| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/14/2010 | CN101778818A Aromatic sulfonium salt compound |
| 07/14/2010 | CN101775196A Preparation method of novel quinone amine curing agent and application to normal temperature epoxy curing system |
| 07/14/2010 | CN101775194A Carbon nano tube/epoxide resin composite material and preparation method thereof |
| 07/14/2010 | CN101775109A Epoxy modified silicon-contained waterborne acrylic resin and coating thereof |
| 07/13/2010 | US7754903 adamantyl diglycidyl ether or 1-adamantanol epichlorohydrin adduct curable to polyepoxides; encapsulant for light-emitting diode; superior optical properties, heat resistance, photostability, and shrinkage inhibition |
| 07/13/2010 | CA2601950C Latent hardener for epoxy resin and epoxy resin composition |
| 07/13/2010 | CA2445721C Moulding composition for producing bipolar plates |
| 07/08/2010 | WO2010077485A1 Divinylarene dioxide formulations for vacuum resin infusion molding |
| 07/08/2010 | WO2010077381A1 Coating compositions with branched phosphorous-containing resin |
| 07/08/2010 | WO2010054989A3 Anti-slip coating |
| 07/08/2010 | WO2008143247A8 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 07/08/2010 | US20100173163 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 07/08/2010 | CA2744063A1 Divinylarene dioxide formulations for vacuum resin infusion molding |
| 07/07/2010 | CN101772527A Epoxy resin composition |
| 07/07/2010 | CN101772526A Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device |
| 07/07/2010 | CN101768245A Naphthol resin, epoxy resin, epoxy resin composition, and solidified products thereof |
| 07/06/2010 | US7750107 An optionally halogenated bisphenol A or bisphenol F epoxy resin, a resorcinol epoxy resin or a tetrakis(hydroxyphenyl)ethane epoxy resin; dicyandiamide as a latent hardener for the epoxy resin, and assymetrical N,N-dimethylurea as an accelerator; powder coatings, electrical laminates, and adhesives |
| 07/06/2010 | US7750061 Ink for printing on a game ball |
| 07/06/2010 | CA2248242C Malononitrile-derivative anion salts, and their uses as ionic conducting materials |
| 07/01/2010 | WO2010075006A1 Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
| 07/01/2010 | WO2010074085A1 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device |
| 07/01/2010 | WO2010073559A1 Liquid resin composition and semiconductor device |
| 07/01/2010 | WO2009138411A9 Polyol formed from an epoxidized oil |
| 07/01/2010 | US20100168277 Curing agents for epoxy-functional compounds |
| 07/01/2010 | US20100168268 Epoxy Resin, Epoxy Resin Composition Containing the Epoxy Resin as an Essential Component and a Cured Product Containing the Epoxy Resin as an Essential Component |
| 07/01/2010 | US20100167088 Electrocoat compositions with amine ligand |
| 07/01/2010 | US20100164134 Method of making models |
| 07/01/2010 | CA2748175A1 Liquid resin composition and semiconductor device |
| 06/30/2010 | CN101765646A Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device |
| 06/30/2010 | CN101759857A Biomass-derived epoxy compound and manufacturing method thereof |
| 06/30/2010 | CN101260185B Low-temperature incubation type epoxide resin curing agent and preparing method thereof |
| 06/29/2010 | US7745549 Reacting an aromatic di- or triglycidyl ether with an aromatic diamine to form a composite having increased distortional deformation, and/or decreased dilatation load, in order to increase von Mises strain within the composition |
| 06/29/2010 | CA2608179C White prepreg, white laminates, and metal foil-cladded white laminates |
| 06/29/2010 | CA2571923C Viscous chemical anchoring adhesive |
| 06/24/2010 | WO2010071700A1 Method of separating solid salt from epoxy resin solutions |
| 06/24/2010 | WO2010071168A1 Carboxylic acid compound and epoxy resin composition containing same |
| 06/24/2010 | WO2010071165A1 Epoxy resin composition, prepreg, laminate board and multilayer board |
| 06/24/2010 | WO2010071107A1 Thermosetting modified polyamide resin composition |
| 06/24/2010 | WO2010069049A1 Epoxy resin compositions and curing agents for thermally insulating ultra-deep sea equipment used for oil and gas production |
| 06/24/2010 | US20100160555 Resin composition |
| 06/23/2010 | EP2199339A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
| 06/23/2010 | EP2199338A2 Polyetheralkanolamine dispersants |
| 06/23/2010 | EP2199313A1 Latent curing agents, epoxy resin compositions conating the same, sealing materials, and organic el displays |
| 06/23/2010 | CN1989145B Novel fluorinated alkylfluorophosphoric acid salt of onium and transition metal complex |
| 06/23/2010 | CN1926214B Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 06/23/2010 | CN101755008A Curable resin composition and cured product |
| 06/23/2010 | CN101754993A catalyst for curing epoxides |
| 06/23/2010 | CN101754989A Flame retardant composition |
| 06/23/2010 | CN101747594A Epoxy acrylate prepolymer resin and preparation method thereof and application in photocurable coating |
