| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 09/21/2010 | CA2433054C Solid polymethylmethacrylate surface material |
| 09/16/2010 | WO2010104191A1 Transparent film |
| 09/16/2010 | WO2010103809A1 Epoxy resin composition, curing agent, and curing accelerator |
| 09/16/2010 | WO2010103745A1 Semiconductor-sealing resin composition and semiconductor device |
| 09/16/2010 | US20100234518 Branched Polyglycols And Branched Polyether Functional Organopolysiloxanes And Coatings Containing Same |
| 09/16/2010 | US20100233387 Ink for making color filter and color filter made thereof |
| 09/15/2010 | CN1974546B Diphenol derivative containing aromatic schiff base and ether band structure and its preparation and application |
| 09/15/2010 | CN101831145A Aqueous epoxy resin and preparation method thereof |
| 09/15/2010 | CN101831143A High-performance liquid epoxy resin composition for packaging LEDs |
| 09/15/2010 | CN101831078A Preparation method of film forming agent and impregnating compound containing film forming agent |
| 09/15/2010 | CN101831053A Aqueous ultraviolet cured epoxy acrylic resin and preparation method thereof |
| 09/15/2010 | CN101831052A Production method of low-residue tetrabromobisphemol A brominated epoxy resin |
| 09/15/2010 | CN101831051A High-temperature-resistant epoxy resin containing naphthalene ring, dicyclopentadiene ring and imide structure and preparation method thereof |
| 09/15/2010 | CN101831050A Multiple modified resin and preparation method thereof |
| 09/15/2010 | CN101830929A Phosphorus-containing hydroquinone derivative, phosphorus-containing flame-retardant epoxy resin, preparation method and application thereof |
| 09/15/2010 | CN101066909B Crude product of glyceryl, its purification method and application in producing dichloropropanol |
| 09/14/2010 | US7795744 Cationically curable epoxy resin composition |
| 09/14/2010 | US7794919 Either a solvent solution of an epoxy group-containing addition polymer and a compound containing more than one carboxyl group and a molecular weight of less than 2000, or a phenolic poly with an OH, COOH or anhydride group(s) and a monomeric isocyanurate with more than one glycidyl group; dry etching |
| 09/14/2010 | US7794838 Formed by adding a poor solvent to a solvent solution of the block polymer; removing the good solvent from the solution to form fine particles having a lamellar structure; and immersing the fine particles in a solvent capable of resolving the van der Waals force between blocks adjacent to each other |
| 09/14/2010 | US7794623 Semiconductor die molded from a bis(epoxyalkyl) derivative of an aromatic initiator, e.g., 1,4-cyclohexylene bis(p-glycidyloxy)benzoate of or 4,4'-bis(4-(glycidyloxy)butoxyphenyl)stilbene; melting point of less than 140 degrees C.; are liquid crystalline at greater than 150 degrees C. |
| 09/10/2010 | WO2010101745A1 Thermosettable composition containing a glycidylether based on trimethyolpropane octadecaethoxilate |
| 09/10/2010 | WO2010101337A1 Hexafluoropropylene oxide polymer compositions and a preparing method of hexafluoropropylene oxide polymer using hexafluoropropylene oligomer |
| 09/10/2010 | WO2010101144A1 Epoxy resin composition |
| 09/10/2010 | WO2010100058A1 Cast resin system for isolators |
| 09/10/2010 | CA2754346A1 Casting resin system for insulators with increased heat distortion resistance |
| 09/09/2010 | US20100227984 HYDROLYSIS-RESISTANT POLY (p-PHENYLENEBENZOBISOXAZOLE) (PBO) FIBERS |
| 09/08/2010 | EP2226349A1 Thermosetting resin composition and prepreg and laminate both made with the same |
| 09/08/2010 | EP2226348A1 Epoxide-based composition |
| 09/08/2010 | EP2226347A1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 09/08/2010 | EP2226346A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 09/08/2010 | EP2225036A1 Anion exchange polymers, methods for making and materials prepared therefrom |
