| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/27/2009 | WO2009104312A1 Microencapsulated silane coupling agent |
| 08/27/2009 | WO2009103720A1 Coating on metal |
| 08/27/2009 | WO2009073821A3 Biopolymer-nucleic acid conjugation |
| 08/26/2009 | EP2092018A1 Low odor, fast cure, toughened epoxy adhesive |
| 08/26/2009 | EP2091998A2 Biodegradable polymeric derivatives |
| 08/26/2009 | EP1765907B1 Curable compositions with an improved adhesion performance |
| 08/26/2009 | CN101516993A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 08/26/2009 | CN101516961A Catalytic low temperature polymerization |
| 08/26/2009 | CN100533233C Liquid crystal sealing material and liquid crystal display cells made by the material |
| 08/26/2009 | CN100533184C Inkjet ink composition for color filter, process for producing color filter, and color filter |
| 08/26/2009 | CN100532418C Synthesis process of epoxy resin with anionic catalyst |
| 08/25/2009 | US7579392 Low-viscosity epoxy resin; a phenolic chain extender; catalyst that promotes self-curing reactions between epoxy groups; an inhibitor that inhibits the activity of the the activity of the catalyst under "B-staging" conditions |
| 08/25/2009 | US7579390 Inkjet ink composition and printed matters created using inkjet ink composition |
| 08/25/2009 | US7579386 Ink for printing on a game ball |
| 08/25/2009 | US7578891 Optics; radiation transparent |
| 08/21/2009 | CA2654773A1 Novel polyether alcohols bearing alkoxysilyl groups by alkoxylation of epoxy-functional alkoxysilanes over double metal cyanide (dmc) catalysts, and processes for preparation thereof |
| 08/20/2009 | WO2009101961A1 Curable resin composition and cured resin |
| 08/20/2009 | WO2009077420A3 Epoxy curing system and coatings obtained thereof |
| 08/20/2009 | WO2009074303A8 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 08/20/2009 | US20090207723 Optical disc and ultraviolet-curable composition for optical disc |
| 08/20/2009 | US20090205856 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
| 08/20/2009 | CA2715384A1 Curable resin composition and cured resin |
| 08/19/2009 | EP2090563A1 Adamantane derivative, method for producing the same, and resin composition containing adamantane derivative |
| 08/19/2009 | CN101511901A One-component epoxy resin composition and motor or electric generator utilizing the same |
| 08/19/2009 | CN101511900A Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board |
| 08/19/2009 | CN101511899A Straight-chain compound containing (methyl) acryloyl, star-shaped compound containing (methyl) acryloyl and method for manufacturing them |
| 08/19/2009 | CN101508764A High-performance pnenolic aldehyde amine hardener for epoxy resin and preparation thereof |
| 08/19/2009 | CN100528959C Production of micron-solid epoxy-resin microsphere containing surface active group |
| 08/19/2009 | CN100528949C Low heat release and low smoke reinforcing fiber/epoxy composites |
| 08/19/2009 | CN100528928C Method for preparing high-molecular L-lactic acid by employing low-molecular-weight epoxide resin chain extender |
| 08/19/2009 | CN100528927C Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 08/19/2009 | CN100528926C Enzymatic hydrolysis lignin epoxy resin material formula and its preparation method |
| 08/18/2009 | US7575653 Melt-flowable materials and method of sealing surfaces |
| 08/18/2009 | CA2440806C Composite pressure container or tubular body and composite intermediate |
| 08/13/2009 | WO2009099837A1 Dental bonding compositions and methods useful in inhibition of microleakage in resin-bonded dentin |
| 08/13/2009 | US20090202832 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 08/13/2009 | US20090202809 Fibre reinforced assembly |
| 08/13/2009 | US20090200071 Resin composition, prepreg, laminate, and wiring board |
| 08/12/2009 | EP1984106B1 Universal wetting agents and dispersants based on isocyanate monoadducts |
| 08/12/2009 | EP1795548B1 Curable diamantane compound |
| 08/12/2009 | EP1650248B1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 08/12/2009 | EP1636274B1 Photocurable resin composition |
| 08/12/2009 | CN100526360C Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 08/12/2009 | CN100526359C Resin-modified method epoxy resin and preparing method |
| 08/11/2009 | US7572877 Modified cyclic aliphatic polyamine |
| 08/11/2009 | US7572503 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 08/06/2009 | WO2009096598A1 A liquid crystal orientating agent, a liquid crystal orientating film and a liquid crystal display element |
| 08/06/2009 | WO2009096501A1 Silicon-containing particle, process for producing the same, organic-polymer composition, ceramic, and process for producing the same |
