| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/25/2009 | EP2121795A2 Film-forming material containing phosphorous and methods of producing coating compositions containing phosphorous |
| 11/25/2009 | CN101589086A Hydroxy ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 11/25/2009 | CN101585906A Curing agents for epoxy resins |
| 11/25/2009 | CN101585905A Organic silicon modified phenolic epoxy curing agent for copper-clad board of printed circuit and preparation method thereof |
| 11/24/2009 | US7623751 fluoroalkyl esters of mercaptoalkylcarboxylic acids; chain transfer agent for with (meth)acrylates; plastic optical fiber having a reduced transmission loss; e.g. 2,2,3,3-tetrafluoropropyl 3-mercaptopropionate |
| 11/24/2009 | US7622516 Composition of epoxy and anhydride components, antioxidant and phosphor material |
| 11/24/2009 | US7622515 Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica |
| 11/24/2009 | CA2462454C High temperature epoxy adhesive films |
| 11/24/2009 | CA2399084C Epoxy resin composition |
| 11/24/2009 | CA2390776C Water dilutable amine curing agents for aqueous two component epoxy resin systems |
| 11/19/2009 | WO2009140001A1 Epoxy toughening using linear co-polyesters |
| 11/19/2009 | WO2009138749A1 Improved moulding processes |
| 11/19/2009 | WO2009138411A1 Polyol formed from an epoxidized oil |
| 11/19/2009 | WO2009138304A1 Coating composition |
| 11/19/2009 | WO2009138301A1 Electronic packaging |
| 11/19/2009 | WO2009120685A3 Process for manufacturing liquid epoxy resins |
| 11/19/2009 | US20090286951 Low-corrosion epoxy resins and production methods therefor |
| 11/19/2009 | US20090286929 Phenolic Resin, Process for Production Thereof, Epoxy Resin, and Use Thereof |
| 11/18/2009 | EP2119744A1 Two-component hardening composition |
| 11/18/2009 | EP2119737A1 Electronic packaging |
| 11/18/2009 | EP2119731A1 Silica sol having reactive monomer dispersed therein, method for producing the silica sol, curing composition, and cured article produced from the curing composition |
| 11/18/2009 | EP2118165A1 Aqueous epoxy resin compositions |
| 11/18/2009 | EP1771491B1 Photosensitive compositions based on polycyclic polymers |
| 11/18/2009 | CN101583648A Latent curing agent |
| 11/18/2009 | CN101583647A Thermosetting resin composition |
| 11/18/2009 | CN101583646A Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| 11/18/2009 | CN101583645A Composition that can be polymerized and/or crosslinked when irradiated by cationic and/or radical route |
| 11/18/2009 | CN101583607A Epoxy resin compositions and method for the production thereof |
| 11/18/2009 | CN101580580A 热固化性组合物 Heat-curable composition |
| 11/18/2009 | CN100560633C Use of urea derivatives as accelerators for epoxy resins |
| 11/18/2009 | CN100560632C Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof |
| 11/18/2009 | CN100560631C Flame-retardant epoxy resin composition |
| 11/18/2009 | CN100560630C Low-viscosity bisphenol A epoxide resin production method |
| 11/18/2009 | CN100560629C Stable cationically crosslinkable/polymerizable dental composition with a high filler content |
| 11/17/2009 | US7619056 Glycidyl ethers of plantanhydrosugars as renewable monomers to replace bisphenol A in epoxy resins; diglycidyl ethers of isosorbide, isomannide, isoidide; amine curingagent, bis(3-aminopropyl) ethers of anhydrosugars; protective coatings for foodcans; chemical resistance; stability; xenoestrogenic |
| 11/17/2009 | US7618489 Pigments for color filters in flat displays are treated with an epoxy compound to form a thin, protective film providing excelllent dispersability and compatible with a resin binder; silicon-free; small particle size; excellent flluid flow; low viscosity;low thixotropic index; radiation transparent |
| 11/17/2009 | CA2358664C Partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions |
| 11/12/2009 | US20090281275 Curable resin compositions and interlayer dielectric films |
| 11/11/2009 | CN101578555A Photocurable resin composition, cured product pattern, and printed wiring board |
| 11/11/2009 | CN101578315A Epoxy resins comprising a cycloalphatic diamine curing agent |
| 11/10/2009 | US7615595 blends comprising epoxy resin modified with an acrylonitrile-butadiene rubber, an endcapped polyester; impact peel strength, corrosion resistance; high viscosity at low shear strains, the epoxy adhesive composition has a high wash-off resistance without being prehardened; for bonding parts of a vehicle |
| 11/10/2009 | US7615584 Method of preparation of a water based epoxy curing agent |
| 11/10/2009 | CA2484452C Surface improver for reinforced composite compositions |
| 11/05/2009 | WO2009133168A1 Activator for epoxy resin compositions |
| 11/05/2009 | WO2009132504A1 A method for preparing air-drying epoxy vinyl ester resin |
| 11/05/2009 | US20090275708 Thermosetting Epoxy Resin Composition |
| 11/04/2009 | EP2113525A1 Activator for epoxy resin composites |