| 09/08/2010 | CN1783543B Porous film and its producing method, battery producing method and electrode/porous film assembly |
| 09/08/2010 | CN101827876A Resin composition |
| 09/08/2010 | CN101824206A Ultra-high-strength buoyancy material and preparation method thereof |
| 09/08/2010 | CN101824205A Integrated molding, fiber-reinforced composite material board and housing for electric/electronic device |
| 09/08/2010 | CN101824152A Preparation method and application of resin having double curing groups |
| 09/08/2010 | CN101824149A Multi-sulfhydryl compound and compounding method thereof |
| 09/08/2010 | CN101824138A Epoxide-based composition |
| 09/08/2010 | CN101824137A Modified bisphenol A epoxy acrylate and preparation method thereof |
| 09/08/2010 | CN101824136A Epoxy resin containing naphthalene ring and biphenyl structure and synthesis method thereof |
| 09/08/2010 | CN101824133A Preparation method for waterborne polyurethane modified epoxy resin curing agent |
| 09/08/2010 | CN101338018B Epoxy curing agent and method for preparing same |
| 09/07/2010 | US7790814 an epoxy resin; and an organoiodine-127 isotope crosslinking agent; iodo-phenyl functionalities; tri-iodophenol; tri-iodobenzoic acid; improved X-ray contrast; use of x-ray analysis to detect problematic voids in the underfill |
| 09/07/2010 | US7790785 for textiles covered with silicone elastomers; electrical insulators, plastic films, thermal transfer ribbons, protective packaging films; siloxane with two polymerizable/crosslinkable epoxy or oxetane groups; cationic initiator |
| 09/07/2010 | US7790354 dry film resist; flexible; insulating protective coating; electroless gold plating resistance; isocyanatoalkyl acrylate, unsaturated co-monomer, thermosetting epoxy, photopolymerization catalyst, polylactone |
| 09/07/2010 | US7790348 Decomposable resin composition and flexographic printing plate precursor using the same |
| 09/02/2010 | WO2010099295A1 Epoxy resin production |
| 09/02/2010 | WO2010099029A1 Epoxy compositions with improved mechanical performance |
| 09/02/2010 | WO2010098966A1 Curable epoxy resin compositions and cured products therefrom |
| 09/02/2010 | WO2010098431A1 Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article |
| 09/02/2010 | WO2010098312A1 Photosensitive resin composition |
| 09/02/2010 | WO2010098302A1 Novel epoxy compounds |
| 09/02/2010 | WO2010098285A1 Sealing agent for optical semiconductor devices and optical semiconductor device using same |
| 09/02/2010 | US20100222490 High solids epoxy coating composition |
| 09/02/2010 | US20100222461 Epoxy compositions with improved mechanical performance |
| 09/02/2010 | CA2750703A1 Curable epoxy resin compositions and cured products therefrom |
| 09/01/2010 | EP2223948A1 Salt compound, cationic polymerization initiator and cationically polymerizable composition |
| 09/01/2010 | EP2222748A2 Curing system and coatings obtained thereof |
| 09/01/2010 | EP2222747A1 Phenalkamine and salted amine blends as curing agents for epoxy resins |
| 09/01/2010 | CN101821677A Composition for forming resist underlayer film and method of forming resist pattern from the same |
| 09/01/2010 | CN101821333A Curable epoxy resin-based adhesive compositions |
| 09/01/2010 | CN101821312A Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition |
| 09/01/2010 | CN101819953A Transparent epoxy resin packaging adhesive |
| 09/01/2010 | CN101817970A Hydroxychloroethylene-vinyl acetate modified epoxy resin compound and preparation method thereof |
| 09/01/2010 | CN101817962A Polyvinyl chloride/epoxy resin blend and preparation method thereof |
| 09/01/2010 | CN101817930A Waterborne epoxy modified acrylic resin specific for tape measure and preparation method thereof |