| 06/23/2010 | CN101747590A Photocurable resin composition for sealing organic el device |
| 06/23/2010 | CN101747492A Co-curing product of epoxy resin/bromostyrene-maleic anhydride and preparation method thereof |
| 06/23/2010 | CN101747491A Fast thickening vinyl ester resin as well as preparation method and application thereof |
| 06/23/2010 | CN101747490A Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board |
| 06/23/2010 | CN101747489A Special epoxy resin for UV-curable waterborne coatings and preparation method and application thereof |
| 06/23/2010 | CN101747303A Method for producing maleopimaric anhydride |
| 06/23/2010 | CN101747205A Curing agent for low temperature cure applications |
| 06/22/2010 | US7741413 A cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid; the ether and thiocarbonate and/or the amine and the carboxylic acid may be combined in one compound; low volume shrinkage upon curing; high precision applications; enhanced pot life; no foaming during curing |
| 06/22/2010 | US7741405 Elastomeric composition |
| 06/22/2010 | US7741388 A phenol-aldehyde glycidyl either resin, phenolic resin with biphenyl units, inorganic filler, a 3-mercapto-1,2-4-triazole, and curing accelerator; high flame resistance without any flame retardant; high solder reflow resistance; lead-free flowable solder |
| 06/17/2010 | WO2010068732A1 Process for the preparation of polyuretdione resins |
| 06/17/2010 | WO2010068219A1 Oil extended rubber compositions |
| 06/17/2010 | WO2010067691A1 Shaping method |
| 06/17/2010 | WO2010067546A1 Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device |
| 06/17/2010 | WO2010067538A1 Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device |
| 06/17/2010 | WO2010066660A1 Glycerol treatment process |
| 06/17/2010 | US20100151137 Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material |
| 06/17/2010 | US20100150510 Flexible optical waveguide, process for its production, and epoxy resin composition for flexible optical waveguides |
| 06/17/2010 | CA2743787A1 Glycerol treatment process |
| 06/17/2010 | CA2741583A1 Process for the preparation of polyuretdione resins |
| 06/16/2010 | EP2195364A1 Epoxy resin formulations |
| 06/16/2010 | EP2195305A2 Isoselective polymerization of epoxides |
| 06/16/2010 | CN1835946B Epoxy compound and cured epoxy resin product |
| 06/16/2010 | CN1795238B 环氧树脂组合物 The epoxy resin composition |
| 06/16/2010 | CN1690855B Liquid radiation-curable composition, and method for producing cured articles or 3-D shaped product by using the same |
| 06/16/2010 | CN101735617A Heat-curable resin composition |
| 06/16/2010 | CN101735571A Formula for layered water injection pipe and production technology thereof |
| 06/16/2010 | CN101735570A Epoxy resin system used for blades of wind driven generator and modification method thereof |
| 06/16/2010 | CN101735569A Preparation method of transparent inflaming retarding epoxy resin |
| 06/16/2010 | CN101735568A Epoxy resin component used for blades of wind driven generator |
| 06/16/2010 | CN101735566A Processable full sea-depth buoyancy material and manufacture method |
| 06/16/2010 | CN101735565A Self-healing and scratch resistant shape memory polymer system |
| 06/16/2010 | CN101735564A Vacuum infusion resin for wind turbine blades and preparation method thereof |
| 06/16/2010 | CN101735428A Preparation method of epoxy resin system used for blades of wind driven generator |
| 06/16/2010 | CN101735176A Synthesis method of four-functional group epoxy resin and prepared epoxy resin |
| 06/16/2010 | CN101073037B Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 06/16/2010 | CN101065415B Curable diamantane compound |
| 06/16/2010 | CN101056932B Polyetheralkanolamine dispersants |
| 06/16/2010 | CN101040221B Composition for forming bottom anti-reflective coating containing aromatic sulfonic acid ester compound and light photoacid-generating agent |
| 06/15/2010 | US7737226 Acetylene group-containing poly(alkylene oxide, oxyethylated polyol or olefinic alcohol) |
| 06/10/2010 | WO2010065323A1 Low temperature, moisture curable coating compositions and related methods |
| 06/10/2010 | WO2010065184A1 Low temperature, moisture curable coating compositions and related methods |
| 06/10/2010 | WO2010064648A1 Novel sulfonium borate complex |
| 06/10/2010 | WO2010019539A3 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 06/10/2010 | US20100145286 Layered non-fouling, antimicrobial antithrombogenic coatings |
| 06/10/2010 | US20100144965 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof |
| 06/10/2010 | US20100143720 Crosslinkable polyvinyl acetal porous powder, method for producing the same, and use of the same |
| 06/10/2010 | US20100143604 Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 06/09/2010 | EP2194098A1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
| 06/09/2010 | EP2194085A1 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode |
| 06/09/2010 | EP2193153A1 Isocyanate modified epoxy resin for fusion bonded epoxy foam applications |