| 08/06/2009 | WO2009096340A1 Sulfur atom-containing composition for resist underlayer film formation and method for resist pattern formation |
| 08/06/2009 | WO2009096235A1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, method for producing phosphorus-containing epoxy resin, curable resin composition using the epoxy resin and the epoxy resin composition, and cured product |
| 08/06/2009 | US20090198040 Insulating polymer material composition |
| 08/06/2009 | US20090198035 Polyether polyamine agents and mixtures thereof |
| 08/05/2009 | EP2085416A1 Epoxy curing system and coatings obtained thereof |
| 08/05/2009 | EP2085415A1 Composite system, method for its manufacture and multi-layered non-woven fabric |
| 08/05/2009 | EP2084241A2 Toughened binder compositions for use in advance processes |
| 08/05/2009 | EP2084206A2 Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| 08/05/2009 | EP2084205A1 Composite materials with improved performance |
| 08/05/2009 | EP2084200A1 Derivatized solid epoxy resin and uses thereof |
| 08/05/2009 | CN201284298Y Ethoxylation apparatus |
| 08/05/2009 | CN101501560A Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels |
| 08/05/2009 | CN101497737A Preparation of aqueous epoxy resin |
| 08/05/2009 | CN100523046C Encapsulation epoxy resin material and electronic component |
| 08/05/2009 | CN100523045C Toughened polyoxymethylene-poly(lactic acid) compositions |
| 08/05/2009 | CN100522957C Sulfonium salt photinitiators and use thereof |
| 08/04/2009 | US7569654 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/04/2009 | US7569327 Curable polymer compound |
| 08/04/2009 | US7569260 Photosensitive composition and cured products thereof |
| 08/04/2009 | US7569163 Polythioether amine resins and compositions comprising same |
| 07/30/2009 | WO2009094295A1 Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
| 07/30/2009 | WO2009094235A1 Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions |
| 07/30/2009 | WO2009093467A1 Polymerizable epoxy composition, and sealing material composition comprising the same |
| 07/30/2009 | WO2009093364A1 Thermosetting epoxy resin composition |
| 07/30/2009 | WO2009061371A3 Copolymers of epoxy compounds and amino silanes |
| 07/30/2009 | US20090192265 Curable composition |
| 07/30/2009 | US20090188869 Multi-layered macromolecules and methods for their use |
| 07/29/2009 | EP2083031A1 Crystalline resin cured product, crystalline resin composite body and method for producing the same |
| 07/29/2009 | EP2083030A1 Water-borne epoxy resin systems |
| 07/29/2009 | EP2083019A1 Photocurable/thermosetting resin composition, cured product and printed wiring board |
| 07/29/2009 | EP1442090B1 High temperature epoxy adhesive films |
| 07/29/2009 | CN101495533A Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin |
| 07/29/2009 | CN101492528A Method for synthesis of alicyclic epoxy resin with catalysis of solid supported heteropoly acid catalyst |
| 07/29/2009 | CN101492527A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 07/29/2009 | CN100519619C 环氧树脂组合物及半导体装置 Epoxy resin composition and semiconductor device |
| 07/29/2009 | CN100519618C Multiple functionality epoxide resin and its preparation method |
| 07/29/2009 | CN100519617C Epoxy resin, method for producing same and epoxy resin composition therof |
| 07/28/2009 | US7566758 Epoxy resin composition |
| 07/28/2009 | US7566501 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 07/28/2009 | US7566377 a solid epoxy resin having a ring and ball method softening temperature of 40 C. or above; an acrylate monomer or an oligomer thereof; a thermoplastic acrylate copolymer; light-activated radical polymerization initiator; a latent epoxy curing agent; one drop fill; stable cell gap; bonding |
| 07/28/2009 | CA2413062C Low moisture absorption epoxy resin systems |
| 07/28/2009 | CA2333035C Adhesive and coating formulations for flexible packaging |
| 07/23/2009 | WO2009090997A1 Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article |
| 07/23/2009 | WO2009090867A1 Resist material and laminate |
| 07/23/2009 | WO2009090196A1 Water-borne epoxy resin systems |
| 07/23/2009 | US20090186955 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 07/23/2009 | US20090186224 Anti-fouling cationically crosslinkable varnish compositions and support substrates coated therewith |
| 07/23/2009 | US20090184431 Liquid epoxy resin composition and flip chip semiconductor device |
| 07/22/2009 | EP2079774A1 Inkjet printing |
| 07/22/2009 | CN101490124A Antivirus mask and filter material |
| 07/21/2009 | US7563850 Aromatic polymer with either carbonyl and/or sulfone groups and cationic group for conductivity and anhydrous or solvent |
| 07/16/2009 | WO2009089145A1 High tg epoxy systems for composite application |