| 09/01/2010 | CN101817924A Method for preparing novel polyaspartic ester and application thereof |
| 09/01/2010 | CN101475682B Preparation of silicon-containing hyperbranched epoxy resin |
| 09/01/2010 | CN101124275B Fire-retardant low-density epoxy composition |
| 09/01/2010 | CN101035830B Curing agents for epoxy resins |
| 09/01/2010 | CN101024680B Binaphthyl-radicle-contained di-phenol A-type resin and its preparing method |
| 08/31/2010 | US7786225 Curable resin composition |
| 08/31/2010 | US7786224 Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator |
| 08/31/2010 | US7786223 Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product |
| 08/31/2010 | US7786219 Initiated by a carboxycycle, such as cyclohexylidene-, cyclopentylidene- or p-phenylene-, diphenol and reacted with cyanogen chloride; prepregs and printed circuits made from the polyether, a different cyanate resin and an epoxy resin; low dielectric constant, high toughness |
| 08/31/2010 | US7786214 Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent |
| 08/26/2010 | WO2010095385A1 Sulfonium salt, photo-acid generator, and photosensitive resin composition |
| 08/26/2010 | WO2010094634A1 Cationically curable compositions and a primer therefor |
| 08/26/2010 | US20100217050 For pegylation of biodrugs such as proteins; end groups etherified with acetylenic group |
| 08/26/2010 | US20100212820 Reversible dry adhesives for wet and dry conditions |
| 08/25/2010 | EP2221860A2 Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods |
| 08/25/2010 | EP2220162A1 Vibration dampening compositions |
| 08/25/2010 | EP2220140A1 Impact strength improving agent for epoxy resin compositions |
| 08/25/2010 | CN101812218A Reactive water-dispersed epoxy resin emulsion and preparation method thereof |
| 08/25/2010 | CN101039984B Epoxy resin composition and semiconductor device |
| 08/24/2010 | US7781543 Containing a bicyclohexyl-3,3'-diepoxide, a thermal cationic or photocationic polymerization initiator or an acid anhydride; and, optionally, an additional epoxy resin; high bending strength, high Tg, and low permittivity; casting composition for electrical insulation |
| 08/24/2010 | US7781542 Cure accelerators |
| 08/24/2010 | US7781522 Aromatic-free polysiloxane containing at least 2 epoxy groups, 1,3-bis((3-m-hydroxyphenyl)propyl)-1,3-dimethyldisiloxane, and a curing accelerator; cured product has high flexibility and improved adhesive characteristics |
| 08/24/2010 | US7780778 Dispersion consisting of a coloring pigment having a primary average particle diameter of 200 nm or smaller, or carbon black having an average particle diameter of 100 nm or smaller, and a second barium sulfate pigment having a primary average particle diameter of 55 nm or smaller; pigment dispersant |
| 08/24/2010 | CA2462527C Aerosol can containing a two-component epoxy paint |
| 08/24/2010 | CA2431426C Flame-proofing agents |
| 08/19/2010 | WO2010093064A1 Fire-resistant phosphorus-containing epoxy resin composition and hardened substance obtained thereby |
| 08/19/2010 | WO2010092947A1 Long chain alkylene group-containing epoxy compound |
| 08/19/2010 | WO2010092630A1 Fast cure resin composition |
| 08/19/2010 | WO2010091922A1 Casting resin system for insulating materials in switch gears |
| 08/19/2010 | WO2010057922A4 Curable composition comprising a thermolatent base |
| 08/19/2010 | CA2751825A1 Casting resin system for insulating materials in switch gears |
| 08/18/2010 | EP2219188A1 Ultraviolet-curable composition for optical disk and optical disk |
| 08/18/2010 | EP2218724A1 Epoxy group-containing organosiloxane compound, curable composition for transfer material, and fine pattern forming method using the composition |
| 08/18/2010 | EP2217651A2 Curable compositions containing isocyanate-based tougheners |