/25/2009 | WO2009077420A2 Epoxy curing system and coatings obtained thereof |
| 06/25/2009 | WO2009014852A3 Process for epoxidizing crude polyenes |
| 06/25/2009 | US20090163676 Benzylated Polyalkylene Polyamines And Uses Thereof |
| 06/25/2009 | US20090163614 Coating compositions and curing method thereof |
| 06/25/2009 | CA2709168A1 Vibration dampening compositions |
| 06/24/2009 | CN101466757A Epoxy resin composition and epoxy resin cured product |
| 06/24/2009 | CN101466756A Thermosetting resin composition, method for forming antihalation film of solid-state imaging device, antihalation film of solid-state imaging device, and solid-state imaging device |
| 06/24/2009 | CN100503681C Curing silicone composition and cured product thereof |
| 06/24/2009 | CN100503680C Castor oil/epoxidized soybean oil based elastomeric compositions |
| 06/23/2009 | US7550550 aminated polyols from alkylene glycol adducts; increased working time; curing agents for epoxy resins; preparing polyureas from the diamines and diisocyanates; composite blades for wind-driven turbines |
| 06/18/2009 | WO2009075265A1 Composition for resist underlayer film formation and method for resist pattern formation |
| 06/18/2009 | WO2009075252A1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 06/18/2009 | WO2009075233A1 Alkali-developable curable composition, insulating thin film using the same, and thin film transistor |
| 06/18/2009 | WO2009074303A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 06/17/2009 | EP2070962A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 06/17/2009 | EP2069418A1 Low temperature, moisture curable coating compositions and related methods |
| 06/17/2009 | EP1979392B1 Non-aqueous, liquid coating compositions |
| 06/17/2009 | CN101460539A Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 06/17/2009 | CN101460538A Oligomeric halogenated chain extenders for preparing epoxy resins |
| 06/17/2009 | CN101460537A New epoxy compound and method for producing the same |
| 06/17/2009 | CN101456944A Refining method of high purity epoxy resins |
| 06/17/2009 | CN100500745C Epoxy-polysiloxane polymer composition |
| 06/16/2009 | US7547373 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 06/16/2009 | CA2391883C Method for the anodic electrophoretic enamelling and electrophoretic paints |
| 06/11/2009 | WO2009073393A1 Novel compositions comprising structural isomers of 1,4-cyclohexanedimethanol dibenzoate and polymer compositions containing same |
| 06/11/2009 | WO2009072632A1 Curable composition, coating composition for optical device, led sealing material, and method for producing the same |
| 06/10/2009 | EP2068319A1 Ultraviolet-curable composition for optical disk and optical disk |
| 06/10/2009 | EP2067810A1 Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent |
| 06/10/2009 | CN101451054A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN101451053A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN100497473C Molding compositions containing quaternary organophosphonium salts |
| 06/10/2009 | CN100497431C Single component solid oxirene resin |
| 06/09/2009 | US7544766 polymerizing tetrahydrofuran in the presence of at least one telogen (acetic anhydride) and/or comonomer and of an acidic heterogeneous catalyst based on activated sheet silicates or mixed metal oxides in a fluidized bed; high space-time yield with simple catalyst removal |
| 06/09/2009 | CA2245548C Compositions which undergo light-induced cationic curing and their use |
| 06/04/2009 | WO2009070488A1 Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
| 06/04/2009 | WO2009069562A1 Resin composition |
| 06/04/2009 | WO2009069465A1 Curable composition for transfer material and method for forming fine pattern using the composition |
| 06/04/2009 | WO2009069429A1 Silica-containing epoxy curing agent and epoxy resin cured body |
| 06/04/2009 | WO2006107552A3 Granular solid wax particle |
| 06/03/2009 | EP2065426A1 Thermally polymerizable resin composition |
| 06/03/2009 | EP2065419A1 Linear (meth)acryloyl-containing compound, star (meth)acryloyl-containing compound and process for producing them |
| 06/03/2009 | EP2064259A1 Catalytic low temperature polymerization |
| 06/03/2009 | CN101448868A Low shrinkage epoxy-cationic curable compositions |
| 06/03/2009 | CN101445587A Resin binding agent for a diamond wire saw and preparation method thereof |
| 06/02/2009 | US7541093 High molecular weight epoxy resin and low viscosity fatty amine oligomer curing agent; reduced drying time and solvent requirement; adhesion; concrete and metal protection; corrosion and impact resistance; flexibility, durability |
| 06/02/2009 | US7541075 Improved durability in high temperature and high humidity environments |
| 05/28/2009 | WO2009065914A1 Impact strength improving agent for epoxy resin compositions |
| 05/28/2009 | WO2009037323A3 Primer compositions for adhesive bonding systems and coatings |
| 05/28/2009 | WO2008048554A8 Improved epoxy compositions |
| 05/28/2009 | US20090137775 Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them |
| 05/28/2009 | US20090137774 Adamantane derivative, resin composition containing same, and optoelectronic component using same |
| 05/28/2009 | US20090136756 Nanodisk Comprising Block Copolymer |
| 05/28/2009 | US20090134358 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 05/27/2009 | EP2062957A1 Swelling inhibitors for clays and shales |
| 05/27/2009 | EP2062928A1 Impact modifier for epoxy resin composites |