| 11/04/2009 | EP2113524A1 Epoxy resin composition, prepreg, laminates and printed wiring boards |
| 11/03/2009 | US7612153 conjugate polymer drugs; endcapped polyethers; nontoxic, biocompatible, non-immunogenic, soluble in water and other solvents |
| 11/03/2009 | US7612127 Curable resin composition |
| 11/03/2009 | US7611817 Aromatic sulfonium salt compound, photo-acid generator comprising the same and photopolymerizable composition containing the same, resin composition for optical three-dimensional shaping, and method of optically forming three-dimensional shape |
| 10/29/2009 | WO2009131101A1 Conductive resin composition |
| 10/29/2009 | WO2009130993A1 Active light-curable inkjet ink composition |
| 10/28/2009 | EP2112147A1 Sulfonium salts as photoinitiators |
| 10/28/2009 | EP2112146A1 Sulfonium salt photoinitiators and their use |
| 10/28/2009 | EP1030894B2 Conductive organic coatings |
| 10/28/2009 | CN101565535A Heat resistant epoxide resin and preparation method thereof |
| 10/28/2009 | CN100554311C Process for the alkoxylation of organic compounds |
| 10/28/2009 | CN100554305C Encapsulant mixture having a polymer bound catalyst |
| 10/27/2009 | US7608676 pinene, turpentine, hydroxyalkyl acrylate, bisphenol A; environmentally friendly; raw materials from renewable and/or inexpensive sources |
| 10/27/2009 | US7608672 Infiltrant system for rapid prototyping process |
| 10/27/2009 | US7608487 B-stageable underfill encapsulant and method for its application |
| 10/22/2009 | WO2009129399A1 Silylimidazolium salt complexes |
| 10/22/2009 | WO2009129088A1 Epoxy-imidazole catalysts useful for powder coating applications |
| 10/22/2009 | WO2009129084A1 Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions |
| 10/22/2009 | WO2009127891A1 Thermosetting resin containing irradiated thermoplastic toughening agent |
| 10/22/2009 | WO2009127699A1 Polyurethane polymer based on an amphiphilic block copolymer and its use as impact modifier |
| 10/22/2009 | US20090264593 Curing agents for epoxy resins |
| 10/22/2009 | CA2720844A1 Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions |
| 10/21/2009 | EP2110851A1 Film for sealing and semiconductor device using the same |
| 10/21/2009 | EP2110397A1 Polyurethane polymer based on amphiphilic block copolymers and its use as impact resistance modifier |
| 10/21/2009 | EP1665375B1 Solvent-modified resin compositions and methods of use thereof |
| 10/21/2009 | CN101563326A Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| 10/21/2009 | CN101560380A Preparation method of depolymerized and dispersed viscosity reducer of heavy oil |
| 10/21/2009 | CN101560323A Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
| 10/21/2009 | CN101560287A Thermofixation plastic resin for accelerating thermofixation |
| 10/21/2009 | CN101560286A Epoxide polymer of shape memory |
| 10/21/2009 | CN101560226A Novel phosphorus series compound as well as preparation method and application thereof |
| 10/20/2009 | US7605195 Epoxy coating system |
| 10/20/2009 | US7604343 Actinic ray curable composition, actinic ray curable ink, image formation method employing it, and ink-jet recording apparatus |
| 10/20/2009 | US7604154 Thermosetting flux and solder paste |
| 10/15/2009 | WO2009126393A2 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same |
| 10/15/2009 | WO2009125845A1 Method for manufacturing flexible wiring board |
| 10/15/2009 | US20090258992 Thermosetting Resin Composition and Semiconductor Sealing Medium |
| 10/15/2009 | US20090258963 Liquid acrylic elastomer |
| 10/15/2009 | US20090258150 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 10/14/2009 | EP2108668A1 Curing agent for low temperature cure applications |
| 10/14/2009 | EP1996641B1 Use of a substituted guanidine compound as a hardener for epoxy resins |
| 10/14/2009 | CN101555319A Hybrid organic silicon-phosphorus type epoxy modifying agent used for copper clad laminate of printed circuit board, preparation method and application thereof |
| 10/14/2009 | CN101555313A Ethylene rhodanate/epoxide resin microballoon and preparation method thereof |
| 10/14/2009 | CN101555310A Curing agent for low temperature cure applications |
| 10/14/2009 | CN100549092C Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 10/14/2009 | CN100549090C Amine compositions |
| 10/14/2009 | CN100549074C Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 10/14/2009 | CN100549059C Epoxy resin composition |
| 10/13/2009 | US7601785 Sulphonated multiblock copolymer and electrolyte membrane using the same |
| 10/08/2009 | WO2009123969A2 Deoxybenzoin-derived anti-flammable polymers |
| 10/08/2009 | WO2009123285A1 Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device |
| 10/08/2009 | WO2009123279A1 Insulated wire, coil using the same, and motor |
| 10/08/2009 | WO2009123276A1 Epoxy compound having protecting group and curable resin composition containing the same |